公开(公告)号：US20040067718A1

公开(公告)日：2004-04-08

申请号：US10670499

申请日：2003-09-26

Inventor： Kazuo Shimizu ,  Shinro Ohta ,  Akihiro Tsukada

IPC: B24B049/00 ,  B24B051/00

CPC classification number: B24B37/013 ,  B23H5/08 ,  B24B37/046 ,  B24B49/12 ,  G01B11/0625

Abstract: A polishing apparatus has a polishing table having a polishing surface, a top ring for holding a workpiece to be polished and pressing the workpiece against the polishing surface on the polishing table, and a film thickness measuring device embedded in the polishing table. The film thickness measuring device includes a light source for applying light having a predetermined wavelength to a surface of the workpiece, a spectroscope for separating light reflected from the surface of the workpiece, and a charge coupled device array for capturing light separated by the spectroscope. The polishing apparatus also has a controller operable to analyze information captured by the charge coupled device array over the entire surface of the workpiece to obtain a film thickness at a desired point on the surface of the workpiece.

Abstract translation: 抛光装置具有：具有研磨面的研磨台，用于保持待研磨的工件的顶环，并将工件压靠在研磨台上的研磨面上，以及嵌入在研磨台中的膜厚测量装置。 膜厚测量装置包括：用于将一个具有预定波长的光施加到工件的表面的光源，用于分离从工件表面反射的光的分光器和用于捕获由分光镜分离的光的电荷耦合器件阵列。 抛光装置还具有控制器，其可操作以分析由电荷耦合器件阵列在工件的整个表面上捕获的信息，以在工件表面上的期望点处获得膜厚度。

公开(公告)号：US20040053559A1

公开(公告)日：2004-03-18

申请号：US10614783

申请日：2003-07-09

Inventor： Hiroomi Torii ,  Hideo Aizawa ,  Satoshi Wakabayashi

IPC: B24B049/00 ,  B24B051/00 ,  B24B001/00

CPC classification number: B24B37/20 ,  B24B49/14 ,  B24D9/085 ,  B24D18/0072

Abstract: A polishing apparatus includes a top ring for holding a substrate and a polishing table having a polishing surface. The substrate held by the top ring is brought into contact with the polishing surface, and in this state, the polishing table and the substrate are moved relative to each other to thereby polish the substrate. Expendable replacement components to be bonded to the top ring and the polishing table, such as a backing film, a pressure ring and a polishing cloth, are bonded in such a manner that pieces of heat-sensitive adhesive tape are interposed between the expendable replacement components on the one hand and the top ring and the polishing table on the other. The heat-sensitive adhesive tape is switchable between a non-adhesive state and a adhesive state according to whether the temperature thereof is higher or lower than a predetermined set temperature. Thus, the expendable replacement components can be bonded and removed extremely easily by the temperature control of the heat-sensitive adhesive tape.

Abstract translation: 抛光装置包括用于保持基板的顶环和具有抛光表面的抛光台。 由顶环保持的基板与研磨面接触，在该状态下，使研磨台和基板相对移动，从而对基板进行抛光。 要结合到顶环和抛光台（例如背衬膜，压力环和抛光布）上的消耗性替换部件以这样的方式粘合，使得热敏胶带被插入在消耗性替换部件之间 另一方面是顶环和抛光台。 根据其温度是否高于或低于预定设定温度，热敏胶带可在非粘合状态和粘合状态之间切换。 因此，可以通过热敏粘合带的温度控制，极易地将消耗性更换部件粘合和去除。

公开(公告)号：US20040048551A1

公开(公告)日：2004-03-11

申请号：US10415803

申请日：2003-09-26

Inventor： Urs Tschudin ,  Libor Sedlacek

IPC: B24B049/00 ,  B24B051/00

CPC classification number: B24B5/307 ,  B24B41/06 ,  B24B53/00

Abstract: A centerless cylindrical grinding machine, for through-feed and in-feed grinding of various workpieces (8), has a first driven positioning axis XS for a grinding spindle head (2) with a grinding wheel (1) and a second driven positioning axis XR, running parallel to the positioning axis XS, for a regulating spindle head (4), with a regulating wheel (3). The positioning axes XS and XR are arranged perpendicular to the rotation axes (5, 6) or the grinding wheel (1) and the regulating wheel (3). A workpiece support (7) on a carriage (12) and an inner- or outer-acting wheel-true device (9) are arranged between the grinding spindle head (2) and the regulating spindle head (4). During operation, the grinding spindle head (2), the regulating spindle head (4), the workpiece support (7) and the wheel-true device (9) are located within a safety housing (15). The carriage (12) may be adjusted along a driven positioning axis YW which runs at right angles to the positioning axes XS and XR, along a carriage track (13) and may be moved to a position outside the safety housing (15). The invention has the advantages that the machine is not just a simpler and therefore cheaper, but is also more reliable in operation and permits easy retooling.

Abstract translation: 一种用于各种工件（8）的进给和进给研磨的无心圆柱磨床具有用于具有砂轮（1）的磨削主轴头（2）的第一从动定位轴XS和具有砂轮（1）的第二从动定位轴 XR平行于定位轴XS运行，用于具有调节轮（3）的调节主轴头（4）。 定位轴XS和XR垂直于旋转轴（5,6）或砂轮（1）和调节轮（3）布置。 在研磨主轴头（2）和调节主轴头（4）之间布置有滑架（12）上的工件支撑件（7）和内部或外部作用的车轮真实装置（9）。 在操作期间，磨削主轴头（2），调节主轴头（4），工件支撑件（7）和车轮真实装置（9）位于安全壳体（15）内。 滑架（12）可以沿着沿着滑架轨道（13）与定位轴线XS和XR成直角延伸的从动定位轴线YW进行调节，并且可以移动到安全壳体（15）外部的位置。 本发明的优点在于机器不仅简单且便宜，而且在操作中也更可靠，并且允许容易的重新装配。

公开(公告)号：US20040043700A1

公开(公告)日：2004-03-04

申请号：US10232854

申请日：2002-08-28

Inventor： Jim Hofmann

IPC: B24B049/00 ,  B24B051/00

CPC classification number: B24B37/013 ,  B24B37/042 ,  B24B49/00 ,  G05B13/04 ,  G05B2219/33043 ,  G05B2219/45232 ,  G05B2219/49085

Abstract: An algorithm uses offline metrology to control a process by passing information from an outer control loop to an inner control loop, extended Kalman filter estimator. The inner control loop operates online, and the outer control loop operates asynchronously with respect to the inner control loop. The online control loop is updated for each subsequent process. The offline metrology is optionally updated for each subsequent process.

Abstract translation: 一种算法使用离线计量来通过将信息从外部控制环路传递到内部控制回路来控制过程，扩展卡尔曼滤波器估计器。 内部控制回路在线运行，外部控制回路相对于内部控制回路异步运行。 在每个后续过程中更新在线控制循环。 可选地为每个后续过程更新离线计量。

公开(公告)号：US20040043699A1

公开(公告)日：2004-03-04

申请号：US10230667

申请日：2002-08-29

Inventor： Nagasubramaniyan Chandrasekaran

IPC: B24B049/00 ,  B24B051/00

CPC classification number: B24B37/04 ,  B24B1/04

Abstract: Planarizing machines and methods for mechanical and/or chemical-mechanical planarization of micro-device workpieces are disclosed herein. In one embodiment, a method for polishing a workpiece includes determining an estimated frequency of serial defects in a workpiece, pressing the workpiece against a polishing pad and moving the workpiece relative to the pad. The method further includes vibrating the workpiece and/or the pad at a frequency that is greater than the estimated frequency of the serial defects. In one aspect of this embodiment, determining the estimated frequency of serial defects can include: determining a relative velocity between the workpiece and the polishing pad; estimating the length of a mark on the workpiece; estimating the time a particle in a planarizing solution is in contact with the workpiece; and estimating the number of cracks in the workpiece.

Abstract translation: 本文公开了用于微型装置工件的机械和/或化学机械平面化的平面化机器和方法。 在一个实施例中，用于抛光工件的方法包括确定工件中的串联缺陷的估计频率，将工件压靠抛光垫并相对于衬垫移动工件。 该方法还包括以大于串联缺陷的估计频率的频率振动工件和/或焊盘。 在该实施例的一个方面，确定串联缺陷的估计频率可以包括：确定工件和抛光垫之间的相对速度; 估计工件上的标记长度; 估计平面化溶液中的颗粒与工件接触的时间; 并估计工件中的裂纹数量。

公开(公告)号：US20040033757A1

公开(公告)日：2004-02-19

申请号：US10222238

申请日：2002-08-16

Inventor： Nagasubramaniyan Chandrasekaran ,  Theodore M. Taylor

IPC: B24B049/00 ,  B24B051/00 ,  B24B001/00

CPC classification number: B24B37/0056 ,  B24B37/044 ,  B24B49/16 ,  C09G1/02 ,  C09K3/1409 ,  C09K3/1463 ,  H01L21/3212 ,  H01L45/085 ,  H01L45/143 ,  H01L45/1683

Abstract: Microelectronic devices including a layer of germanium and selenium, optionally including up to 10 atomic percent silver, show promise for select applications. Manufacturing microelectronic devices containing such layers using conventional CMP processes presents some significant challenges. Embodiments of the invention provide methods of planarizing workpieces with GenullSe layers, many of which can be carried out using conventional CMP equipment. Other embodiments of the invention provide chemical-mechanical polishing systems adapted to produce planarized workpieces with GenullSe layers or, in at least one embodiment, other alternative layers. Various approaches suggested herein facilitate production of such microelectronic devices by appropriate control of the down force of the GenullSe layer against the planarizing medium and/or one or more aspects of the planarizing medium, which aspects include pH, abrasive particle size, abrasive particle hardness, weight percent of abrasive.

Abstract translation: 包括锗和硒层的微电子器件（任选地包括至多10原子百分比的银）对于选择的应用来说显示出希望。 使用常规CMP工艺制造含有这种层的微电子器件提出了一些重大挑战。 本发明的实施例提供了使用Ge-Se层平坦化工件的方法，其中许多可以使用常规CMP设备进行。 本发明的其它实施方案提供了适用于产生具有Ge-Se层的平坦化工件的化学机械抛光系统，或者在至少一个实施方案中产生其它替代层。 本文提出的各种方法通过适当控制Ge-Se层对平坦化介质的向下力和/或平坦化介质的一个或多个方面来促进这种微电子器件的生产，这些方面包括pH，研磨粒度，磨料颗粒 硬度，磨料重量百分比。

公开(公告)号：US20040029491A1

公开(公告)日：2004-02-12

申请号：US10606980

申请日：2003-06-27

Inventor： Edward J. Hubbell III

IPC: B24B049/00 ,  B24B051/00

CPC classification number: B28D5/0064

Abstract: A saw cutting pattern is dynamically established for a semiconductor dicing saw based on detection of the saw blade contacting a wafer or a portion of a wafer. The dynamic cutting pattern may terminate cuts if the saw blade no longer contacts the wafer or a portion of a wafer. Thus, irregular shaped wafers may be cut without requiring that an entire predefined cutting pattern be carried out and/or without previously mapping the shape of the wafer or portion of a wafer. A map of the wafer or a portion of a wafer may also be generated based on the detection of the saw blade contacting the wafer during a first cutting pass and may be used during a second cutting pass.

Abstract translation: 基于与晶片或晶片的一部分接触的锯片的检测，半导体切割锯动态建立锯切图案。 如果锯片不再接触晶片或晶片的一部分，则动态切割图案可以终止切割。 因此，可以切割不规则形状的晶片，而不需要执行整个预定义的切割图案和/或不预先映射晶片或晶片的一部分的形状。 也可以基于在第一切割过程中与锯片接触的锯片的检测来生成晶片或晶片的一部分的图，并且可以在第二次切割过程中使用。

公开(公告)号：US20030224701A1

公开(公告)日：2003-12-04

申请号：US10412320

申请日：2003-04-14

Inventor： Laurent Guillermin ,  Sylvaine Millet

IPC: B24B049/00 ,  B24B051/00 ,  B24B001/00

CPC classification number: B24B9/148 ,  B24B17/06 ,  B24B47/225 ,  B24B49/12 ,  G05B2219/37365 ,  G05B2219/37571 ,  G05B2219/45157

Abstract: Process for grinding the rim of an ophthalmic lens that has two opposite faces, following a predetermined contour corresponding to that of a ring of a spectacle frame in which the lens is intended to be mounted, the contour being delimited on each of the faces by an edge, and the process includes a plotting stage in which the three-dimensional shape of at least one of the edges is plotted. In the plotting stage, the edge is scanned on the illuminated face of lens using a light beam forming a light spot on the face, the successive positions of an image of the light spot are plotted simultaneously on optical reception elements pointing towards the light spot, and the three-dimensional shape of the edge is deduced from the plots made, machining of the lens being carried out according to the plot or plots.

Abstract translation: 用于研磨具有两个相对面的眼镜片的边缘的方法，该眼镜片沿着与要安装透镜的眼镜框的环相对应的预定轮廓，轮廓在每个面上被界定为 边缘，并且该过程包括绘制至少一个边缘的三维形状的绘图阶段。 在绘图阶段，使用在面上形成光斑的光束在透镜的照明面上扫描边缘，将光点的图像的连续位置同时绘制在指向光点的光接收元件上， 并且从所绘制的图中推导出边缘的三维形状，根据绘图或绘图进行透镜的加工。

公开(公告)号：US20030220051A1

公开(公告)日：2003-11-27

申请号：US10301197

申请日：2002-11-20

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd

Inventor： Chih-Ming Chang

IPC: B24B049/00 ,  B24B051/00 ,  B24B007/00

CPC classification number: B24B53/017

Abstract: A conditioning disk actuating system for raising and lowering a conditioning disk inside a conditioning head for the conditioning of semiconductor wafer polishing pads. The system includes a fluid-actuated cylinder which is coupled to a travel hub vertically slidably mounted in a travel housing provided inside the conditioning head. The conditioning disk is mounted on the bottom end of a disk shaft carried by the travel hub. The fluid-actuated cylinder is operated to selectively lower and raise the travel hub and conditioning disk to press the disk against the polishing pad and remove the disk from the polishing pad, respectively. A position sensing mechanism may be provided in the conditioning head for revealing the nullupnull or nulldownnull position of the conditioning disk.

公开(公告)号：US20030190862A1

公开(公告)日：2003-10-09

申请号：US10260570

申请日：2002-10-01

Inventor： Kyung-Su Chae ,  Sang-Sun Shin ,  Jong-Go Lim

IPC: B24B049/00 ,  B24B051/00 ,  B24B001/00

CPC classification number: G02F1/1333 ,  B24B9/06 ,  B24B49/12 ,  G02F1/133351 ,  G02F2001/133302

Abstract: In an apparatus and a method for correcting a grinding amount of a unit liquid crystal display panel, by grinding an edge of a unit liquid crystal display panel; generating grinding pictures of the unit liquid crystal display panel; calculating an error value by comparing the grinding pictures with a reference picture; and changing a set value of a grinding unit according to the error value. In addition, by disposing a grinding amount correcting apparatus in a grinding apparatus, correcting a grinding amount of a unit liquid crystal display panel can be performed by an automatic system.