公开(公告)号：US20220019137A1

公开(公告)日：2022-01-20

申请号：US17321521

申请日：2021-05-17

申请人： Coretronic Corporation

发明人： FA-CHIH CHEN

IPC分类号： G03B21/20 ,  H01L33/50 ,  H01L33/64

摘要： A wavelength conversion module includes a driving assembly, a wavelength conversion substrate, and a clamping element. The driving assembly is connected to the wavelength conversion substrate to drive the wavelength conversion substrate to rotate around a central axis of the driving assembly. The clamping element is attached to the wavelength conversion substrate along the central axis. At least one of the wavelength conversion substrate and the clamping element includes at least one recess and at least one through hole. A direction of the through hole is parallel to the central axis, and the clamping element, the recess, and the wavelength conversion substrate define at least one heat dissipation channel. The through hole is relatively adjacent to the central axis and is in communication with the heat dissipation channel.

公开(公告)号：US11221512B2

公开(公告)日：2022-01-11

申请号：US16294731

申请日：2019-03-06

申请人： Apple Inc.

发明人： Rong Liu ,  Daming Xu ,  Jun Qi ,  Ling Han ,  Mookyung Son ,  Chenhua You ,  Victor H. Yin ,  Xinyu Zhu ,  Heesang Suh ,  Juan He ,  Joshua A. Spechler ,  Zhenyue Luo ,  Suraj P. Gorkhali

IPC分类号： G02F1/13357 ,  H05K1/02 ,  H05K1/18 ,  H05K3/22 ,  H05K3/34 ,  F21K9/64 ,  H01L25/075 ,  H01L33/54 ,  H01L33/62 ,  H01L33/64 ,  F21Y115/10 ,  G02F1/1335

摘要： A display may have a pixel array such as a liquid crystal pixel array. The pixel array may be illuminated with backlight illumination from a backlight unit. The backlight unit may include a printed circuit board, a plurality of light-emitting diodes mounted on the printed circuit board, at least one light spreading layer formed over the printed circuit board that spreads light received from the plurality of light-emitting diodes, a partially reflective layer formed over the at least one light spreading layer, a color conversion layer formed over the partially reflective layer, a collimating layer formed over the color conversion layer, a brightness enhancement film formed over the collimating layer, and a diffuser formed over the brightness enhancement film. The at least one light spreading layer may include two light spreading layers with elongated protrusions that are rotated relative to each other.

公开(公告)号：US20210407977A1

公开(公告)日：2021-12-30

申请号：US17358235

申请日：2021-06-25

申请人： BOE TECHNOLOGY GROUP CO., LTD.

发明人： Yu TIAN ,  Qian JIN ,  Qian SUN ,  Wei HUANG

IPC分类号： H01L25/16 ,  H01L33/50 ,  H01L33/58 ,  H01L33/64 ,  H01L27/12 ,  H01L33/56

摘要： The present disclosure provides a display panel, a method for manufacturing a display panel and a display device. The display panel includes a substrate, and a light emitting element array and a quantum dot color filter array arranged on the substrate, the quantum dot color filter array is arranged on a light exiting side of the light emitting element array, and quantum dot color filters in the quantum dot color filter array correspond to light emitting elements in the light emitting element array one to one, and the display panel further includes a blocking structure arranged between the light emitting element array and the quantum dot color filter array so as to block heat dissipated by the light emitting elements from being conducted to the quantum dot color filters.

公开(公告)号：US11211538B1

公开(公告)日：2021-12-28

申请号：US17133200

申请日：2020-12-23

申请人： Joseph L. Pikulski ,  Willett Tuitele

发明人： Joseph L. Pikulski ,  Willett Tuitele

IPC分类号： H01L33/64

摘要： Described herein are devices, systems and methods for utilizing fluid cooling to thermally manage electrically-powered devices. Embodiments incorporating features of the present disclosure can purge heated cooling fluid from the system immediately after it has been used to absorb heat from an electrically-powered device, so that other devices in the system do not receive cooling fluid from another device in the system. In some embodiments, cooling fluid can be made to directly impinge on or near an electrically-powered device.

公开(公告)号：US20210391508A1

公开(公告)日：2021-12-16

申请号：US17346232

申请日：2021-06-12

申请人： Shinko Electric Industries Co., Ltd.

发明人： Michio Horiuchi ,  Masaya Tsuno

IPC分类号： H01L33/48 ,  H01L25/075 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64

摘要： A light emitting device includes a light-transmissive ceramic substrate, a light emitting element mounted on the ceramic substrate, a wiring arranged inside the ceramic substrate and electrically connected to the light emitting element, a base material faced to the ceramic substrate, and a seal member hermetically sealing a gap between the ceramic substrate and the base material. The light emitting element is arranged in a space surrounded by the ceramic substrate, the base material, and the seal member. The wiring includes a wiring layer extending in a planar direction of the ceramic substrate.

公开(公告)号：US20210375981A1

公开(公告)日：2021-12-02

申请号：US17327104

申请日：2021-05-21

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Yongmin KWON ,  Geunwoo Ko ,  Jaeyoon Kim ,  Jonghyun Lee

IPC分类号： H01L27/15 ,  H01L25/16 ,  H01L33/22 ,  H01L33/46 ,  H01L33/38 ,  H01L33/50 ,  H01L33/62 ,  H01L33/64

摘要： A light source module is provided. The light source module includes a printed circuit board; a light-emitting device mounted on the printed circuit board, the light-emitting device including a plurality of cell blocks, each of which includes a plurality of light-emitting cells; and a plurality of controllers mounted on the printed circuit board, each of which is configured to drive a cell block corresponding thereto, from among the plurality of cell blocks. The plurality of cell blocks are electrically isolated from each other, the plurality of cell blocks include a first cell block and a second cell block, and a number of first light-emitting cells included in the first cell block is less than a number of second light-emitting cells included in the second cell block.

公开(公告)号：US11189766B2

公开(公告)日：2021-11-30

申请号：US16249246

申请日：2019-01-16

申请人： Cree, Inc.

发明人： Arthur F. Pun ,  Colin Blakely ,  Kyle Damborsky ,  Jae-Hyung Jeremiah Park

IPC分类号： H01L33/00 ,  H01L33/62 ,  H01L25/075 ,  H01L33/32 ,  H01L33/64

摘要： Solid-state lighting devices including light-emitting diodes (LEDs) and LED packages are disclosed. LED packages are provided with improved thermal and/or electrical coupling between LED chips and submounts or lead frames. Various configurations of submounts with via arrangements are disclosed to provide improved coupling between LED chips and submounts. LED chip contacts are disclosed with one or more openings that are registered with vias to provide more uniform mounting. Multiple LED chips may be arranged around a thermally conductive element on a submount, and a via in the submount may be registered with the thermally conductive element. Subassemblies are provided between LED chips and lead frames to improve electrical and thermal coupling. Underfill materials may be arranged between LED chips and lead frames to provide improved mechanical support.

公开(公告)号：US20210367125A1

公开(公告)日：2021-11-25

申请号：US17313862

申请日：2021-05-06

申请人： Bridgelux Chongqing Co., Ltd.

发明人： Tao XU ,  Hao YIN

IPC分类号： H01L33/64 ,  H01L33/50 ,  H01L33/56

摘要： A light emitting diode (LED) package includes an aluminum nitride (AlN) substrate, a patterned copper layer with polished portions formed on a first side of the substrate, at least one LED disposed over the polished portions of the patterned copper layer, covers incorporating one or more phosphors disposed over the LEDs, a silicone fill and dam walls. The silicone fill, which is bordered by silicone dam walls and silicone fill surfaces, is formed in between the LEDs and covers. In some embodiments, the silicone fill does not extend over the covers. The silicone fill surface and the ends of the dam walls are substantially planar with an end of the substrate. The LED package can also include a thermal pad disposed on an opposite side of the substrate. Embodiments also include methods for make the LED package.

公开(公告)号：US20210351327A1

公开(公告)日：2021-11-11

申请号：US17382827

申请日：2021-07-22

申请人： DENSO CORPORATION

发明人： Kosuke NIIMURA

IPC分类号： H01L33/48 ,  H01L33/52 ,  H01L33/64

摘要： A light-source apparatus includes a light-source chip, a case, a substrate, an electromagnetic shield plate and a thermally-conductive member. The light-source chip is received in the case. The case is mounted to the substrate. The electromagnetic shield plate covers at least part of the substrate. The thermally-conductive member is arranged to abut both the case and the electromagnetic shield plate.

公开(公告)号：US20210336115A1

公开(公告)日：2021-10-28

申请号：US16609888

申请日：2019-04-29

申请人： BOE OPTICAL SCIENCE AND TECHNOLOGY CO., LTD. ,  BOE TECHNOLOGY GROUP CO., LTD.

发明人： Tao WANG

IPC分类号： H01L33/64 ,  H01L23/00

摘要： The present disclosure provides a light-emitting diode, a method for manufacturing the same, a backlight source and a display device. The light-emitting diode includes a support having a bottom wall, a light-emitting chip on the support, and a die bonding structure. A through hole is provided in the bottom wall. At least a portion of the die bonding structure is located in the through hole. The light-emitting chip is attached to the bottom wall through the die bonding structure.