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170 条记录 (耗时 0.039 秒)

    Packaging chip having inductor therein
    52.
    发明授权
    Packaging chip having inductor therein 失效
    具有电感器的封装芯片

    公开(公告)号：US07541662B2

    公开(公告)日：2009-06-02

    申请号：US11435985

    申请日：2006-05-18

    申请人： Dong-ha Sim ,  In-sang Song ,  Duck-hwan Kim ,  Yun-kwon Park ,  Seok-chul Yun ,  Kuang-woo Nam

    发明人： Dong-ha Sim ,  In-sang Song ,  Duck-hwan Kim ,  Yun-kwon Park ,  Seok-chul Yun ,  Kuang-woo Nam

    IPC分类号： H01L29/00 ,  H01L23/12

    CPC分类号： H01L23/10 ,  H01F17/0006 ,  H01F27/027 ,  H01L23/49838 ,  H01L23/645 ,  H01L2924/16152

    摘要： A packaging chip having inductors therein is provided. The packaging chip includes a substrate for mounting a circuit element therein, at least one port formed on a surface of the substrate, a sealing portion electrically connected on the substrate to the circuit element and the at least one port, respectively, and a packaging substrate bonded to the substrate through the sealing portion and packaging the circuit element. In this case, the sealing portion has a certain magnitude of inductance since it is formed of a conductive material, thereby serving as an inductor. Accordingly, the packaging chip having an inductor therein can be implemented in a small size.

    摘要翻译： 提供其中具有电感器的封装芯片。 封装芯片包括用于在其中安装电路元件的基板，形成在基板的表面上的至少一个端口，分别电连接到基板上的电路元件和至少一个端口的密封部分和封装基板 通过密封部分粘合到基板上并封装电路元件。 在这种情况下，密封部分具有一定的电感量，因为其由导电材料形成，从而用作电感器。 因此，其中具有电感器的封装芯片可以实现为小尺寸。

    Device for detecting voltage and analog-to-digital converter (ADC) using the same
    53.
    发明授权
    Device for detecting voltage and analog-to-digital converter (ADC) using the same 失效
    用于检测电压的装置和使用其的模数转换器（ADC）

    公开(公告)号：US07532143B2

    公开(公告)日：2009-05-12

    申请号：US11979490

    申请日：2007-11-05

    申请人： In-sang Song ,  Sang-wook Kwon ,  Jung-eun Lee ,  Young-tack Houng

    发明人： In-sang Song ,  Sang-wook Kwon ,  Jung-eun Lee ,  Young-tack Houng

    IPC分类号： H03M1/12

    CPC分类号： G01R19/16576 ,  G01D1/18 ,  G01R5/28 ,  H03M1/361

    摘要： A voltage detecting device and an analog-to-digital converter (ADC) using the same are provided. The voltage detecting device determines whether input voltage is higher than threshold voltage based on contact of a strip and a membrane. Therefore, high resolution and high speed operation is possible, but with consuming lower power, and an element capable of performing the function of resistor and comparator is provided. Furthermore, a more effective ADC may be provided using the above.

    摘要翻译： 提供了使用其的电压检测装置和模数转换器（ADC）。 电压检测装置基于条带和膜的接触来确定输入电压是否高于阈值电压。 因此，高分辨率和高速度操作是可能的，但是消耗较低的功率，并且提供了能够执行电阻器和比较器的功能的元件。 此外，可以使用上述提供更有效的ADC。

    TUNABLE RESONATOR AND TUNABLE FILTER
    54.
    发明申请
    TUNABLE RESONATOR AND TUNABLE FILTER 有权
    TUNABLE谐振器和TUNABLE滤波器

    公开(公告)号：US20090115555A1

    公开(公告)日：2009-05-07

    申请号：US12045850

    申请日：2008-03-11

    申请人： Chul-soo Kim ,  Sang-won Yun ,  Young-ho Cho ,  In-sang Song ,  Byeong-ju Ha ,  Duck-hwan Kim

    发明人： Chul-soo Kim ,  Sang-won Yun ,  Young-ho Cho ,  In-sang Song ,  Byeong-ju Ha ,  Duck-hwan Kim

    IPC分类号： H01P1/203

    CPC分类号： H01P1/20336

    摘要： A tunable filter is provided which includes a filter unit comprising a pair of microstrips which are disposed facing each other, a capacitor unit connected to one side of the filter unit, and an adjustment unit for regulating the length of each of the pair of microstrips to adjust inductance of the filter unit, the adjustment unit being connected to the opposite side of the filter unit. The length of the microstrips may thereby be regulated in order to vary the frequency band.

    摘要翻译： 提供了一种可调谐滤波器，其包括一个滤波器单元，该滤波器单元包括一对彼此相对设置的微带，连接到滤波单元一侧的电容器单元和用于调节该对微带中的每一个的长度的调节单元 调节过滤器单元的电感，调节单元连接到过滤器单元的相对侧。 因此可以调节微带的长度以改变频带。

    MEMS switch
    56.
    发明授权
    MEMS switch 有权
    MEMS开关

    公开(公告)号：US07257307B2

    公开(公告)日：2007-08-14

    申请号：US11471511

    申请日：2006-06-21

    申请人： Che-heung Kim ,  Hyung Choi ,  In-sang Song ,  Sang-hun Lee ,  Sang-wook Kwon

    发明人： Che-heung Kim ,  Hyung Choi ,  In-sang Song ,  Sang-hun Lee ,  Sang-wook Kwon

    IPC分类号： G02B6/00

    CPC分类号： H01H59/0009 ,  H01H1/20

    摘要： A MEMS (micro electro mechanical system) switch, which includes a substrate; a fixed electrode formed on an upper side of the substrate; a signal line formed on both sides of the fixed electrode; a contact member formed on an upper side of the signal line at a distance from said fixed electrode and contacting an edging portion of the signal line; a supporting member supporting the contact member to be movable; and a moving electrode disposed on an upper side of the supporting member.

    摘要翻译： MEMS（微机电系统）开关，其包括基板; 固定电极，形成在所述基板的上侧; 形成在固定电极两侧的信号线; 接触构件，形成在距离所述固定电极一定距离的信号线的上侧，并与信号线的边缘部分接触; 支撑构件，其支撑所述接触构件以可移动; 以及设置在所述支撑构件的上侧的移动电极。

    RF module, multi RF module including the RF module, and method of manufacturing the RF module
    57.
    发明申请
    RF module, multi RF module including the RF module, and method of manufacturing the RF module 有权
    RF模块，包括RF模块的多RF模块和RF模块的制造方法

    公开(公告)号：US20070170565A1

    公开(公告)日：2007-07-26

    申请号：US11634247

    申请日：2006-12-06

    申请人： Seog-woo Hong ,  In-sang Song ,  Byeong-ju Ha ,  Hae-seok Park ,  Jun-sik Hwang ,  Joo-ho Lee

    发明人： Seog-woo Hong ,  In-sang Song ,  Byeong-ju Ha ,  Hae-seok Park ,  Jun-sik Hwang ,  Joo-ho Lee

    IPC分类号： H01L23/02

    CPC分类号： H03H9/0547 ,  H01L2924/0002 ,  H03H9/587 ,  H01L2924/00

    摘要： A radio frequency (RF) module and a multi RF module including the same include a base substrate, a first element capable of processing RF signals formed on the base substrate, a second element capable of processing RF signals separated from and disposed over the first element, a cap substrate coupled with the base substrate to encapsulate the first and second elements including a plurality of through electrodes that electrically connect the first and second elements to the outside, and a bonding pad that encapsulates and joins the base substrate and the cap substrate and electrically connects the first and second elements to the through electrodes.

    摘要翻译： 射频（RF）模块和包括其的多RF模块包括基底基板，能够处理形成在基底基板上的RF信号的第一元件，能够处理从第一元件分离并布置在第一元件上的RF信号的第二元件 ，与所述基底衬底耦合以封装所述第一和第二元件的帽衬底，所述第一和第二元件包括将所述第一和第二元件电连接到外部的多个通孔，以及封装并连接所述基底衬底和所述帽衬底的焊盘，以及 将第一和第二元件电连接到贯通电极。

    Inductor integrated chip and fabrication method thereof
    58.
    发明申请
    Inductor integrated chip and fabrication method thereof 有权
    电感集成芯片及其制造方法

    公开(公告)号：US20070138594A1

    公开(公告)日：2007-06-21

    申请号：US11473079

    申请日：2006-06-23

    申请人： Joo-ho Lee ,  Hae-seok Park ,  Byeoung-ju Ha ,  Seog-woo Hong ,  Hyung Choi ,  In-sang Song

    发明人： Joo-ho Lee ,  Hae-seok Park ,  Byeoung-ju Ha ,  Seog-woo Hong ,  Hyung Choi ,  In-sang Song

    IPC分类号： H01L29/00

    CPC分类号： H03H9/0542 ,  H03H9/105

    摘要： An inductor integrated chip and fabrication method thereof is provided. The inductor integrated chip includes a wafer; an inductor bonded on a surface of the wafer; a circuit element formed on the surface of the wafer and coupled to a first end of the inductor; a packaging wafer connected to the surface of the wafer and packaging the inductor and the circuit element; and a connecting electrode formed on the packaging wafer and connected to a second end of the inductor. The method includes forming an inductor and a circuit element on a surface of a wafer, wherein the circuit element is coupled to a first end of the inductor; forming a connecting electrode on a packaging wafer; and packaging the inductor and the circuit element by joining the wafer and the packaging wafer so as to connect the connecting electrode with a second end of the inductor.

    摘要翻译： 提供一种电感器集成芯片及其制造方法。 电感器集成芯片包括晶片; 结合在晶片表面上的电感器; 电路元件，其形成在所述晶片的表面上并且耦合到所述电感器的第一端; 连接到晶片表面并封装电感器和电路元件的封装晶片; 以及形成在封装晶片上并连接到电感器的第二端的连接电极。 该方法包括在晶片的表面上形成电感器和电路元件，其中电路元件耦合到电感器的第一端; 在封装晶片上形成连接电极; 并且通过接合晶片和封装晶片来封装电感器和电路元件，以将连接电极与电感器的第二端连接。

    Piezoelectric RF MEMS device and method of fabricating the same
    59.
    发明申请
    Piezoelectric RF MEMS device and method of fabricating the same 失效
    压电RF MEMS器件及其制造方法

    公开(公告)号：US20070120445A1

    公开(公告)日：2007-05-31

    申请号：US11594813

    申请日：2006-11-09

    申请人： Jong-seok Kim ,  In-sang Song ,  Sang-hun Lee ,  Sang-wook Kwon ,  Chang-seung Lee ,  Young-tack Houng ,  Che-heung Kim

    发明人： Jong-seok Kim ,  In-sang Song ,  Sang-hun Lee ,  Sang-wook Kwon ,  Chang-seung Lee ,  Young-tack Houng ,  Che-heung Kim

    IPC分类号： H01L41/053

    CPC分类号： H01H57/00 ,  H01L41/094 ,  H01L41/314 ,  H01L41/33

    摘要： A piezoelectric RF micro electro mechanical system (MEMS) device and a method of fabricating the same are provided, in which the RF MEMS device is driven upward at a low voltage based on a piezoelectric effect. The piezoelectric RF MEMS device includes an upper substrate provided with an RF output signal line, a piezoelectric actuator positioned below the RF output signal line, and a lower substrate provided with a cavity so that one end of the piezoelectric actuator is fixed to the lower substrate and its other end is movably spaced apart from the upper and lower substrates, wherein the piezoelectric actuator is provided with an RF input signal line thereon, and a contact pad is provided to connect the RF output signal line with the RF input signal line when the piezoelectric actuator is driven upward. A method of fabricating a piezoelectric RF MEMS device includes providing an upper substrate including an RF output signal line, providing a lower substrate including a piezoelectric actuator having an RF input signal line corresponding to the RF output signal line, and assembling the upper substrate and the lower substrate.

    摘要翻译： 提供了一种压电RF微机电系统（MEMS）器件及其制造方法，其中基于压电效应，RF MEMS器件以低电压向上驱动。 压电RF MEMS器件包括：设置有RF输出信号线的上基板，位于RF输出信号线下方的压电致动器;以及设置有空腔的下基板，使得压电致动器的一端固定到下基板 并且其另一端与上基板和下基板可移动地间隔开，其中压电致动器在其上设置有RF输入信号线，并且提供接触焊盘以将RF输出信号线与RF输入信号线连接， 压电致动器被向上驱动。 制造压电RF MEMS器件的方法包括提供包括RF输出信号线的上基板，提供包括具有对应于RF输出信号线的RF输入信号线的压电致动器的下基板，以及组装上基板和 下基板。