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111 条记录 (耗时 0.038 秒)

    Surface cutting method
    51.
    发明授权
    Surface cutting method 失效
    表面切割方法

    公开(公告)号：US4764877A

    公开(公告)日：1988-08-16

    申请号：US43349

    申请日：1987-03-17

    申请人： Kunio Tanaka ,  Yasushi Onishi

    发明人： Kunio Tanaka ,  Yasushi Onishi

    IPC分类号： B23Q15/00 ,  C07C259/06 ,  G05B19/4093 ,  G05B19/41 ,  G05B19/00

    CPC分类号： G05B19/41 ,  G05B2219/49381 ,  G05B2219/49392

    摘要： The present invention relates to a surface cutting method for cutting a surface within an area (AR) bounded by a predetermined closed curve (CCL) by moving a tool (TL) along a cutting path (PT.sub.i) in a predetermined direction (direction of arrow A) to cut the surface within the area, thenceforth moving the tool along an adjacent cutting path (PT.sub.i+1), obtained by a shift of a predetermined amount, to cut the surface, and repeating these surface cutting operations.The surface cutting method includes obtaining an offset curve (OFC) offset by a predetermined amount to the outer side of the closed curve (CCL), obtaining width W, in the shift direction (direction of arrow B), of the area bounded by the offset curve (OFC), finding, from among lengths of line segments obtained by dividing the width W into n equal parts, a length closest to a predetermined maximum cut-in amount without exceeding the same, adopting this length as an actual cut-in amount P, and performing surface cutting by shifting the tool (TL) by the cut-in amount P in the shift direction after the end of surface cutting along the cutting path PT.sub.i, and thereafter moving the tool along the adjacent cutting path PT.sub.i+1. A cutting starting point (P.sub.i) and cutting end point (Q.sub.i) of each cutting path are provided on an offset curve (OFC') offset by a predetermined amount to the outer side of the closed curve (CCL) specifying the area.

    摘要翻译： PCT No.PCT / JP86 / 00381 Sec。 371日期1987年3月17日 102（e）1987年3月17日PCT PCT 1986年7月21日PCT公布。 公开号WO87 / 00475 日本1987年1月29日。本发明涉及一种用于通过沿着切割路径（PTi）移动工具（TL）来切割由预定闭合曲线（CCL）界定的区域（AR）内的表面的表面切割方法 沿着预定方向（箭头A的方向）切割该区域内的表面，然后沿着通过预定量的偏移获得的相邻切割路径（PTi + 1）移动工具，以切割表面，并重复这些表面 切割作业。 表面切割方法包括获得偏移到闭合曲线（CCL）的外侧预定量的偏移曲线（OFC），获得沿着移动方向（箭头B的方向）的宽度W 偏移曲线（OFC），从宽度W分为n个相等部分获得的线段长度中，找出最接近预定最大切入量的长度，而不超过相同的长度，采用该长度作为实际切入 量P，并且通过沿着切割路径PTi在表面切割结束之后沿着移动方向移动刀具（TL）进行表面切割，然后沿着相邻切割路径PTi + 1移动刀具 。 每个切割路径的切割起始点（Pi）和切割终点（Qi）被设置在偏移预定量的偏移曲线（OFC'）上，以与指定该区域的闭合曲线（CCL）的外侧相对。

    Mounting apparatus for leadless electronic parts
    52.
    发明授权
    Mounting apparatus for leadless electronic parts 失效
    无铅电子零件安装装置

    公开(公告)号：US4451976A

    公开(公告)日：1984-06-05

    申请号：US414256

    申请日：1982-08-12

    申请人： Takayuki Fujita ,  Yoshiaki Yoshida ,  Toshiyuki Higashiura ,  Kunio Tanaka

    发明人： Takayuki Fujita ,  Yoshiaki Yoshida ,  Toshiyuki Higashiura ,  Kunio Tanaka

    IPC分类号： H05K13/04 ,  H05K3/32

    CPC分类号： H05K13/0404 ,  H05K13/0465 ,  Y10T29/49144 ,  Y10T29/53178

    摘要： The present invention relates to a mounting apparatus for leadless electronic parts wherein leadless electronic parts 3 supplied through a cylindrical chute 5 are dropped one by one into a part holding hole 7 of a part feeding pusher 6, with the part holding hole having a cutout, the part feeding pusher 6 transports the leadless electronic part 3 between chucks 10 and 11, and then a main block 8 including the chucks 10 and 11 is pivoted such that the leadless electronic parts 3 are taken out and mounted on a mounting portion of a printed circuit board 1 rapidly and reliably.

    摘要翻译： PCT No.PCT / JP81 / 00386 Sec。 371日期1982年8月12日 102（e）日期1982年8月12日PCT提交1981年12月16日PCT公布。 公开号WO82 / 02136 日本1982年6月24日。无铅电子部件的安装装置技术领域本发明涉及一种无铅电子部件的安装装置，其中通过圆筒形滑槽5供给的无引线电子部件3一个接一个地落入部件供给推动器6的部件保持孔7中， 部件保持孔具有切口，部件供给推动器6将无引线电子部件3传送到卡盘10和11之间，然后包括卡盘10和11的主块8枢转，使得无引线电子部件3被取出并安装 快速且可靠地在印刷电路板1的安装部分上。

    Component mounting apparatus
    55.
    发明申请
    Component mounting apparatus 有权
    组件安装设备

    公开(公告)号：US20070124922A1

    公开(公告)日：2007-06-07

    申请号：US10574914

    申请日：2004-10-06

    申请人： Kensuke Kawasumi ,  Kunio Tanaka ,  Hiroto Miyazaki ,  Nobuhiro Nakai

    发明人： Kensuke Kawasumi ,  Kunio Tanaka ,  Hiroto Miyazaki ,  Nobuhiro Nakai

    IPC分类号： B23P19/00

    CPC分类号： H05K13/0452 ,  H05K13/0409 ,  Y10T29/49133 ,  Y10T29/53087 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53261

    摘要： A component mounting apparatus includes one head unit which has a component holding member capable of holding a component and which is selected from among a plurality of types of head units according to a type of the fed component, a head moving unit which has a head fitting portion onto which the selected one head unit is removably loaded and which moves the head unit loaded on the head fitting portion in a direction extending generally along a surface of the board, and a head control unit which is provided for each of the head units and which performs control for component mounting operation by a head unit corresponding to the loaded head unit.

    摘要翻译： 一种部件安装装置，包括一个头部单元，其具有能够保持部件并且根据馈送部件的类型从多种类型的头单元中选择的部件保持部件，头部移动单元，其具有头部配件 所选择的一个头单元可移除地装载在该部分上，并且沿着大体沿板的表面延伸的方向移动装载在头部装配部分上的头单元，以及头部控制单元，其设置用于每个头单元和 其通过与加载的头单元相对应的头单元执行对部件安装操作的控制。

    Process for producing sodium salts
    57.
    发明授权
    Process for producing sodium salts 失效
    生产钠盐的方法

    公开(公告)号：US06576209B2

    公开(公告)日：2003-06-10

    申请号：US09749546

    申请日：2000-12-28

    申请人： Kunio Tanaka ,  Shintaro Kikuchi

    发明人： Kunio Tanaka ,  Shintaro Kikuchi

    IPC分类号： C01D700

    CPC分类号： C01D7/35 ,  C01D7/12 ,  C01D7/14

    摘要： A process for producing sodium salts, which comprises adding solid sodium carbonate to a first aqueous solution containing sodium carbonate and sodium hydrogencarbonate, to prepare a second aqueous solution, precipitating, separating and recovering from the second aqueous solution sodium sesquicarbonate crystals containing at least 50 mol % of the sodium hydrogencarbonate component contained in the second aqueous solution, and further recovering sodium carbonate from a mother liquor remaining after separating the sodium sesquicarbonate crystals from the second aqueous solution.

    摘要翻译： 一种制备钠盐的方法，其包括将固体碳酸钠加入到含有碳酸钠和碳酸氢钠的第一水溶液中，以制备第二水溶液，从第二水溶液中沉淀，分离和回收含有至少50摩尔的倍半碳酸钠晶体 ％的碳酸氢钠成分，并且从从第二水溶液中分离倍半碳酸钠晶体后残留的母液进一步回收碳酸钠。

    Electronic component mounting device
    59.
    发明授权
    Electronic component mounting device 有权
    电子零件安装装置

    公开(公告)号：US06216336B1

    公开(公告)日：2001-04-17

    申请号：US09142868

    申请日：1998-09-17

    申请人： Takatoshi Mitsushima ,  Kunio Tanaka ,  Takashi Munezane

    发明人： Takatoshi Mitsushima ,  Kunio Tanaka ,  Takashi Munezane

    IPC分类号： H05K330

    CPC分类号： H05K13/0452 ,  H05K13/0409 ,  H05K13/041 ,  Y10T29/53091 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191

    摘要： The present invention relates to an electronic parts mounting device designed to mount chip type electronic parts on a printed board. It is an object of the invention to provide a compact and high-speed electronic parts mounting device. To achieve this object, the present invention provides first and second drive systems (12) and (13) for driving first and second supplying portions (2) and (3) arranged on both sides of a table portion (6) and has arrangement pitches of suction nozzles (18) of each supplying portion, each of the drive systems (12) and (13), and each cassette (4) of the supplying portions identical with each other. This structure provides the compact and high-speed electronic parts mounting device.

    摘要翻译： 电子零件安装装置技术领域本发明涉及一种设计用于将芯片型电子部件安装在印刷电路板上的电子部件安装装置。 本发明的目的是提供一种紧凑型和高速的电子部件安装装置。为了实现该目的，本发明提供了用于驱动第一和第二供应部分（2）的第一和第二驱动系统（12）和（13） ）和（3）布置在台部（6）的两侧，并且具有每个供应部分的吸嘴（18），每个驱动系统（12）和（13）以及每个盒（4）的排列间距， 的供给部彼此相同。 这种结构提供了紧凑和高速的电子部件安装装置。

    Machining load monitoring system
    60.
    发明授权
    Machining load monitoring system 失效
    加工负载监控系统

    公开(公告)号：US5822212A

    公开(公告)日：1998-10-13

    申请号：US911440

    申请日：1997-08-12

    申请人： Kunio Tanaka ,  Yasushi Onishi

    发明人： Kunio Tanaka ,  Yasushi Onishi

    IPC分类号： G05B19/4063 ,  G06F19/00 ,  B23Q17/09

    CPC分类号： G05B19/4063 ,  G05B2219/50197

    摘要： A machining load monitoring system to monitor a machining condition by comparing sampled data of a machining load in a trial cutting process and measured data thereof in an actual cutting process with each other precisely with respect to time. An NC command executing unit (1) executes NC commands, and updates a block number and an execution mode in an executed state table (2) when the execution of NC commands of one block is finished. A load monitoring unit (4) compares sampled data, stored in a sampled data table (3), of a machining load in a trial cutting process with measured data thereof in an actual cutting process at given intervals of time. When the block number in the executed state table (2) is updated, sampled data of a new block number are read from the sampled data table (3). The sampled data in the trial cutting process and the measured data in the actual cutting process are compared with each other at predetermined times, and an alarm is issued when the difference between the compared data reaches or exceeds a predetermined level.

    摘要翻译： 一种加工负载监视系统，用于通过将切割试验中的加工载荷的采样数据与实际切割过程中的测量数据相对于时间精确地相互比较来监视加工条件。 NC命令执行单元（1）执行NC命令，并且当执行一个程序段的NC命令完成时，更新执行状态表（2）中的程序段号和执行模式。 负载监视单元（4）将在试验切割处理中的加工负载的采样数据表（3）中存储的采样数据与在实际切割过程中的给定时间间隔的测量数据进行比较。 当更新执行状态表（2）中的块号时，从采样数据表（3）读取新块号的采样数据。 试验切削过程中的采样数据和实际切割过程中的测量数据在预定时间彼此进行比较，并且当比较数据之间的差达到或超过预定水平时发出报警。