公开(公告)号：US20080246397A1

公开(公告)日：2008-10-09

申请号：US11696220

申请日：2007-04-04

申请人： Bily Wang ,  Jonnie Chuang ,  Chia-Hung Chen

发明人： Bily Wang ,  Jonnie Chuang ,  Chia-Hung Chen

IPC分类号： H01J99/00 ,  H01J9/26

CPC分类号： H01L33/505 ,  H01L33/486 ,  H01L33/507 ,  H01L33/52 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A manufacturing method of white light LED and a structure thereof include first, a substrate being prepared to be formed as a consecutively connected holder, on a first electrode of which non-conductive fluorescent glue is coated to form a fluorescent layer, on which a blue light chip is fixed; second, two conducting wires being welded onto the chip and electrically connected to both the first electrode and the second electrode of the holder respectively, finally, glue body encapsulating the holder, the fluorescent layer, the chip, and the two conducting wires to form a photic zone, over which a frame body encloses; furthermore, a window being formed on the frame body and provided for making the photic zone exposed. When blue light chip is excited to generate blue light, which will further excite the fluorescent layer to emit yellow light, then both blue light and yellow light will be dispersed through the photic zone to generate a uniform light source, which may output light longitudinally and collectively, making the output power promoted notably and the lightness enhanced significantly.

摘要翻译： 白光LED的制造方法及其结构首先在准备形成为连续保持器的基板上，在其上涂布非导电荧光胶的第一电极上形成荧光层，蓝色 光芯片固定; 第二，将两根导线焊接在芯片上，分别与保持器的第一电极和第二电极两者电连接，最后将胶体封装在保持器，荧光层，芯片和两根导线上，形成 一个框架主体围绕着它; 此外，窗框形成在框架体上并被设置用于使光区暴露。 当蓝光芯片被激发以产生蓝光，这将进一步激发荧光层发出黄光，则蓝光和黄光将通过光区分散以产生均匀的光源，其可以纵向输出光， 共同推动输出功率显着提升，亮度明显增强。

公开(公告)号：US08003413B2

公开(公告)日：2011-08-23

申请号：US12314168

申请日：2008-12-05

申请人： Bily Wang ,  Jonnie Chuang ,  Chia-Hung Chen

发明人： Bily Wang ,  Jonnie Chuang ,  Chia-Hung Chen

IPC分类号： H01L21/00

CPC分类号： H01L33/483 ,  H01L33/62 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/09701 ,  H01L2924/00014

摘要： An LED chip package structure includes a ceramic substrate, a conductive unit, a hollow ceramic casing, many LED chips, and a package colloid. The ceramic substrate has a main body, many protrusions extended from the main body, many penetrating holes respectively penetrating through the protrusions, and many half through holes formed on a lateral side of the main body and respectively formed between each two protrusions. The conductive unit has many first conductive layers respectively formed on the protrusions, many second conductive layers respectively formed on inner surfaces of the half through holes and a bottom face of the main body, and many third conductive layers respectively filled in the penetrating holes. The hollow ceramic casing is fixed on the main body to form a receiving space. The LED chips is received in the receiving space. The package colloid is filled in the receiving space for covering the LED chips.

摘要翻译： LED芯片封装结构包括陶瓷基板，导电单元，中空陶瓷外壳，许多LED芯片和封装胶体。 陶瓷基板具有主体，从主体延伸的许多突起，分别穿过突起的许多穿透孔和形成在主体的侧面上并分别形成在每个两个突起之间的许多半通孔。 导电单元具有分别形成在突起上的许多第一导电层，分别形成在半通孔的内表面上的许多第二导电层和主体的底面，以及分别填充在穿透孔中的许多第三导电层。 中空陶瓷壳体固定在主体上以形成容纳空间。 LED芯片被接收在接收空间中。 包装胶体填充在用于覆盖LED芯片的接收空间中。

公开(公告)号：US07671373B2

公开(公告)日：2010-03-02

申请号：US11976478

申请日：2007-10-25

申请人： Bily Wang ,  Jonnie Chuang ,  Chia-Hung Chen

发明人： Bily Wang ,  Jonnie Chuang ,  Chia-Hung Chen

IPC分类号： H01L29/267 ,  H01L21/15 ,  H01L29/26 ,  H01L31/12 ,  H01L29/16 ,  H01L29/18 ,  H01L29/22 ,  H01L29/24 ,  H01L25/16

CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/09701 ,  H01L2924/00014

摘要： An LED chip package structure using a ceramic material as a substrate includes a ceramic substrate, a conductive unit, a hollow ceramic casing, a plurality of LED chips, and a package colloid. The ceramic substrate has a main body, and a plurality of protrusions extended from three faces of the main body. The conductive unit has a plurality of conductive layers formed on the protrusions, respectively. The hollow casing is fixed on a top face of the main body to form a receiving space for exposing a top face of each conductive layer. The LED chips are received in the receiving space, and each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected to different conductive layers. In addition, the packaging colloid is filled into the receiving space for covering the LED chips.

摘要翻译： 使用陶瓷材料作为基板的LED芯片封装结构包括陶瓷基板，导电单元，中空陶瓷外壳，多个LED芯片和封装胶体。 陶瓷基板具有主体和从主体的三个面延伸的多个突起。 导电单元具有分别形成在突起上的多个导电层。 中空壳体固定在主体的顶面上，以形成用于暴露每个导电层顶面的容纳空间。 LED芯片被接收在接收空间中，并且每个LED芯片分别具有正极侧和负极侧，并且电连接到不同的导电层。 此外，将包装胶体填充到用于覆盖LED芯片的接收空间中。

公开(公告)号：US07741648B2

公开(公告)日：2010-06-22

申请号：US11976340

申请日：2007-10-24

申请人： Bily Wang ,  Jonnie Chuang ,  Chia-Hung Chen

发明人： Bily Wang ,  Jonnie Chuang ,  Chia-Hung Chen

IPC分类号： H01L29/18

CPC分类号： H01L33/483 ,  H01L33/62 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/09701 ,  H01L2924/00014

摘要： An LED chip package structure includes a ceramic substrate, a conductive unit, a hollow ceramic casing, many LED chips, and a package colloid. The ceramic substrate has a main body, many protrusions extended from the main body, many penetrating holes respectively penetrating through the protrusions, and many half through holes formed on a lateral side of the main body and respectively formed between each two protrusions. The conductive unit has many first conductive layers respectively formed on the protrusions, many second conductive layers respectively formed on inner surfaces of the half through holes and a bottom face of the main body, and many third conductive layers respectively filled in the penetrating holes. The hollow ceramic casing is fixed on the main body to form a receiving space. The LED chips is received in the receiving space. The package colloid is filled in the receiving space for covering the LED chips.

摘要翻译： LED芯片封装结构包括陶瓷基板，导电单元，中空陶瓷外壳，许多LED芯片和封装胶体。 陶瓷基板具有主体，从主体延伸的许多突起，分别穿过突起的许多穿透孔和形成在主体的侧面上并分别形成在每个两个突起之间的许多半通孔。 导电单元具有分别形成在突起上的许多第一导电层，分别形成在半通孔的内表面上的许多第二导电层和主体的底面，以及分别填充在穿透孔中的许多第三导电层。 中空陶瓷壳体固定在主体上以形成容纳空间。 LED芯片被接收在接收空间中。 包装胶体填充在用于覆盖LED芯片的接收空间中。

公开(公告)号：US20090008656A1

公开(公告)日：2009-01-08

申请号：US11976340

申请日：2007-10-24

申请人： Bily Wang ,  Jonnie Chuang ,  Chia-Hung Chen

发明人： Bily Wang ,  Jonnie Chuang ,  Chia-Hung Chen

IPC分类号： H01L33/00

CPC分类号： H01L33/483 ,  H01L33/62 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/09701 ,  H01L2924/00014

摘要： An LED chip package structure includes a ceramic substrate, a conductive unit, a hollow ceramic casing, many LED chips, and a package colloid. The ceramic substrate has a main body, many protrusions extended from the main body, many penetrating holes respectively penetrating through the protrusions, and many half through holes formed on a lateral side of the main body and respectively formed between each two protrusions. The conductive unit has many first conductive layers respectively formed on the protrusions, many second conductive layers respectively formed on inner surfaces of the half through holes and a bottom face of the main body, and many third conductive layers respectively filled in the penetrating holes. The hollow ceramic casing is fixed on the main body to form a receiving space. The LED chips is received in the receiving space. The package colloid is filled in the receiving space for covering the LED chips.

公开(公告)号：US20090124032A1

公开(公告)日：2009-05-14

申请号：US12314168

申请日：2008-12-05

申请人： Bily Wang ,  Jonnie Chuang ,  Chia-Hung Chen

发明人： Bily Wang ,  Jonnie Chuang ,  Chia-Hung Chen

IPC分类号： H01L21/50

CPC分类号： H01L33/483 ,  H01L33/62 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/09701 ,  H01L2924/00014

摘要： An LED chip package structure includes a ceramic substrate, a conductive unit, a hollow ceramic casing, many LED chips, and a package colloid. The ceramic substrate has a main body, many protrusions extended from the main body, many penetrating holes respectively penetrating through the protrusions, and many half through holes formed on a lateral side of the main body and respectively formed between each two protrusions. The conductive unit has many first conductive layers respectively formed on the protrusions, many second conductive layers respectively formed on inner surfaces of the half through holes and a bottom face of the main body, and many third conductive layers respectively filled in the penetrating holes. The hollow ceramic casing is fixed on the main body to form a receiving space. The LED chips is received in the receiving space. The package colloid is filled in the receiving space for covering the LED chips.

摘要翻译： LED芯片封装结构包括陶瓷基板，导电单元，中空陶瓷外壳，许多LED芯片和封装胶体。 陶瓷基板具有主体，从主体延伸的许多突起，分别穿过突起的许多穿透孔和形成在主体的侧面上并分别形成在每个两个突起之间的许多半通孔。 导电单元具有分别形成在突起上的许多第一导电层，分别形成在半通孔的内表面上的许多第二导电层和主体的底面，以及分别填充在穿透孔中的许多第三导电层。 中空陶瓷壳体固定在主体上以形成容纳空间。 LED芯片被接收在接收空间中。 包装胶体填充在用于覆盖LED芯片的接收空间中。

公开(公告)号：US20080246185A1

公开(公告)日：2008-10-09

申请号：US11696216

申请日：2007-04-04

申请人： Bily Wang ,  Jonnie Chuang ,  Chia-Hung Chen

发明人： Bily Wang ,  Jonnie Chuang ,  Chia-Hung Chen

IPC分类号： C08L63/00 ,  C08K3/08

CPC分类号： H01L33/60 ,  C08K3/08 ,  C08K5/0041 ,  H01L33/486 ,  H01L33/505 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2933/0041 ,  H01L2924/00014 ,  H01L2924/00

摘要： A lamp body is an enclosing structure that encloses a blue light-emitting crystal to form a LED structure. In a method of manufacturing frame body of the LED, resin, titanium, and fluorescent powder are mixed uniformly to constitute a composition of frame body, then the composing materials being placed into a mould for processing a thermally pressing procedure to thus form a frame body. By the blue light emitted from the blue light-emitting crystal, the fluorescent powder of the frame body may be excited to emit uniform yellow light, which may be further mixed with the blue light to become white light.

摘要翻译： 灯体是包围蓝色发光晶体以形成LED结构的封闭结构。 在制造LED框架体的方法中，将树脂，钛和荧光粉均匀地混合以构成框体的组成，然后将构成材料放入用于加工热压程序的模具中，从而形成框架体 。 通过从蓝色发光晶体发出的蓝色光，可以激励框架体的荧光粉发出均匀的黄光，这可以进一步与蓝光混合成白光。

公开(公告)号：US20080173881A1

公开(公告)日：2008-07-24

申请号：US11976478

申请日：2007-10-25

申请人： Bily Wang ,  Jonnie Chuang ,  Chia-Hung Chen

发明人： Bily Wang ,  Jonnie Chuang ,  Chia-Hung Chen

IPC分类号： H01L29/78

CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/09701 ,  H01L2924/00014

摘要： An LED chip package structure using a ceramic material as a substrate includes a ceramic substrate, a conductive unit, a hollow ceramic casing, a plurality of LED chips, and a package colloid. The ceramic substrate has a main body, and a plurality of protrusions extended from three faces of the main body. The conductive unit has a plurality of conductive layers formed on the protrusions, respectively. The hollow casing is fixed on a top face of the main body to form a receiving space for exposing a top face of each conductive layer. The LED chips are received in the receiving space, and each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected to different conductive layers. In addition, the packaging colloid is filled into the receiving space for covering the LED chips.

摘要翻译： 使用陶瓷材料作为基板的LED芯片封装结构包括陶瓷基板，导电单元，中空陶瓷外壳，多个LED芯片和封装胶体。 陶瓷基板具有主体和从主体的三个面延伸的多个突起。 导电单元具有分别形成在突起上的多个导电层。 中空壳体固定在主体的顶面上，以形成用于暴露每个导电层顶面的容纳空间。 LED芯片被接收在接收空间中，并且每个LED芯片分别具有正极侧和负极侧，并且电连接到不同的导电层。 此外，将包装胶体填充到用于覆盖LED芯片的接收空间中。

公开(公告)号：US07803641B2

公开(公告)日：2010-09-28

申请号：US11854066

申请日：2007-09-12

申请人： Bily Wang ,  Jonnie Chuang ,  Hui-Yen Huang

发明人： Bily Wang ,  Jonnie Chuang ,  Hui-Yen Huang

IPC分类号： H01L21/66 ,  H01L21/00

CPC分类号： H01L21/565 ,  H01L21/561 ,  H01L2224/97 ,  H01L2224/85

摘要： A mold structure for packaging LED chips includes a top mold and a bottom mold. The bottom mold is mated with the top mold. The bottom mold has a main flow channel, a plurality of receiving spaces formed beside the main flow channel, a plurality of secondary flow channels for respectively and transversely communicating the receiving spaces with each other, and a plurality of ejection pins penetrating through the bottom mold.

摘要翻译： 用于封装LED芯片的模具结构包括顶模和底模。 底模与上模相配。 底模具有主流道，在主流路旁边形成有多个接收空间，分别形成多个用于使接收空间相互横向连通的二次流动通道，以及贯穿底模的多个排出销 。

公开(公告)号：US07701124B2

公开(公告)日：2010-04-20

申请号：US11711840

申请日：2007-02-28

申请人： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin ,  Chih Shan Yu

发明人： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin ,  Chih Shan Yu

IPC分类号： H01J61/02 ,  H01J29/06

CPC分类号： C09K11/7731 ,  C09K11/7734 ,  H01J1/62 ,  H01L33/502 ,  H01L33/504 ,  H01L2224/48091 ,  Y02B20/181 ,  H01L2924/00014

摘要： A white light source has a substrate with a blue light-emitting diode placed thereon and a cap layer enclosing the blue light-emitting diode. The cap layer includes a mixture of silicon and phosphor blend at ratio of 1:0.2-0.5. The phosphor blend includes a red phosphor, a green phosphor and a yellow phosphor.

摘要翻译： 白光源具有放置在其上的蓝色发光二极管的基板和包围蓝色发光二极管的盖层。 盖层包括硅和磷掺合物的混合物，其比例为1:0.2-0.5。 荧光体掺合物包括红色荧光体，绿色荧光体和黄色荧光体。