摘要:
A backlight unit comprises an arrangement surface and a plurality of point light sources arranged on the arrangement surface, wherein the arrangement surface is divided into an array of hexagonal cells, a plurality of the cells comprising a white light providing unit. An LCD comprising a backlight unit on which a point light source is efficiently disposed and an efficient arrangement method of a point light source are provided.
摘要:
A light-generating device includes a driving substrate and a plurality of light source arrays. The driving substrate has a rectangular planar shape. The plurality of light source arrays is formed on the driving substrate. The light source arrays include at least one light emitting diode to generate light in response to power being applied through the substrate, and the light source arrays are spaced apart from each other. Thus, heat generated from the light-generating device is rapidly dissipated from the light-generating device, improving brightness of the light, brightness uniformity of the light and color reproducibility of the light.
摘要:
A power supply is provided, which includes a DC-DC converter being supplied with an external DC input voltage and a first switching control signal and outputting a duty sensing signal of which a magnitude is varied in accordance with the first switching control signal, the duty sensing signal being indicative of a duty ratio of the first switching control signal, and the DC-DC converter converting the input voltage into a DC output voltage of a predetermined magnitude based on the first switching control signal; and a feedback controlling unit comparing the duty sensing signal with a first reference signal to adjust the duty ratio of the first switching control signal.
摘要:
In an anisotropic conductive film including conductive particles, and a bump, and a packaging structure of a semiconductor chip having the anisotropic conductive film and the bump, the anisotropic conductive film includes a resin layer and the conductive particles. The anisotropic conductive film electrically connects an electrode of a substrate and the bump of a semiconductor chip. A volume ratio of the conductive particles to the resin layer is about 0.1 to about 0.12. A number of the conductive particles per cubic millimeter (mm3) is about 4 millions to about 7 millions. A standard deviation of heights of the bumps is no more than about 0.25. An interval between each of the bumps and an electrode of the substrate is no more than about 1.3 μm. Therefore, the size of each of the conductive particles is optimized so that a failure probability of the open circuit is decreased.
摘要:
An optical plate includes a plate body, a first lens pattern which is depressed on a first surface of the plate body, and a second lens pattern which is projected from a second surface of the plate body. The second lens pattern corresponds to the first lens pattern.
摘要:
A driver chip includes a base body, input terminals, first output terminals and dummy terminals. The base body includes a face having first to fourth edge portions. The first and second edge portions are disposed in substantially parallel along a longitudinal side of the face, and the third and fourth edge portions are disposed in substantially parallel along a horizontal side of the face. The input terminals are formed on the first edge portion such that the input terminals are arranged along the longitudinal side. The first output terminals are formed on the second edge portion such that the first output terminals are arranged along the longitudinal side. The dummy terminals are formed such that the dummy terminals are disposed between the input terminals and the first output terminals. A warpage and defects of electrical connection between the driver chip and a display panel of the display apparatus are prevented.
摘要:
A lens for reforming radiation from a light-emitting diode having a first convex surface for admitting radiation path from the light-emitting diode that is close to the axis of the diode and a cylindrical surface for admitting radiation that makes a wider angle with the axis of the diode, a conical surface disposed to receive and totally internally reflect radiation admitted by said convex surface and re-radiate it at an angle substantially normal to the axis of the diode and a curved surface for receiving and re-radiating at an angle substantially normal to the axis of the diode radiation admitted by the cylindrical surface.
摘要:
In a drive IC and a display device having the same, the drive IC includes a plurality of bumps disposed on a lower surface of the drive IC and aligned in a plurality of rows along an edge of the drive IC. The bumps aligned in different rows from each other are juxtaposed in a direction perpendicular to a direction in which the bumps are aligned. Accordingly, when the drive IC is mounted on a display panel using an anisotropic conductive film, the anisotropic conductive film may be smoothly flowed through a space defined by the bumps of the drive IC, thereby improving electric properties of the drive IC and display device.
摘要:
A light generating device includes a circuit board and a plurality of light source units. Each of the light source units includes a first light source group and a second light source group. The first light source group includes at least two light sources spaced apart from each other by a first distance and the second light source group including at least two light sources. Each of the light sources of the second light source group is spaced apart from a first virtual line segment connecting centers of the light sources of the first light source group by a second distance that is larger than the first distance. A second virtual line segment connecting centers of the light sources of the second light source group crosses the first virtual line segment. Therefore, a number of light sources is reduced to lower a cost of manufacturing the light generating device
摘要:
A cooling apparatus comprises a casing, a heat sink and a cooling fan. The casing comprises a first opening and a second opening to provide an air path. The heat sink is received in the casing. The heat sink includes a recession part. The cooling fan is disposed in the recession part.