Process and electrolyte for depositing lead and lead-containing layers
    41.
    发明授权
    Process and electrolyte for depositing lead and lead-containing layers 失效
    用于沉积铅和含铅层的工艺和电解质

    公开(公告)号:US5443714A

    公开(公告)日:1995-08-22

    申请号:US848952

    申请日:1992-05-29

    CPC分类号: C25D3/56 C25D3/36

    摘要: A process for acidic electrolytical deposition of lead layers and predominantly lead-containing layers onto surfaces using an electrolyte containing lead salts and acids, in particular alkanesulfonic acid, borofluoric acid or silicofluoric acid, with non-ionic surfactants and cationic or amphoteric surfactants being added to the electrolyte. The process can be operated at current densities of from 0.5 to 20 A/dm.sup.2 and at a pH value below 1.

    摘要翻译: PCT No.PCT / EP90 / 01670 Sec。 371日期:1992年5月29日 102(e)日期1992年5月29日PCT 1990年10月5日PCT PCT。 公开号WO91 / 05890 日期1991年3月2日。一种使用含有铅盐和酸,特别是烷基磺酸,硼氟酸或硅氟酸的电解质与非离子表面活性剂的酸性电解沉积铅层和主要含铅层到表面上的方法, 将阳离子或两性表面活性剂加入到电解质中。 该过程可以以0.5至20A / dm 2的电流密度和低于1的pH值操作。

    Tin lead electroplating solutions
    43.
    发明授权
    Tin lead electroplating solutions 失效
    锡铅电镀解决方案

    公开(公告)号:US4717460A

    公开(公告)日:1988-01-05

    申请号:US64167

    申请日:1987-06-18

    摘要: Baths and methods for electroplating tin or tin-lead alloys wherein the formation of tetravalent tin and stannic oxide sludge is reduced or prevented. These baths contain a soluble divalent tin compound, a soluble alkyl or alkylol sulfonic acid at least one wetting agent, and a hydroxyl phenyl compound reducing agent. Other compounds may be added to the bath for improving its performance during electroplating.

    摘要翻译: 用于电镀锡或锡铅合金的浴和方法,其中减少或防止四价锡和氧化锡污泥的形成。 这些浴含有可溶性二价锡化合物,可溶性烷基或烷基磺酸至少一种润湿剂和羟基苯基化合物还原剂。 可以向浴中加入其它化合物以改善其在电镀过程中的性能。

    Plating bath and method for electroplating tin and/or lead
    44.
    发明授权
    Plating bath and method for electroplating tin and/or lead 失效
    电镀锡和/或铅的电镀浴和方法

    公开(公告)号:US4582576A

    公开(公告)日:1986-04-15

    申请号:US716260

    申请日:1985-03-26

    摘要: An aqueous acidic plating bath for electrodeposition of tin, lead or tin-lead alloys on a substrate is described. The plating baths are free of fluoborate and comprise (a) at least one bath-soluble metal salt selected from the group consisting of a stannous salt, a lead salt, or a mixture of stannous and lead salts, (b) at least one alkane sulfonic acid or alkanolsulfonic acid, (c) at least one nonionic, cationic or amphoteric surfactant, (d) an effective amount of at least one primary brightening agent selected from the group consisting of aromatic aldehydes, acetophenones, and carbonyl compounds having the general formulaAr--C(H).dbd.C(H)--C(O)--CH.sub.3 (III)wherein Ar is a phenyl, naphthyl, pyridyl, thiophenyl or furyl group, and (e) an effective amount of a secondary brightening agent selected from the group consisting of lower aliphatic aldehydes and substituted olefins of the formula ##STR1## wherein R.sub.1 is a carboxy, carboxamide, alkali metal carboxylate, ammonium carboxylate, amine carboxylate or allyl carboxylate, and R.sub.2, R.sub.3 an R.sub.4 are each independently hydrogen or lower alkyl groups. Methods for the electrodeposition of tin, lead, or tin-lead alloys from such baths also are described.

    摘要翻译: 描述了用于在基底上电沉积锡,铅或锡铅合金的酸性电镀液。 电镀浴不含氟硼酸盐,并且包含(a)至少一种选自亚锡盐,铅盐或亚锡和铅盐的混合物的浴溶性金属盐,(b)至少一种烷烃 磺酸或链烷醇磺酸,(c)至少一种非离子,阳离子或两性表面活性剂,(d)有效量的至少一种选自芳族醛,苯乙酮和具有通式 Ar-C(H)= C(H)-C(O)-CH 3(III)其中Ar是苯基,萘基,吡啶基,噻吩基或呋喃基,和(e)有效量的二次增白剂, 由式(IV)的低级脂族醛和取代烯烃组成的组,其中R 1是羧基,羧酰胺,碱金属羧酸盐,羧酸铵,羧酸胺或羧酸烯丙基酯,R 2,R 3和R 4各自独立地是氢 或低级烷基。 还描述了用于从这种浴中电沉积锡,铅或锡铅合金的方法。

    Bath and process for plating tin, lead and tin-lead alloys
    45.
    发明授权
    Bath and process for plating tin, lead and tin-lead alloys 失效
    镀锡,铅和锡铅合金的浴和工艺

    公开(公告)号:US4565609A

    公开(公告)日:1986-01-21

    申请号:US723595

    申请日:1985-04-15

    摘要: This invention relates to the electrodeposition of tin, lead and particularly tin-lead alloys from an electroplating bath comprising a lead and/or tin alkylsulfonate, an alkylsulfonic acid in a sufficient amount to impart a pH below about 3 to the bath, and various additives to improve the brightness of the deposits, the useful current density ranges, and/or the solderability of tin-lead alloy deposits including quaternary nitrogen wetting agents containing a fatty acid radical, alkylene oxides, pyridine compounds, aromatic aldehydes, acetaldehyde and/or a bismuth compound.

    摘要翻译: 本发明涉及从包含铅和/或烷基磺酸锡的电镀浴中的锡,铅和特别是锡铅合金的电沉积,足以使pH低于约3的烷基磺酸,以及各种添加剂 改善沉积物的亮度,有用的电流密度范围和/或锡 - 铅合金沉积物的可焊性,包括含有脂肪酸基团,环氧烷烃,吡啶化合物,芳族醛,乙醛和/或 铋化合物。

    Electrodeposition of tin, lead and tin-lead alloys
    48.
    发明授权
    Electrodeposition of tin, lead and tin-lead alloys 失效
    锡,铅和锡铅合金的电沉积

    公开(公告)号:US4000047A

    公开(公告)日:1976-12-28

    申请号:US535146

    申请日:1974-12-20

    IPC分类号: C25D3/32 C25D3/36 C25D3/60

    CPC分类号: C25D3/60 C25D3/32 C25D3/36

    摘要: A bath for the electrodeposition of bright tin-lead alloys which comprises an aqueous acidic bath containing at least one soluble tin compound and one soluble lead compound to which there has been added:A. a lower alkylene oxide condensation product, andB. an effective amount of at least one pyridine or quinoline compound having the structure ##STR1## wherein the substituents R.sub.1, R.sub.2, R.sub.3, R.sub.4 and R.sub.5 each is a hydrogen or halogen atom, a lower alkyl radical containing a hydroxyl group, an alkenyl radical, the radical (C.sub.n H.sub.2n --CO.sub.2 H in which n has a value from 0 to 6 or a carbamide radical or R.sub.4 and R.sub.5 combined form a divalent radical to provide a compound having the structure ##STR2## in which R.sub.6 is nothing or a hydroxyl radical; Z is nothing, 0.sup.- or a quaternary ammonium forming hydrocarbon radical provided that when Z is nothing, at least one of the substituents R.sub.1, R.sub.2, R.sub.3, R.sub.4 and R.sub.5 is a halogen atom, a lower alkyl radical containing a hydroxyl group, an alkenyl radical, the radical (C.sub.n H.sub.2n --CO.sub.2 H in which n has a value from 0 to 6 or a carbamide radical or R.sub.6 is a hydroxy radical; and X is nothing or when Z is a quaternary ammonium forming hydrocarbon radical X is an anion.The invention also includes the addition of an aromatic aldehyde in combination with pyridine or quinoline compounds and the alkylene oxide condensation product which results in the production of even brighter to brilliant deposits over a wide current density range.

    摘要翻译: 用于电沉积明亮的锡铅合金的浴,其包含含有至少一种可溶性锡化合物和一种可溶性铅化合物的水性酸性浴,其中加入有:

    Addition agent for the electrolyte used in the electrodeposition of lead
    49.
    发明授权
    Addition agent for the electrolyte used in the electrodeposition of lead 失效
    用于电极电极的电解质添加剂

    公开(公告)号:US3554884A

    公开(公告)日:1971-01-12

    申请号:US3554884D

    申请日:1968-08-01

    申请人: ITT RAYONIER INC

    发明人: QUIMBY GEORGE R

    IPC分类号: C25C1/18 C25D3/36 C22D1/24

    CPC分类号: C25C1/18 C25D3/36

    摘要: THE UNIFORM ELECTROYLTIC DEPOSITIONOF LEAD FROM A CONVENTIONAL ELEXTROEFINING AQUEOUS ELECTROYLTICSOLUTION CONTAINING LEAD FLUOSILICATE AND HYDROFLUOSILICIC ACID IS PROMOTED BY ADDING TO THE ELECTROLYTIC SOLUTION FROM ABOUT 140-1200 MG./LITER OF A LIGNOSULFONATE AND FROM ABOUT 40-600 MG./LITER OF A WATER-SOLUBLE BLOCK COPOLYMER OF PROPYLENE OXIDE AND ETHYLENE OXIDE HAVING THE FOLLOWING GENERAL FORMULA:

    HO-(CH2-CH2-O)Y-(CH(-CH3)-CH2-O)X-(CH2-CH2-O)Z-H

    IN WHICH X IS AT LEAST 13, AND Y AND Z ARE SUCH THAT THE ETHENOXY CONTENT REPRESENTS FROM 20% TO 90% OF THE COPOLYMER.