摘要:
An LED chip package structure includes a ceramic substrate, a conductive unit, a hollow ceramic casing, many LED chips, and a package colloid. The ceramic substrate has a main body, many protrusions extended from the main body, many penetrating holes respectively penetrating through the protrusions, and many half through holes formed on a lateral side of the main body and respectively formed between each two protrusions. The conductive unit has many first conductive layers respectively formed on the protrusions, many second conductive layers respectively formed on inner surfaces of the half through holes and a bottom face of the main body, and many third conductive layers respectively filled in the penetrating holes. The hollow ceramic casing is fixed on the main body to form a receiving space. The LED chips is received in the receiving space. The package colloid is filled in the receiving space for covering the LED chips.
摘要:
An optical object distance simulation device is disclosed. The device has an optical lens module composed of a plurality of optical lens and the optical lens module is arranged between an optical lens and a chart for simulating the real object distance and reducing the space required for testing an optical lens. Moreover, the optical lens module is separated from a light-emitting element, a power supply or any heat-generating elements all separated from the optical lens module. Furthermore, the heat-dissipating elements are arranged near elements that generate substantial heat. Hence, not only does the present invention have a good heat-dissipating effect, but it also prevents external dust from polluting the optical lens module because of the positioning of the heat-dissipating element and the heat-dissipating hole.
摘要:
An LED chip package structure includes a substrate unit, a light-emitting unit, and a colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace is respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body for generating light, wherein each of the LED chips has a positive side and a negative side respectively electrically connected with the positive electrode trace and the negative electrode trace. The colloid unit is covered over the substrate unit and the light-emitting unit for guiding the light from the light-emitting unit to form a series of light-generating areas on the colloid unit.
摘要:
A modular illumination device with adjustable illumination modules includes a substrate, a rotating element, a reflective element, an adjustable element, and a light-emitting element. The rotating element is rotatably disposed on the substrate and rotates corresponding to the substrate. The reflective element pivots on the rotating element and pivots corresponding to the substrate. The adjustable element is moveably disposed on the substrate and is moved corresponding to the reflective element. The light-emitting element is disposed on the adjustable element. The modular illumination device can be adjusted to shine light at any angle or in any direction. Furthermore, a plurality of illumination modules are combined to form the modular illumination device. By adjusting the lighting range and direction of the illumination modules respectively, the illumination device has different illumination ranges.
摘要:
An optical object distance simulation device is disclosed. The device has an optical lens module composed of a plurality of optical lens and the optical lens module is arranged between an optical lens and a chart for simulating the real object distance and reducing the space required for testing an optical lens. Moreover, the optical lens module is separated from a light-emitting element, a power supply or any heat-generating elements all separated from the optical lens module. Furthermore, the heat-dissipating elements are arranged near elements that generate substantial heat. Hence, not only does the present invention have a good heat-dissipating effect, but it also prevents external dust from polluting the optical lens module because of the positioning of the heat-dissipating element and the heat-dissipating hole.
摘要:
A package for an LED, comprises a metal substrate, at least one LED chip, and an insulative housing, wherein the metal substrate has a first terminal and a second terminal, and the first terminal is formed with a recess. The at least one LED chip is arranged in the recess of the first terminal of the metal substrate, wherein the chip is electrically connected with the first terminal and the second terminal of the metal substrate. Since the insulative housing caps the chip and the metal substrate, and the LED package can be reduced in size.
摘要:
A vital sign sending method and a sending apparatus thereof is disclosed. The vital sign sending method includes the following steps. A user wears the vital sign sending apparatus. The vital sign sending apparatus includes a positioning module fitting with a satellite positioning system, a sending module that can transmit information via a wireless communication system, and a sensing module that contacts the user's body and monitors the vital signs of the user. Then, the vital sign sending apparatus monitors and obtains the vital signs over a fixed period and software is adopted to judge whether the vital signs of the user are abnormal or not. When the vital signs of the user are abnormal, the vital sign sending apparatus forcibly generates a sending function for informing a target person, and information regarding the location and vital signs of the user are transmitted to the target person.
摘要:
An electrical lamp apparatus includes a shade, a light-emitting unit and a light-focusing unit. After a power plug on the shade is connected to a power socket of the electrical lamp apparatus, the power plug supplies electrical power to light the light-emitting unit. The light from the light-emitting unit passes to a convex lens through a second channel of a second end face of the light-focusing unit, and then the light is projected through a first channel of the first end face of the light-focusing unit, whereby the light can be projected to a farther place.
摘要:
Multiple LED matrix array circuit boards are pieced together a form a display panel. L-shape brackets are mounted on the bottom sides of the circuit boards and aligned with the butting edges of the circuit boards. The vertical butting walls are pressed together by clamps. A set screw is inserted in one jaw of the clamp to tighten the pressure between butting edges of the circuit boards. Another set screw is inserted on top of the clamp to align the adjacent boards vertically.
摘要:
A circuit for driving a light-emitting diode (LED) display has multiple driving modes. The circuit has a control unit for outputting a mode-switching signal, a scan driving chip connecting with the control unit for providing a scan signal, a data driving chip connecting with the control unit and the scan driving chip for providing a data signal, a row control interface connecting with the row line, the control unit, the scan driving chip and the data driving chip to receive the mode-switching signal for switching an input end of the row control interface, and a column control interface connecting with the column line, the control unit, the scan driving chip and the data driving chip to receive the mode-switching signal for switching an input end of the column control interface.