公开(公告)号：US20040262373A1

公开(公告)日：2004-12-30

申请号：US10875285

申请日：2004-06-25

Applicant: SHIBUYA KOGYO CO., LTD

Inventor： Kensei Murata

IPC: B23K001/00

CPC classification number: B23K3/0607 ,  H01L21/4853 ,  H05K3/3478 ,  H05K3/3489

Abstract: A flux is supplied from a flux transfer head having a flux transfer pin to a predetermined position on a substrate, and then a solder ball is mounted on the predetermined position by a solder ball mounting head having a suction nozzle. The solder ball mounting head and the flux transfer head are provided alternately on a head supporter. When the rotation of the head supporter is stopped, sucking a solder ball suction by the suction nozzle, depositing the flux on a free end of the flux transfer pin, transferring the flux to the substrate by the flux transfer pin, and mounting the solder ball on the predetermined position by the ball mounting head, and examining whether the solder ball exists on the suction nozzle by which the ball mounting operation has just carried out are executed.

Abstract translation: 从具有磁通传递销的磁通传递头向基板上的预定位置供给磁通，然后通过具有吸嘴的焊球安装头将焊球安装在预定位置上。 焊球安装头和焊剂转移头交替地设置在头部支撑件上。 当头部支撑件的旋转停止时，通过吸嘴抽吸焊球吸引，将助熔剂沉积在助焊剂传递销的自由端上，通过助焊剂传送销将助焊剂转移到衬底，并安装焊球 通过球安装头在预定位置上，并且检查焊球是否存在于刚刚执行球安装操作的吸嘴上。

公开(公告)号：US20040232206A1

公开(公告)日：2004-11-25

申请号：US10875928

申请日：2004-06-25

Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.

Inventor： Haretaro Hidaka ,  Michio Tsukamoto

IPC: B23K001/00

CPC classification number: B23K31/02 ,  B23K20/1265 ,  B23K26/364 ,  B23K37/047 ,  F15B13/0807 ,  F15B13/0846 ,  F16L9/22 ,  F28F3/12 ,  F28F9/0202 ,  F28F9/26 ,  H01M8/02 ,  H01M8/0258 ,  H01M8/0267 ,  H01M8/0269 ,  H01M8/0297 ,  H01M8/04007 ,  H01M8/04067 ,  H01M8/04074 ,  H01M8/04082 ,  H01M8/2465 ,  H01M8/2485 ,  Y02P70/56 ,  Y10T137/85938 ,  Y10T137/877 ,  Y10T137/87885

Abstract: A machining method for an integrated piping plate, for example, composed of a plurality of plates joined together, and in which an instrument and a component constituting an apparatus, or the instrument, or the component are or is disposed on one surface or both surfaces of the integrated piping plate, and the instrument and the component, or the instrument, or the component are or is connected by fluid channel grooves formed in joining surfaces of the plates, and communication holes formed in the plates. The machining method welds the joining surfaces of the plates around the entire periphery of the fluid channel grooves, for example, by an FSW welding machine, to join the plates. Compared with joining of the plates by an adhesive, the machining method can increase the durability of the plate joining portion and increase pressure resistance. Also, the method can increase work efficiency and further downsize the integrated piping plate.

Abstract translation: 一种整体管道板的加工方法，例如由连接在一起的多个板构成，并且其中构成装置或仪器或部件的器械或部件在一个表面或两个表面上设置或设置在其中 集成管道板，仪器和部件或仪器或部件通过形成在板的接合表面中的流体通道槽连接或连接，以及形成在板中的连通孔。 加工方法例如通过FSW焊接机焊接流体通道槽的整个周边的板的接合表面，以连接板。 与通过粘合剂的板的接合相比，加工方法可以增加板接合部的耐久性并增加耐压性。 此外，该方法可以提高工作效率，进一步缩小集成管板的尺寸。

公开(公告)号：US20040226984A1

公开(公告)日：2004-11-18

申请号：US10802871

申请日：2004-03-18

Inventor： Philip Russel James Smith ,  Adrian Neil Bargh

IPC: B23K001/00

CPC classification number: B01L3/50855 ,  B01L3/5082 ,  B01L9/06 ,  B01L2200/025 ,  B01L2300/021 ,  B01L2300/041 ,  B01L2300/0851 ,  G01N21/03

Abstract: A tube for storing micro-litre volumes is provided. The tube is open at one end and comprises a body portion of substantially square cross section; a shoulder portion at one end of the body portion and providing the open end of the tube, the cross section of the shoulder portion being greater than that of the body portion; and a formation providing a snap fit connector portion at the other end.

Abstract translation: 提供了用于存储微量体积的管。 管在一端开口并且包括基本正方形横截面的主体部分; 在主体部分的一端处的肩部并且提供管的开口端，肩部的横截面大于主体部分的横截面; 以及在另一端提供卡扣配合连接器部分的结构。

公开(公告)号：US20040226979A1

公开(公告)日：2004-11-18

申请号：US10833072

申请日：2004-04-28

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Masahiro Sato ,  Masashi Ishiguro ,  Tomoko Fukunaka ,  Kazuhiko Yamashita ,  Mamoru Watanabe ,  Ryoji Inutsuka ,  Kenji Takahashi ,  Toshikazu Yoneda

IPC: B23K001/00

CPC classification number: B23K1/0056 ,  B23K26/04 ,  B23K2101/42

Abstract: An optical processing apparatus includes an emitter for emitting light, a first light path for directing the light to a position to be processed on a workpiece, and a processing head. The processing head includes an optical system provided in the first light path, for shaping the light, a second light path having a portion shared with the first light path, the second light path directing light reflected from the workpiece, and an optical receiver for receiving the reflected light from the second light path. The optical processing apparatus further includes an actuator for changing a positional relationship between the optical system and the workpiece, a feeder for supplying a solder to the workpiece, a first shifter for moving the processing head in a first direction in parallel to an optical axis of the light emitted from the emitter, a second shifter for positioning the feeder in the first direction away from the processing head when the processing head is moved away from the workpiece by the first shifter, and a third shifter for moving the feeder against the processing head in a second direction perpendicular to the first direction while the processing head is moved by the first shifter. The optical processing apparatus allows the spot of the incident light and the position of soldering to be readily set depending on the configuration of a workpiece and can thus solder the workpiece at higher quality under soldering conditions optimized for the workpiece.

Abstract translation: 光学处理设备包括用于发射光的发射器，用于将光引导到在工件上被处理的位置的第一光路和处理头。 处理头包括设置在第一光路中的光学系统，用于使光成形，具有与第一光路共享的部分的第二光路，引导从工件反射的光的第二光路和用于接收的光接收器 来自第二光路的反射光。 光学处理装置还包括用于改变光学系​​统和工件之间的位置关系的致动器，用于向工件供应焊料的馈送器，用于沿第一方向平行于第一方向移动处理头的第一移位器， 从发射器发射的光;第二移位器，用于当处理头通过第一移位器移动离开工件时，将馈送器沿第一方向定位成远离处理头;以及第三移位器，用于将馈送器移动到处理头 在垂直于第一方向的第二方向上，当处理头被第一移位器移动时。 光学处理装置允许入射光的点和焊接位置根据工件的构造容易地设定，并且因此可以在针对工件优化的焊接条件下以更高的质量焊接工件。

公开(公告)号：US20040200878A1

公开(公告)日：2004-10-14

申请号：US10411494

申请日：2003-04-10

Applicant: Visteon Global Technologies, Inc.

Inventor： Lakhi N. Goenka

IPC: B23K001/00

CPC classification number: B23K1/008 ,  B23K1/0016 ,  B23K2101/40 ,  H05K3/3494 ,  H05K2203/0165 ,  H05K2203/081 ,  H05K2203/111 ,  H05K2203/1121

Abstract: A method of soldering electronic components to a heat sensitive flexible substrate with cooling for a vector transient reflow process is disclosed. The method comprises applying solder paste to the substrate and placing electronic components to the substrate to form a substrate assembly. The method further includes locating the substrate assembly on a pallet having a heat conductive layer for heat sinking means from the substrate. The method further includes rapid localized heating to a melting temperature sufficient to melt the solder paste using a supplemental heat source. While exposing the deposited solder paste to further rapid localized heating, the method further comprises cooling the pallet at the second surface to diffuse the heat from the substrate defining a temperature gradient across the substrate.

Abstract translation: 公开了一种将电子部件焊接到热敏柔性基板上的方法，其中冷却用于矢量瞬态回流工艺。 该方法包括将焊膏施加到基底上并将电子元件放置到基底上以形成基底组件。 该方法还包括将基板组件定位在具有用于散热装置的导热层的托盘上，该基板由基板定位。 该方法还包括使用补充热源快速局部加热至足以熔化焊膏的熔融温度。 在将沉积的焊膏暴露于进一步快速局部加热的同时，该方法还包括在第二表面处冷却托盘以将来自衬底的热量扩散跨越衬底限定温度梯度。

公开(公告)号：US20040188495A1

公开(公告)日：2004-09-30

申请号：US10819321

申请日：2004-04-05

Inventor： R. Scott Enochs ,  Travis Ernst

IPC: B23K001/00

CPC classification number: G02B6/4238 ,  B23K3/0607 ,  G02B6/4248

Abstract: A solder machine that can automatically solder a fiber optic cable to a package. The solder machine includes a fixture for supporting the cable and the package. The machine has a gas heater that emits a heated inert gas. The gas heats at least a portion of the package to a soldering temperature. The machine also includes a solder dispenser that dispenses solder into the heated package. The solder attaches the fiber optic cable to the package. The inert gas prevents undesirable oxidation at the solder site. The use of an inert gas eliminates the need for solder flux. The heating, gassing and dispensing steps can be controlled by a computer to automate the entire process. The package and fiber optic cable can be supported by a pallet that is loaded and then unloaded from the machine to further improve the ease of operation and decrease the cost associated with the solder process.

Abstract translation: 可以自动焊接光纤到封装的焊锡机。 焊接机包括用于支撑电缆和封装的夹具。 该机器具有放出加热的惰性气体的气体加热器。 气体将包装的至少一部分加热至焊接温度。 该机器还包括将焊料分配到加热包装中的焊料分配器。 焊料将光缆连接到包装上。 惰性气体防止在焊点处的不期望的氧化。 使用惰性气体不需要焊剂助焊剂。 加热，放气和分配步骤可以由计算机控制以使整个过程自动化。 包装和光纤电缆可以由装载并从机器卸载的托盘支撑，以进一步提高操作的便利性并降低与焊接过程相关的成本。

公开(公告)号：US20040134970A1

公开(公告)日：2004-07-15

申请号：US10621506

申请日：2003-07-17

Inventor： Johannis Josephus Den Boer ,  Anthony Thomas Cole ,  Klisthenis Dimitriadis ,  Dirk Arie Kronemeijer ,  Jan Erik Vollebregt

IPC: B23K001/00

CPC classification number: B23K31/12 ,  B23K2101/06 ,  G01N29/2412 ,  G01N2291/0422

Abstract: A method for inspecting welds between welded tubular ends includes arranging a series electromagnetic acoustic transducer (EMAT) assemblies in circumferential direction adjacent to an inner and/or outer surface of at least one of the welded tubular ends and inducing the EMAT assemblies to transmit sequentially or simultaneously acoustic shear wave signals towards the weld and to detect the shear waves reflected by and/or passing through the weld while the EMAT assemblies are maintained in a substantially fixed position relative to the weld such that at least a substantial part of the weld is scanned by the EMAT assemblies instantly after the weld is made.

Abstract translation: 用于检查焊接的管状端部之间的焊缝的方法包括在邻近焊接的管状端部中的至少一个的内表面和/或外表面的周向方向上布置串联电磁声换能器（EMAT）组件，并且引导EMAT组件依次或 同时声波剪切波信号朝向焊缝并且检测由焊缝反射和/或通过焊缝的剪切波，同时EMAT组件相对于焊缝保持在基本上固定的位置，使得至少大部分焊缝被扫描 在焊接后立即由EMAT组件。

公开(公告)号：US20040129759A1

公开(公告)日：2004-07-08

申请号：US10706077

申请日：2003-11-13

Inventor： Philippe Rouault ,  Fred Schweighardt

IPC: B23K001/00

CPC classification number: B23K31/00

Abstract: A method and system for diagnosing, solving, and/or controlling, in particular remotely, a given technical problem likely to arise before, during or after a heat treatment operation on metals, in particular in the welding or cutting field, and to provide the most suitable solution thereto, and to do so by minimizing the time needed to solve this problem and therefore by reducing the loss of productivity likely to occur because of this technical problem.

Abstract translation: 一种用于诊断，解决和/或控制特别是远程地在金属，特别是在焊接或切割领域的热处理操作之前，期间或之后可能出现的给定技术问题的方法和系统，并且提供 最合适的解决方案，并且通过最小化解决该问题所需的时间并因此通过减少由于该技术问题而可能发生的生产损失来做到这一点。

公开(公告)号：US20040104260A1

公开(公告)日：2004-06-03

申请号：US10714262

申请日：2003-11-14

Applicant: Siemens Technology-to-Business Center LLC

Inventor： Irving S. Scher ,  Daniel Conrad Benson

IPC: B23K001/00

CPC classification number: G01L1/205 ,  H01H2207/008 ,  H01H2207/014 ,  H05K3/321 ,  H05K3/325 ,  H05K3/341 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49142 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49155

Abstract: The present invention provides methods for connecting electrically conductive elastomer to electronics that reduce cost and time for manufacturing a tactile sensor that includes an electrically conductive elastomer such as a conductive foam. The methods provide a good connection between the electrically conductive elastomer and the electrodes connected to the electronics, which provide for repeatable measurements. The methods can be used for all cases of electrically conductive elastomers and elastomers made to be conductive with the addition of conductive particles (such as carbon, silver, nickel, gold, etc.) including thermoplastic and some thermosetting elastomers.

Abstract translation: 本发明提供了将导电弹性体连接到电子装置的方法，其减少了制造包括导电弹性体如导电泡沫的触觉传感器的成本和时间。 这些方法提供了导电弹性体和连接到电子器件的电极之间的良好连接，这提供了可重复的测量。 所述方法可用于通过添加包括热塑性塑料和一些热固性弹性体的导电颗粒（例如碳，银，镍，金等）而导致的导电弹性体和弹性体的所有情况。

公开(公告)号：US20040056078A1

公开(公告)日：2004-03-25

申请号：US10661960

申请日：2003-09-11

Inventor： Kwan Yew Kee ,  Chew Boon Ngee ,  Keith Wong Bing Chiang

IPC: B23K001/00

CPC classification number: B23K1/018 ,  H05K3/225 ,  H05K3/3478 ,  Y10T29/53178

Abstract: A method for reworking a ball grid array (BGA) of solder balls including one or more defective solder balls on an electronic component workpiece using a single-ball extractor/placer apparatus having a heatable capillary tube pickup head optionally augmented with vacuum suction. A defective solder ball is identified, extracted by the pickup head and disposed of. A nondefective solder ball is picked up by the pickup head, positioned on the vacated attachment site, and thermally softened for attachment to the workpiece. Flux may be first applied to the replacement solder ball or to the vacated attachment site. The extractor/placer apparatus may be automated to locate, extract and replace defective balls for completion of a fully operable BGA.