摘要:
An imaging apparatus capable of suppressing deterioration of image qualities and output properties is provided having one or more output circuits in series and a buffer circuit 6, and processing luminance signals from photodetectors to output image information, the buffer circuit performing impedance conversion on signals outputted from a final output circuit of the one or more output circuits, the final output circuit being a source follower circuit that has an active element and a current source circuit 5 which is inserted between a source terminal of the active element and a reference voltage terminal, wherein the current source circuit and the buffer circuit 6 are external to a solid-state image sensor 1 having the photodetectors, and a main part of the current source circuit 5 and a main part of the buffer circuit 6 are in a single package.
摘要:
An imaging apparatus capable of suppressing deterioration of image qualities and output properties is provided having one or more output circuits in series and a buffer circuit 6, and processing luminance signals from photodetectors to output image information, the buffer circuit performing impedance conversion on signals outputted from a final output circuit of the one or more output circuits, the final output circuit being a source follower circuit that has an active element and a current source circuit 5 which is inserted between a source terminal of the active element and a reference voltage terminal, wherein the current source circuit and the buffer circuit 6 are external to a solid-state image sensor 1 having the photodetectors, and a main part of the current source circuit 5 and a main part of the buffer circuit 6 are in a single package.
摘要:
Providing an imaging apparatus capable of suppressing deterioration of image qualities and output properties when a wafer thickness of the imaging apparatus is made thin. The imaging apparatus having one or more output circuits in series and a buffer circuit 6, and processing luminance signals from photodetectors to output image information, the buffer circuit performing impedance conversion on signals outputted from a final output circuit of the one or more output circuits, the final output circuit being a source follower circuit that has an active element and a current source circuit 5 which is inserted between a source terminal of the active element and a reference voltage terminal, wherein the current source circuit and the buffer circuit 6 are external to a solid-state image sensor 1 having the photodetectors, and a main part of the current source circuit 5 and a main part of the buffer circuit 6 are in a single package.
摘要:
A charge-coupled device comprises transfer gate electrodes separated from a substrate by a multilayer insulating film, and gate electrodes of MIS transistors separated from the substrate by a single layer insulating film. The multilayer insulating film comprising at least a lower silicon oxide layer of 10 nm to 200 nm thickness and an upper silicon nitride layer of 10 nm to 100 nm thickness. Since each of the gate insulating films of the MIS transistors is the same layer as the lower silicon oxide layer, there occurs no degradation in the transistor characteristics due to the surface states or the trapping states present within the silicon nitride layer.
摘要:
A charge-coupled device comprises transfer gate electrodes separated from a substrate by a multi-layer insulating film, and gate electrodes of MIS transistors separated from the substrate by a single layer insulating film. The multilayer insulating film comprising at least a lower silicon oxide layer of 10 nm to 200 nm thickness and an upper silicon nitride layer of 10 nm to 100 nm thickness. Since each of the gate insulating films of the MIS transistors is the same layer as the lower silicon oxide layer, there occurs no degradation in the transistor characteristics due to the surface states or the trapping states present within the silicon nitride layer.
摘要:
A radio receiver (FM radio receiver) has an amplitude detecting section (13) for detecting the amplitude level of a received radio wave; a multipath occurrence state detecting section (14) for monitoring the amplitude level, and for detecting the degree of a multipath occurrence state; a multipath occurrence state deciding section (15) for deciding the operation limiting level of the amplitude correction according to the degree of the multipath occurrence state; a receiving condition deciding section (20) for deciding receiving conditions of the radio wave; and a limiting level deciding section (21) for adjusting the operation limiting level of the amplitude correction output from the multipath occurrence state deciding section (15) according to a receiving condition decision result output from the receiving condition deciding section (20), and suppresses the multipath noise by imposing operation limitations on the amplitude correction of the FM demodulator 9.
摘要:
An imaging apparatus capable of suppressing deterioration of image qualities and output properties is provided having one or more output circuits in series and a buffer circuit 6, and processing luminance signals from photodetectors to output image information, the buffer circuit performing impedance conversion on signals outputted from a final output circuit of the one or more output circuits, the final output circuit being a source follower circuit that has an active element and a current source circuit 5 which is inserted between a source terminal of the active element and a reference voltage terminal, wherein the current source circuit and the buffer circuit 6 are external to a solid-state image sensor 1 having the photodetectors, and a main part of the current source circuit 5 and a main part of the buffer circuit 6 are in a single package.
摘要:
A heater device includes a heating unit which includes a heating element that generates heat using an induction-heating method. A power supply part supplies a driving current to the heating unit. A first high-frequency component cutoff unit is connected to the power supply part. A switching unit controls the supply of the driving current from the power supply part to the heating unit. A second high-frequency component cutoff unit is connected to the switching unit. And a connection unit connects the first high-frequency component cutoff unit and the second high-frequency component cutoff unit.
摘要:
An object is to provide a technique to facilitate an identification of a semiconductor bare chip. To achieve this object, the semiconductor bare chip includes a plurality of fuse elements f11 to f19 disposed, in a predetermined order, on a surface of a semiconductor substrate. ID information of the semiconductor bare chip is indicated by a combination of the order of the fuse elements and fusing status of the fuse elements, which indicate whether or not the respective fuse elements are fused.
摘要:
This invention relates an optoelectronic material comprising a uniform medium with a controllable electric characteristic; and semiconductor ultrafine particles dispersed in the medium and having a mean particle size of 100 nm or less, and an application device using the same. This invention also relates to a method of manufacturing an optoelectronic material by irradiating a laser beam onto a first target of a semiconductor material, placed in a reaction chamber in low pressure rare gas ambient, and a second target of a medium material with a controllable electric characteristic, placed in the reaction chamber, condensing/growing a semiconductor material ablated from the first target to be collected as ultrafine particles having a mean particle size of 100 nm or smaller on a substrate placed in the reaction chamber, and condensing/growing a medium material ablated from the second target to be collected on the substrate placed in the reaction chamber, thus forming an ultrafine-particles dispersed layer having semiconductor ultrafine particles dispersed in the medium on the substrate.