Abstract:
A knuckle is minimized in size to be located in an internal space of a rear wheel. An upper arm is disposed lower than a conventional double wishbone type and one end of the upper arm is secured to the knuckle. A shock absorber couples at a lower end thereof to the knuckle by passing through a space between a lower arm and assist arm. This configuration thus constructed greatly increases the space of the trunk room, reduces noise by minimizing the transmission of road impact and vibration, and improves ride comfort as well as braking stability and turn stability.
Abstract:
A temperature controller for a semiconductor-fabricating tool includes a Peltier element disposed on an outer wall of the semiconductor-fabricating tool, and a battery for providing a current to the Peltier element. The Peltier element a heat-emitting plate for emitting heat by the current provided thereto, and a heat-absorbing plate for absorbing a heat. A first temperature sensor senses a temperature of the Peltier element. A second temperature sensor senses an interior temperature of the semiconductor-fabricating tool. A controller controls an amount of the current provided to the Peltier element in accordance with a temperature of the Peltier element sensed by the first temperature sensor and an interior temperature of the semiconductor-fabricating tool sensed by the second temperature sensor.
Abstract:
In accordance with the present invention, there is provided a semiconductor package which includes a generally planar die paddle defining multiple peripheral edge segments and including at least two slots formed therein and extending along respective ones of a pair of the peripheral edge segments thereof. The semiconductor package further comprises a plurality of first leads which are segregated into at least two sets disposed within respective ones of the slots included in the die paddle. In addition to the first leads, the semiconductor package includes a plurality of second leads which are also segregated into at least two sets extending along respective ones of at least two peripheral edge segments of the die paddle in spaced relation thereto. Electrically connected to the top surface of the die paddle is at least one semiconductor die which is electrically connected to at least some of each of the first and second leads. At least portions of the die paddle, the first and second leads, and the semiconductor die are encapsulated by a package body, the bottom surfaces of the die paddle and the first leads being exposed in a common exterior surface of the package body.
Abstract:
A liquid crystal display device includes a first substrate including a plurality of data bus lines, a plurality of gate bus lines, and a plurality of thin film transistors at cross points of the plurality gate bus lines and the plurality of gate bus lines; a second substrate including a color filter layer; at least one shielding layer for shielding an outer induced electric field; and a liquid crystal layer sandwiched between the first substrate and the second substrate.
Abstract:
A rapid prototyping process and apparatus that provides an intermittent material feed type variable-lamination rapid prototyping using a linear thermal cutting system, wherein intermittently fed materials are cut to have variable lengths, widths, and lateral gradients with the 4-axis control-type linear thermal cutting system controlled by a computer, and based on cutting operation data generated in the computer.
Abstract:
Disclosed herein is a variable lamination manufacturing process and apparatus. The method comprises the step of coating strip-shaped material with an adhesive while the strip-shaped material is fed. Thereafter, the strip-shaped material being fed is cut into material pieces of a variable width, variable inclinations and a variable length in accordance with the three-dimensional computer aided design data of a three-dimensional product using a linear heat source. The cut material pieces are stacked on a moving table to be positioned in the corresponding positions of the three-dimensional product. Finally, the stacked cut material pieces are pushed to bond one piece to anther.
Abstract:
A positive resist composition which gives improved profile without lowering other properties such as sensitivity and resolution, and comprises an alkali-soluble novolak resin, a quinone diazide type radiation-sensitive agent and N-(n-octylsulfonyloxy)succinimide
Abstract:
A semiconductor memory device having a ground noise isolation circuit which prevents the influence of noise which occurs due to ground bouncing which causes erroneous data reading of a memory cell. The ground noise isolation circuit generates a pulse signal having a predetermined width in accordance with a chip enable signal for controlling the output of a data output unit when the data output unit outputs data and by disconnecting a sense amplifier driving transistor during the generation of the pulse signal.
Abstract:
The amorphous perovskite structure catalysts according to the present invention comprise a carrier material and a mixture of at least two metal oxides supported thereon, which have the following formula: (M.sup.1.sub.a O.sub.x.M.sup.2.sub.1-a O.sub.y)(M.sup.3.sub.b O.sub.z.M.sup.4.sub.1-b O.sub.w)/S wherein M.sup.1 and M.sup.2 independently of each other are selected from the group consisting of the lanthanide metals, the alkali metals and the alkaline earth metals, M.sup.3 and M.sup.4 independently of each other are selected from the group consisting of the transition metals and the platinum metals, a and b are from 0 to 1, x, y, z and w are determined stoichiometrically on the values of a and b, the ratio of �M.sup.1 +M.sup.2 ! to �M.sup.3 +M.sup.4 ! is 0.1.about.3.0:1.0, and S is a carrier material. The process for preparing the amorphous perovskite structure catalysts comprises dissolving completely at least two salt solutions of metals, M.sup.1, M.sup.2, M.sup.3 and M.sup.4, and an acid in an organic acid, preparing an ester type resin intermediate by adding a hydroxy alcohol to the solution, mixing the solution in a liquid state by adding a powder type carrier material, distilling the mixed solution under a reduced pressure so as to concentrate the solution into a high viscous state, drying the concentrated solution using a microwave into a gel type catalyst precursor, and calcining the precursor stepwise at the temperatures of 300.degree..about.700.degree. C. The process can provide amorphous perovskite structure catalysts having a high specific surface area and a good dispersion for denitrizing nitrogen oxides.
Abstract:
Provided is a cage to be inserted into vertebrae. The cage configured to reduce a risk of organs, muscles, and nerves being injured during an insertion surgery process and to allow the insertion surgery process to be easily performed. To this end, the present invention provides a cage including a leading insertion portion which is inserted from the front of vertebrae to be in position between the vertebrae and a following insertion portion which is coupled to one surface of the leading insertion portion to be in position between the vertebrae. According to the present invention, there are effects of reducing a risk of organs, muscles, and nerves being injured during a surgery process of inserting the cage, facilitating the surgery process of inserting the cage, reducing post-surgery side effects by stably fixing the cage, and reducing a surgery time to reduce a burden to a patient.