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    Silicon nitride sintered body and method of producing the same
    52.
    发明授权
    Silicon nitride sintered body and method of producing the same 有权
    氮化硅烧结体及其制造方法

    公开(公告)号：US06391812B1

    公开(公告)日：2002-05-21

    申请号：US09579970

    申请日：2000-05-26

    Applicant: Kiyoshi Araki ,  Katsuhiro Inoue

    Inventor： Kiyoshi Araki ,  Katsuhiro Inoue

    IPC: C04B35587

    CPC classification number: C04B35/5935 ,  H01L23/15 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H01L2924/00

    Abstract: A method of producing the silicon nitride sintered body includes the steps of forming a compact of molding materials including silicon nitride powder, a Mg component and a sintering aid, and sintering the molding materials at 1,800 to 2,000° C. under a nitrogen atmosphere. The materials at least include an oxide of Mg in a range of 0.3 to 10 wt. %. A constant temperature is kept for at least 0.5 hours in a temperature range of 1,400 to 1,700° C. before the temperature is increased to the sintering temperature. A silicon nitride body having high thermal conductivity and excellent electrical insulation properties at high temperature can thus be provided.

    Abstract translation: 制造氮化硅烧结体的方法包括以下步骤：形成包含氮化硅粉末，Mg组分和烧结助剂的成型材料的压坯，并在氮气气氛下在1,800至2,000℃下烧结成型材料。 这些材料至少包括0.3至10重量％的Mg的氧化物。 ％。 在温度升至烧结温度之前，在1400〜1700℃的温度范围内将恒温保持至少0.5小时。 因此可以提供具有高导热性和高温下优异的电绝缘性能的氮化硅体。

    Conveyance system in a semiconductor manufacturing process and method for processing semiconductor wafer therein
    53.
    发明授权
    Conveyance system in a semiconductor manufacturing process and method for processing semiconductor wafer therein 失效
    半导体制造工艺中的输送系统及其中半导体晶片的处理方法

    公开(公告)号：US06298274B1

    公开(公告)日：2001-10-02

    申请号：US09388194

    申请日：1999-09-01

    Applicant: Katsuhiro Inoue

    Inventor： Katsuhiro Inoue

    IPC: G06F1900

    CPC classification number: H01L21/67276 ,  G05B19/4189 ,  G05B2219/31013 ,  Y02P90/28 ,  Y02P90/285

    Abstract: A conveyance system in a semiconductor manufacturing process comprises a process unit processing a semiconductor wafer, a conveyer conveying the semiconductor wafer, a conveyer controller controlling the conveyer, and a computer controlling the conveyer and the conveyer controller. In the system, the process unit sends a warning signal to said computer, indicating time of the process completion in the process unit before the process is completed, and the conveyer is moved to the process unit in response to the warning signal.

    Abstract translation: 半导体制造工艺中的输送系统包括处理半导体晶片的处理单元，输送半导体晶片的输送机，控制输送机的输送机控制器以及控制输送机和输送机控制器的计算机。 在系统中，处理单元向处理单元发送警告信号，指示在处理完成之前在处理单元中处理完成的时间，并且响应于警告信号将传送器移动到处理单元。

    Method of bonding a chip part to a substrate using solder bumps
    54.
    发明授权
    Method of bonding a chip part to a substrate using solder bumps 失效
    使用焊锡凸块将芯片部分接合到基板的方法

    公开(公告)号：US5984165A

    公开(公告)日：1999-11-16

    申请号：US873742

    申请日：1997-06-12

    Applicant: Katsuhiro Inoue ,  Nobuo Igusa ,  Takeshi Ohori

    Inventor： Katsuhiro Inoue ,  Nobuo Igusa ,  Takeshi Ohori

    IPC: H01L21/60 ,  B23K1/005 ,  B23K3/06 ,  H05K3/34 ,  B23K31/02 ,  H05B1/00 ,  A61M16/00

    CPC classification number: B23K1/0056 ,  B23K3/0623 ,  B23K2201/40 ,  H01L2224/75 ,  H01L2224/751 ,  H01L2224/75283 ,  H01L2224/755 ,  H01L2224/75744 ,  H05K3/3431

    Abstract: A method for bonding a chip part, having solder bumps on the underside thereof, to a base material. The method includes the steps of placing the chip part at a specific position on the base material, placing a weight on the chip part, the weight being based on the number of solder bumps mounted on the chip part and a surface tension of the solder bumps at melting, and irradiating, with an electromagnetic wave, an upper surface of the weight to transfer heat to the solder bumps through the weight and the chip, thereby melting the solder bumps and bonding the chip part to the base material.

    Abstract translation: 一种用于将其下侧具有焊料凸块的芯片部分接合到基材的方法。 该方法包括以下步骤：将芯片部分放置在基材上的特定位置，将重量放置在芯片部分上，其重量基于安装在芯片部分上的焊料凸块的数量和焊料凸块的表面张力 在熔化时，用电磁波照射重量的上表面，通过重物和芯片将热量传递给焊料凸块，由此熔化焊料凸块并将芯片部分粘合到基材上。

    System test apparatus for verifying operability
    55.
    发明授权
    System test apparatus for verifying operability 失效
    用于验证可操作性的系统测试装置

    公开(公告)号：US5161115A

    公开(公告)日：1992-11-03

    申请号：US543371

    申请日：1990-06-26

    Applicant: Fumiaki Teshima ,  Katsuhiro Inoue ,  Kaoru Kurebayashi ,  Yukihiro Mihara ,  Takuya Kishimoto

    Inventor： Fumiaki Teshima ,  Katsuhiro Inoue ,  Kaoru Kurebayashi ,  Yukihiro Mihara ,  Takuya Kishimoto

    IPC: G05B23/02 ,  G06F17/50

    CPC classification number: G06F17/504 ,  G05B23/0248

    Abstract: A system test apparatus for verifying whether or not a tested system works according to particular specifications is disclosed. The system test apparatus comprises a storage device for storing the particular specifications as a finite state machine model including elements represented with time sections which may take place, a detecting device for periodically detecting operation information which represents an operation of the tested system as a combination of events and actions represented with the time sections which may take place and a verification device for comparing the operation information with the particular specifications stored in the storage device according to the finite state machine model. In the above finite state machine model, events, actions, and the like are represented with time sections which may take place.

    Abstract translation: 公开了一种用于验证被测系统是否根据特定规格工作的系统测试装置。 该系统测试装置包括存储装置，用于将特定规格存储为包括可能发生的时间段表示的元件的有限状态机模型，用于周期性地检测表示被测系统的操作的操作信息的检测装置， 用可能发生的时间段表示的事件和动作，以及用于根据有限状态机模型将存储在存储装置中的操作信息与特定规格进行比较的验证装置。 在上述有限状态机模型中，事件，动作等以可能发生的时间段表示。

    Communication apparatus and control method thereof
    56.
    发明授权
    Communication apparatus and control method thereof 有权
    通信装置及其控制方法

    公开(公告)号：US09497352B2

    公开(公告)日：2016-11-15

    申请号：US12404234

    申请日：2009-03-13

    Applicant: Yutaka Inoue ,  Katsuhiro Inoue

    Inventor： Yutaka Inoue ,  Katsuhiro Inoue

    IPC: G06F3/12 ,  H04N1/333 ,  H04N1/327

    CPC classification number: H04N1/333 ,  H04N1/32797 ,  H04N1/33353 ,  H04N1/33361

    Abstract: This invention provides a communication apparatus, which designates, when a line designated as that used for a specific application falls into a disabled state, another line as a new line used for the specific application. To accomplish this, even when at least one of a plurality of lines falls into a disabled state, and when the line in the disabled state is designated as a line used for the specific application, the communication apparatus designates a line other than the line in the disabled state among the plurality of lines as a new line used for the specific application.

    Abstract translation: 本发明提供一种通信装置，当指定为特定应用的线路被指定为禁用状态时，指定另一条线作为用于特定应用的新线。 为了实现这一点，即使当多条线路中的至少一条线路处于禁用状态时，并且当处于禁用状态的线路被指定为用于特定应用的线路时，通信设备指定除了线路之外的线路 作为用于特定应用的新行的多行中的禁用状态。

    Image processing apparatus, information processing apparatus, and storage medium
    57.
    发明授权
    Image processing apparatus, information processing apparatus, and storage medium 失效
    图像处理装置，信息处理装置和存储介质

    公开(公告)号：US08743427B2

    公开(公告)日：2014-06-03

    申请号：US12606385

    申请日：2009-10-27

    Applicant: Katsuhiro Inoue

    Inventor： Katsuhiro Inoue

    IPC: H04N1/32 ,  H04N1/00

    CPC classification number: H04N1/00204 ,  G06F3/1205 ,  G06F3/1232 ,  G06F3/1254 ,  G06F3/1288 ,  H04N1/4433

    Abstract: An image processing apparatus includes a receiving unit configured to receive a job ticket from an information processing apparatus, a determination unit configured to determine whether it is permitted for a user to use an extended function not included in functions described in function information defined in the job ticket received by the receiving unit, and a control unit configured, if it is determined by the determination unit that it is permitted for the user to use the extended function, to permit execution of processing on image data that uses a function described in the function information defined in the job ticket received by the receiving unit and execution of processing that uses the extended function.

    Abstract translation: 一种图像处理设备，包括：接收单元，被配置为从信息处理设备接收作业传票;确定单元，被配置为确定是否允许用户使用不包括在功能信息中定义的功能中描述的功能的扩展功能 由接收单元接收的票;以及控制单元，如果由确定单元确定允许用户使用扩展功能，则配置为允许对使用功能中描述的功能的图像数据执行处理 由接收单元接收的作业单中定义的信息和使用扩展功能的处理的执行。

    OPTICAL APPARATUS
    59.
    发明申请
    OPTICAL APPARATUS 有权
    光学装置

    公开(公告)号：US20080129830A1

    公开(公告)日：2008-06-05

    申请号：US11938502

    申请日：2007-11-12

    Applicant: Katsuhiro Inoue ,  Masanori Ishikawa ,  Jun Sugita ,  Hiroshi Akada ,  Sawako Ito

    Inventor： Katsuhiro Inoue ,  Masanori Ishikawa ,  Jun Sugita ,  Hiroshi Akada ,  Sawako Ito

    IPC: H04N5/228

    CPC classification number: G03B5/00

    Abstract: The invention relates to an optical apparatus having a vibration detector that detects vibration, a holding member that holds an image stabilizing optical system, an elastic member that elastically supports the holding member so that the holding member can shift within a plane perpendicular to an optical axis, a drive unit that generates a drive force resisting against an elastic force of the elastic member, a drive circuit that drives the drive unit, a control circuit that controls the position of the holding member, a temperature sensor that measures temperature, and a viscous damper that damps movement of the holding member in the drive direction. The control circuit changes the image stabilizing drive control characteristic of the drive circuit to compensate for changes in viscosity of the viscous damper with temperature.

    Abstract translation: 本发明涉及一种具有检测振动的振动检测器，保持图像稳定光学系统的保持构件的光学装置，弹性地支撑保持构件的弹性构件，使得保持构件能够在垂直于光轴的平面内移动 ，驱动单元，其产生抵抗弹性构件的弹力的驱动力，驱动驱动单元的驱动电路，控制保持构件的位置的控制电路，测量温度的温度传感器和粘性 阻尼器阻止保持构件在驱动方向上的移动。 控制电路改变驱动电路的图像稳定驱动控制特性，以补偿粘滞阻尼器随着温度变化的粘度。

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