公开(公告)号：USD541332S1

公开(公告)日：2007-04-24

申请号：US29220569

申请日：2005-01-04

申请人： Tsutomu Tsuchiya

设计人： Tsutomu Tsuchiya

公开(公告)号：US20050199987A1

公开(公告)日：2005-09-15

申请号：US10512459

申请日：2003-04-28

申请人： Tadatoshi Danno ,  Tsutomu Tsuchiya

发明人： Tadatoshi Danno ,  Tsutomu Tsuchiya

IPC分类号： H01L23/31 ,  H01L23/495

CPC分类号： H01L24/32 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/50 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L24/97 ,  H01L2223/6611 ,  H01L2224/05554 ,  H01L2224/27013 ,  H01L2224/29007 ,  H01L2224/32013 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48257 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/10253 ,  H01L2924/12036 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/20752 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  H03F3/189 ,  H01L2924/20645 ,  H01L2224/83 ,  H01L2224/78 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： This invention provides a high frequency power module which is incorporated into a mobile phone and which incorporates high frequency portion analogue signal processing ICs including low noise amplifiers which amplify an extremely weak signal therein. A semiconductor device includes a sealing body which is made of insulation resin, a plurality of leads which are provided inside and outside the sealing body, a tab which is provided inside the sealing body and has a semiconductor element fixing region and a wire connection region on a main surface thereof, a semiconductor element which is fixed to the semiconductor element fixing region and includes electrode terminals on an exposed main surface, conductive wires which connect electrode terminals of the semiconductor element and the leads, and conductive wires which connect electrode terminals of the semiconductor element and the wire connecting region of the tab. In such a semiconductor device, a circuit formed in the semiconductor element in a monolithic manner is comprised of a plurality of circuit parts and, in a specified circuit part (a low noise amplifier) which forms a portion of the circuit parts, all grounding electrode terminals out of electrode terminals of the semiconductor element are not connected to the tab through wires but are connected with the leads through wires.

摘要翻译： 本发明提供一种并入移动电话中的高频功率模块，其包括高频部分模拟信号处理IC，包括放大其中极弱信号的低噪声放大器。 一种半导体器件，包括由绝缘树脂制成的密封体，设置在密封体的内部和外部的多个引线，设置在密封体内部并具有半导体元件固定区域和导线连接区域的突片 其主表面，固定到半导体元件固定区并且在暴露的主表面上包括电极端子的半导体元件，连接半导体元件的电极端子和引线的导线以及连接半导体元件的电极端子的导线 半导体元件和引线连接区域。 在这种半导体装置中，以单片方式形成在半导体元件中的电路由多个电路部分构成，并且在形成电路部分的一部分的规定电路部分（低噪声放大器）中，所有接地极 半导体元件的电极端子之外的端子不通过导线连接到突片，而是通过导线与引线连接。

公开(公告)号：US20050147397A1

公开(公告)日：2005-07-07

申请号：US11006721

申请日：2004-12-08

申请人： Hidetoshi Isawa ,  Shizuo Arai ,  Tsutomu Tsuchiya ,  Yuka Tsutsumi

发明人： Hidetoshi Isawa ,  Shizuo Arai ,  Tsutomu Tsuchiya ,  Yuka Tsutsumi

IPC分类号： H04N5/225 ,  G11B17/04 ,  G11B25/04 ,  G11B31/00 ,  G11B33/02 ,  H04N5/247 ,  H04N5/76

CPC分类号： G11B31/006

摘要： In a small size image pickup apparatus, depending upon the opening direction of the lid, a hand strap and the like become obstacles and it becomes difficult to open a disc lid with a large angle. Hence, a disc-like recording medium cannot be attached to and detached from the disc type image pickup apparatus without difficulty. In a disc type image pickup apparatus comprises a table rotating apparatus 35 for rotating a turntable 36 on which a DVD 2 is detachably loaded in the erected state, an optical pickup apparatus 71 capable of recording an information signal of an image corresponding to light of an object inputted through at least a lens apparatus 4 on the DVD 2 rotated by the table rotating apparatus 35, an outer case 5 having a disc compartment portion 6 in which the table rotating apparatus 35 and the optical pickup apparatus 71 are accommodated and in which the turntable 36 being opened to the side surface thereof and a disc lid 7 attached to the outer case 5 so as become freely openable and closable to cover the disc compartment portion 6. A lid rotary shaft portion 39 is provided on the rear portion of the side surface of the outer case 5 to rotatably support the disc lid 7 and the disc lid 0.7 can be rotated around the lid rotary shaft portion 39 in the lateral direction.

摘要翻译： 在小尺寸图像拾取装置中，根据盖的打开方向，手带等成为障碍物，并且变得难以以大的角度打开盘盖。 因此，盘状记录介质不能轻易地附接到盘式图像拾取装置并从其拆卸。 在一种盘式摄像装置中，包括一台转台装置35，用于旋转DVD 2以竖立状态可拆卸地装载在其上的转盘36;能够记录与光线对应的图像的信息信号的光学拾取装置71; 通过台式旋转装置35旋转的DVD 2上的至少透镜装置4输入的物体，具有容纳台式旋转装置35和光学拾取装置71的盘室部6的外壳5， 转台36向其侧表面敞开，盘盖7安装在外壳5上，以便可自如地打开和关闭以覆盖盘室隔间6。 在外壳5的侧面的后部设置盖旋转轴部39，以可旋转地支撑盘盖7，并且盘盖0.7可以围绕盖旋转轴部39沿横向旋转。

公开(公告)号：USD442160S1

公开(公告)日：2001-05-15

申请号：US29126519

申请日：2000-07-13

申请人： Tsutomu Tsuchiya

设计人： Tsutomu Tsuchiya

公开(公告)号：USD430538S

公开(公告)日：2000-09-05

申请号：US106121

申请日：1999-06-08

申请人： Kozo Kawakita ,  Takeshi Yamagishi ,  Tsutomu Tsuchiya ,  Toru Imai ,  Nobuyuki Fukui

设计人： Kozo Kawakita ,  Takeshi Yamagishi ,  Tsutomu Tsuchiya ,  Toru Imai ,  Nobuyuki Fukui

公开(公告)号：US08126501B2

公开(公告)日：2012-02-28

申请号：US13094383

申请日：2011-04-26

申请人： Tadatoshi Danno ,  Tsutomu Tsuchiya

发明人： Tadatoshi Danno ,  Tsutomu Tsuchiya

IPC分类号： H04M1/00 ,  H04B1/28

CPC分类号： H01L24/32 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/50 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L24/97 ,  H01L2223/6611 ,  H01L2224/05554 ,  H01L2224/27013 ,  H01L2224/29007 ,  H01L2224/32013 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48257 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/10253 ,  H01L2924/12036 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/20752 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  H03F3/189 ,  H01L2924/20645 ,  H01L2224/83 ,  H01L2224/78 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： This invention provides a high frequency power module which is incorporated into a mobile phone and which incorporates high frequency portion analogue signal processing ICs including low noise amplifiers which amplify an extremely weak signal therein. A semiconductor device includes a sealing body which is made of insulation resin, a plurality of leads which are provided inside and outside the sealing body, a tab which is provided inside the sealing body and has a semiconductor element fixing region and a wire connection region on a main surface thereof, a semiconductor element which is fixed to the semiconductor element fixing region and includes electrode terminals on an exposed main surface, conductive wires which connect electrode terminals of the semiconductor element and the leads, and conductive wires which connect electrode terminals of the semiconductor element and the wire connecting region of the tab. In such a semiconductor device, a circuit formed in the semiconductor element in a monolithic manner is comprised of a plurality of circuit parts and, in a specified circuit part (a low noise amplifier) which forms a portion of the circuit parts, all grounding electrode terminals out of electrode terminals of the semiconductor element are not connected to the tab through wires but are connected with the leads through wires.

摘要翻译： 本发明提供一种并入移动电话中的高频功率模块，其包括高频部分模拟信号处理IC，包括放大其中极弱信号的低噪声放大器。 一种半导体器件，包括由绝缘树脂制成的密封体，设置在密封体的内部和外部的多个引线，设置在密封体内部并具有半导体元件固定区域和导线连接区域的突片 其主表面，固定到半导体元件固定区并且在暴露的主表面上包括电极端子的半导体元件，连接半导体元件的电极端子和引线的导线以及连接半导体元件的电极端子的导线 半导体元件和引线连接区域。 在这种半导体装置中，以单片方式形成在半导体元件中的电路由多个电路部分构成，并且在形成电路部分的一部分的规定电路部分（低噪声放大器）中，所有接地极 半导体元件的电极端子之外的端子不通过导线连接到突片，而是通过导线与引线连接。

公开(公告)号：US07937105B2

公开(公告)日：2011-05-03

申请号：US12032690

申请日：2008-02-17

申请人： Tadatoshi Danno ,  Tsutomu Tsuchiya

发明人： Tadatoshi Danno ,  Tsutomu Tsuchiya

IPC分类号： H04M1/00 ,  H04B1/28

CPC分类号： H01L24/32 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/50 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L24/97 ,  H01L2223/6611 ,  H01L2224/05554 ,  H01L2224/27013 ,  H01L2224/29007 ,  H01L2224/32013 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48257 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/10253 ,  H01L2924/12036 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/20752 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  H03F3/189 ,  H01L2924/20645 ,  H01L2224/83 ,  H01L2224/78 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： This invention provides a high frequency power module which is incorporated into a mobile phone and which incorporates high frequency portion analogue signal processing ICs including low noise amplifiers which amplify an extremely weak signal therein. A semiconductor device includes a sealing body which is made of insulation resin, a plurality of leads which are provided inside and outside the sealing body, a tab which is provided inside the sealing body and has a semiconductor element fixing region and a wire connection region on a main surface thereof, a semiconductor element which is fixed to the semiconductor element fixing region and includes electrode terminals on an exposed main surface, conductive wires which connect electrode terminals of the semiconductor element and the leads, and conductive wires which connect electrode terminals of the semiconductor element and the wire connecting region of the tab. In such a semiconductor device, a circuit formed in the semiconductor element in a monolithic manner is comprised of a plurality of circuit parts and, in a specified circuit part (a low noise amplifier) which forms a portion of the circuit parts, all grounding electrode terminals out of electrode terminals of the semiconductor element are not connected to the tab through wires but are connected with the leads through wires.

摘要翻译： 本发明提供一种并入移动电话中的高频功率模块，其包括高频部分模拟信号处理IC，包括放大其中极弱信号的低噪声放大器。 一种半导体器件，包括由绝缘树脂制成的密封体，设置在密封体的内部和外部的多个引线，设置在密封体内部并具有半导体元件固定区域和导线连接区域的突片 其主表面，固定到半导体元件固定区并且在暴露的主表面上包括电极端子的半导体元件，连接半导体元件的电极端子和引线的导线以及连接半导体元件的电极端子的导线 半导体元件和引线连接区域。 在这种半导体装置中，以单片方式形成在半导体元件中的电路由多个电路部分构成，并且在形成电路部分的一部分的规定电路部分（低噪声放大器）中，所有接地极 半导体元件的电极端子之外的端子不通过导线连接到突片，而是通过导线与引线连接。

公开(公告)号：USD518018S1

公开(公告)日：2006-03-28

申请号：US29225810

申请日：2005-03-22

申请人： Shinpei Hirano ,  Shigeaki Suzuki ,  Tsutomu Tsuchiya

设计人： Shinpei Hirano ,  Shigeaki Suzuki ,  Tsutomu Tsuchiya

公开(公告)号：USD516597S1

公开(公告)日：2006-03-07

申请号：US29210733

申请日：2004-08-06

申请人： Tsutomu Tsuchiya

设计人： Tsutomu Tsuchiya

公开(公告)号：USD492278S1

公开(公告)日：2004-06-29

申请号：US29142532

申请日：2001-05-30

申请人： Tsutomu Tsuchiya

设计人： Tsutomu Tsuchiya