摘要:
An illumination system including a light source, a light guide including an output surface, emissive material positioned to receive light from the output surface of the light guide, and a first interference reflector positioned between the output surface of the light guide and the emissive material is disclosed. The light source emits light having a first optical characteristic. The emissive material emits light having a second optical characteristic when illuminated with light having the first optical characteristic. The first interference reflector substantially transmits light having the first optical characteristic and substantially reflects light having the second optical characteristic.
摘要:
An electronic device can include a top side with circuit structures. The circuit structures form the bottom region of a cavity. Each cavity can be surrounded by a cavity frame made of plastic and can have a cavity cover made of semiconductor material.
摘要:
The invention relates to the technical field of data communication in a network of distributed stations, particularly in a home network. A home network of this type allows AV data streams to be transmitted between network subscriber stations. The aim of the invention is to assist the user of a network of this type when he wishes to start a recording procedure for the audio and/or video data. In line with the invention, a data connection is automatically set up between that data source appliance which has already set up a connection to a data sink appliance or to a user interface appliance and the recording appliance. The automatic set-up of a data connection takes place directly after the user interface for the recording appliance has been called up. Alternatively, the automatic set-up of a data connection may take place only specifically after selection of the recording function on the recording appliance. The measure assists the implementation of an instant-recording function on the recording appliance in the network.
摘要:
An infrared light reflecting article is disclosed and includes a visible light transparent substrate including a polymer and an infrared light reflecting cholesteric liquid crystal layer disposed on the substrate. The substrate and infrared light reflecting cholesteric liquid crystal layer have a combined haze value of less than 3%.
摘要:
A semiconductor component and a method for its production in semiconductor chip size, can have a semiconductor chip, which has external contacts of the semiconductor component that are arranged in the manner of a flip-chip on its active upper side. The semiconductor chip can be encapsulated by a plastic compound at least on its rear side and its side edges. The outer contacts, which can be arranged on external contact connecting areas, can project from the active upper side.
摘要:
A saw, such as a chop saw, a miter saw, a sliding saw, a compound miter saw, etc. In some constructions, the saw may include a miter adjustment assembly including a coarse adjustment assembly and a fine adjustment assembly. In some constructions, the saw may include a bevel adjustment assembly including a brake mechanism and a bevel detent assembly. In some constructions, the saw may include a dust collection assembly including a dust chute defining a dust both around the bevel arm. In some constructions, the saw may include a table having a top wall with a peripheral rim and a side wall depending from the top wall, and a base defining an opening in which the side wall is received and a ledge above which the rim is positioned. In some constructions, the saw may include elastomeric material covering a portion of the base, such as a bottom surface, a lateral surface, a grip surface, etc.
摘要:
A visible light transmissive card includes a security indicia that fluoresces under UV light. The card also includes at least one IR filter. The IR filter and/or another card layer that is substantially coextensive with a front card surface includes a component that also fluoresces under UV light. A UV blocking material is disposed between the security indicia and the UV-excitable component of the IR filter or other layer, so that the security indicia is clearly visible when the card is exposed to UV light. In some embodiments the UV blocking material is patterned to define (in combination with the fluorescing IR filter or another coextensive card layer) a secondary security indicia, which may be used in addition to or in place of the original security indicia. IR filter laminates used in the construction of such cards are also disclosed.
摘要:
A multilayer film article is disclosed. The multilayer film article includes an infrared light reflecting multilayer film having alternating layers of a first polymer type and a second polymer type, an infrared light absorbing nanoparticle layer including a plurality of metal oxide nanoparticles dispersed in a cured polymeric binder and having a thickness in a range from 1 to 20 micrometers. The nanoparticle layer being disposed adjacent the multilayer film. The metal oxide nanoparticles include tin oxide or doped tin oxide.
摘要:
A rotary hammer and a power tool. The rotary hammer is operable in an idle mode and a hammer mode and comprises a housing and a barrel positioned in the housing and having a forward portion. A ram is positioned within the barrel and is movable relative to the barrel between hammering positions and an idle position. In some aspects, a ram catcher assembly is positioned along the axis adjacent the forward portion of the barrel to releasably hold the ram in the idle position. The ram catcher assembly includes a friction member frictionally engageable with the ram and a damping member at least partially surrounding the friction member. As the ram moves to the idle position with a force, the damping member absorbs at least a portion of the force and the member applies friction to the ram.
摘要:
A method for manufacturing a chip housing includes a first basis having a photolithograpically structurable layer on a main face, structured into a cover. A chip has the structure at a main face between first contact elements. A second photolithograpically structurable layer applied to the main face is structured forming a recess surrounded by a wall near the structure exposing the first contact elements. Then, the first basis and the chip are merged with the structure and the cover facing and aligned with each other, and the recess closed by the cover. Removing the first basis leads to an on-chip cavity. Afterwards, a second basis and the chip are merged with the first contact elements connected to the second basis via a conductive structure. Afterwards, the second basis is removed for exposing the conductive structure. The method is less subject to cost and size limitations of known housing technologies.