Light emitting device and method for manufacturing the same
    51.
    发明授权
    Light emitting device and method for manufacturing the same 有权
    发光元件及其制造方法

    公开(公告)号:US08008684B2

    公开(公告)日:2011-08-30

    申请号:US12500988

    申请日:2009-07-10

    IPC分类号: H01L33/00

    摘要: A light emitting device according to an embodiment is provided. The light emitting device comprises a second electrode layer, a third conductive semiconductor layer comprising a schottky contact region and an ohmic contact region on the second electrode layer, a second conductive semiconductor layer on the third conductive semiconductor layer, an active layer on the second conductive semiconductor layer, a first conductive semiconductor layer on the active layer, and a first electrode layer on the first conductive semiconductor layer.

    摘要翻译: 提供了根据实施例的发光器件。 发光器件包括第二电极层,第三导电半导体层,包括肖特基接触区域和第二电极层上的欧姆接触区域,第三导电半导体层上的第二导电半导体层,第二导电半导体层上的有源层 半导体层,有源层上的第一导电半导体层,以及第一导电半导体层上的第一电极层。

    Light emitting device and method for fabricating the same
    53.
    发明授权
    Light emitting device and method for fabricating the same 有权
    发光元件及其制造方法

    公开(公告)号:US07511308B2

    公开(公告)日:2009-03-31

    申请号:US11526883

    申请日:2006-09-26

    IPC分类号: H01L33/00

    摘要: A light emitting device and a method for fabricating the same are disclosed, whereby a thin mask film is changed to agglomerates by a simple thermal treatment process, and a plurality of nano openings, each opening spaced a distance apart, are formed in the agglomerates, a light emitting structure exposed to the nano openings is etched to form nano grooves and nano openings therein, enabling to enhance a light emitting area and to reduce the totally reflected light for an improvement of the light extraction efficiency.

    摘要翻译: 公开了一种发光器件及其制造方法,由此通过简单的热处理工艺将薄掩模膜改变成团聚体,并且在附聚物中形成多个间隔开距离的开口的多个纳米开口, 蚀刻暴露于纳米开口的发光结构以在其中形成纳米凹槽和纳米开口,从而能够增强发光面积并减少全反射光以提高光提取效率。

    Light emitting device and lighting system
    55.
    发明授权
    Light emitting device and lighting system 有权
    发光装置和照明系统

    公开(公告)号:US08698176B2

    公开(公告)日:2014-04-15

    申请号:US13179192

    申请日:2011-07-08

    IPC分类号: H01L33/00

    摘要: A light emitting device includes a conductive support member, a first conductive layer on the conductive support member, a second conductive layer, a first semiconductor layer on the second conductive layer, a second semiconductor layer and an active layer between the first semiconductor layer and the second conductive layer, and an insulation layer disposed between the first conductive layer and the second conductive layer. The first conductive layer includes a first expansion part penetrating the second conductive layer, the second semiconductor layer and the active layer, and a second expansion part extending from the first expansion part and disposed in the first semiconductor layer. The insulation layer is on a lateral surface of the first expansion part. At least a portion of a lateral surface of the second expansion part contacts the first semiconductor layer, and the insulation layer is between the first semiconductor layer and the second expansion part.

    摘要翻译: 发光器件包括导电支撑构件,导电支撑构件上的第一导电层,第二导电层,第二导电层上的第一半导体层,第二半导体层和第一半导体层与第一半导体层之间的有源层 第二导电层和设置在第一导电层和第二导电层之间的绝缘层。 第一导电层包括穿透第二导电层,第二半导体层和有源层的第一扩展部分和从第一扩展部分延伸并设置在第一半导体层中的第二扩展部分。 绝缘层位于第一膨胀部的侧面上。 第二扩张部的侧面的至少一部分与第一半导体层接触,绝缘层位于第一半导体层与第二扩展部之间。

    Light emitting device and method for manufacturing the same
    57.
    发明授权
    Light emitting device and method for manufacturing the same 有权
    发光元件及其制造方法

    公开(公告)号:US08569784B2

    公开(公告)日:2013-10-29

    申请号:US13618952

    申请日:2012-09-14

    IPC分类号: H01L33/00 H01L21/00

    CPC分类号: H01L33/145 H01L33/60

    摘要: A light emitting device according to an embodiment includes a second electrode layer comprising at least one projection part; at least one current blocking layer on the projection part of the second electrode layer; a second conductive type semiconductor layer on the second electrode layer and the current blocking layer; an active layer on the second conductive type semiconductor layer; a first conductive type semiconductor layer on the active layer; and a first electrode layer on the first conductive type semiconductor layer, at least a portion of the first electrode layer corresponding with the current blocking layer in a vertical direction.

    摘要翻译: 根据实施例的发光器件包括包括至少一个突出部分的第二电极层; 在所述第二电极层的所述突起部分上的至少一个电流阻挡层; 在第二电极层和电流阻挡层上的第二导电型半导体层; 在第二导电类型半导体层上的有源层; 在所述有源层上的第一导电类型半导体层; 以及在所述第一导电型半导体层上的第一电极层,所述第一电极层的至少一部分在垂直方向对应于所述电流阻挡层。

    Light emitting device
    58.
    发明授权
    Light emitting device 有权
    发光装置

    公开(公告)号:US08558260B2

    公开(公告)日:2013-10-15

    申请号:US12522246

    申请日:2009-01-15

    IPC分类号: H01L33/00

    CPC分类号: H01L33/405

    摘要: Disclosed is a light emitting device. The light emitting device comprises a reflective layer comprising an alloy of at least one of an Ag-based alloy, an Al-based alloy, Ag, Al, Rh, or Sn, and at least one of Pd, Cu, C, Sn, In or Cr, and a light emitting semiconductor layer comprising a second conductive semiconductor layer, an active layer and a first conductive semiconductor layer on the reflective layer.

    摘要翻译: 公开了一种发光器件。 发光器件包括反射层,其包含Ag基合金,Al基合金,Ag,Al,Rh或Sn中的至少一种的合金,以及Pd,Cu,C,Sn, In或Cr,以及在反射层上包括第二导电半导体层,有源层和第一导电半导体层的发光半导体层。

    Light emitting device and light emitting device package
    60.
    发明授权
    Light emitting device and light emitting device package 有权
    发光器件和发光器件封装

    公开(公告)号:US08455880B2

    公开(公告)日:2013-06-04

    申请号:US13023100

    申请日:2011-02-08

    IPC分类号: H01L29/15

    摘要: Provided is a light emitting device. A light emitting device includes: a conductive support member; a light emitting structure for generating a light on the conductive support member, the light emitting structure comprising a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer; an electrode on the light emitting structure; and an oxide layer between the electrode and the light emitting structure. The light emitting structure includes an oxygen-injected region where oxygen is injected on an upper portion of the light emitting structure.

    摘要翻译: 提供了一种发光装置。 发光器件包括:导电支撑构件; 用于在导电支撑构件上产生光的发光结构,所述发光结构包括第一导电类型半导体层,第二导电类型半导体层和有源层; 发光结构上的电极; 以及电极和发光结构之间的氧化物层。 发光结构包括在发光结构的上部注入氧的氧注入区域。