摘要:
According to one exemplary embodiment, a one-time programmable memory cell includes an access transistor coupled to a shiftable threshold voltage transistor between a bitline and a ground, where the access transistor has a gate coupled to a wordline. The shiftable threshold voltage transistor has a drain and a gate shorted together. A programming operation causes a permanent shift in a threshold voltage of the shiftable threshold voltage transistor to occur in response to a programming voltage on the bitline and the wordline. In one embodiment, the access transistor is an NFET while the shiftable threshold voltage transistor is a PFET. In another embodiment, the access transistor is an NFET and the shiftable threshold voltage transistor is also an NFET. The programming voltage can cause an absolute value of the threshold voltage to permanently increase by at least 50.0 millivolts.
摘要:
Embodiments of an aluminum pad thinning in bond pad for fine pitch ultra-thick aluminum pad structures are provided herein. Embodiments include a conductive structure formed on a substrate. A first passivation layer is formed over the substrate and the conductive structure, the first passivation layer having an opening formed over the conductive structure. An ultra-thick conductive structure having a thinned trench region formed over the opening of the first passivation layer. The ultra-thick conductive structure is in contact with the conductive structure. A second passivation layer formed over the first passivation region and the ultra-thick conductive structure. The second passivation layer having an opening formed over the thinned trench region of the ultra-thick conductive structure.
摘要:
According to one exemplary embodiment, a method for forming a one-time programmable metal fuse structure includes forming a metal fuse structure over a substrate, the metal fuse structure including a gate metal segment situated between a dielectric segment and a polysilicon segment, a gate metal fuse being formed in a portion of the gate metal segment. The method further includes doping the polysilicon segment so as to form first and second doped polysilicon portions separated by an undoped polysilicon portion where, in one embodiment, the gate metal fuse is substantially co-extensive with the undoped polysilicon portion. The method can further include forming a first silicide segment on the first doped polysilicon portion and a second silicide segment on the second doped polysilicon portion, where the first and second silicide segments form respective terminals of the one-time programmable metal fuse structure.
摘要:
The present invention provides blue-green silicate luminescent materials, which are rare earth activated alkaline-earth metals silicates having a formula of Ba1-bMbSi2O(5-a/2)Da:Eux, Lny, wherein M is one or two elements selected from the group consisting of Mg, Ca and Sr; D is one or two ions selected from the group consisting of Cl− and F−; Ln is an ion selected from Ce, Er, Pr or Mn; a, b, x, and y are molar coefficients and within following ranges: 0≦a
摘要翻译:本发明提供蓝色 - 绿色硅酸盐发光材料,它们是具有式Ba1-bMbSi2O(5-a / 2)Da:Eux,Lny的稀土活化的碱土金属硅酸盐,其中M是选自以下的一种或两种元素: 由Mg,Ca和Sr组成的组; D是选自Cl-和F-的一种或两种离子; Ln是选自Ce,Er,Pr或Mn的离子; a,b,x和y是摩尔系数,并在以下范围内:0&nlE; a <2,0&nlE; b <0.5,0
摘要:
The present invention discloses a group resource allocation method, which comprises the following steps that: a user resource management device groups user-side equipments according to the service type or the modulation and coding scheme of the user-side equipments; and the user resource management device performs an initialization description and/or an update and maintenance description for each group via a group message, describes the resource allocation information of the user-side equipments in each group via the group message to realize a group resource allocation. Through the technical solution above, the present invention lowers the description overhead of a group resource allocation.
摘要:
A photovoltaic cell comprising a metal oxide back buffer layer. Improved n-CdS/p-CdTe heterojunction photovoltaic cells comprising a metal oxide buffer layer for making low-resistance electrical contact to the p-type CdTe layer. The back buffer layer comprises metal oxides having a high work function.
摘要:
According to one exemplary embodiment, a method for fabricating a flash memory cell in a semiconductor die includes forming a control gate stack overlying a floating gate stack in a memory region of a substrate, where the floating gate stack includes a floating gate overlying a portion of a dielectric one layer. The floating gate includes a portion of a metal one layer and the dielectric one layer includes a first high-k dielectric material. The control gate stack can include a control gate including a portion of a metal two layer, where the metal one layer can include a different metal than the metal two layer.
摘要:
According to an exemplary embodiment, a method for fabricating a MOS transistor, such as an LDMOS transistor, includes forming a self-aligned lightly doped region in a first well underlying a first sidewall of a gate. The method further includes forming a self-aligned extension region under a second sidewall of the gate, where the self-aligned extension region extends into the first well from a second well. The method further includes forming a drain region spaced apart from the second sidewall of the gate. The method further includes forming a source region in the self-aligned lightly doped region and the first well. The self-aligned lightly doped region and the self-aligned extension region define a channel length of the MOS transistor, such as an LDMOS transistor.
摘要:
According to an exemplary embodiment, a method for fabricating a decoupling composite capacitor in a wafer that includes a dielectric region overlying a substrate includes forming a through-wafer via in the dielectric region and the substrate. The through-wafer via includes a through-wafer via insulator covering a sidewall and a bottom of a through-wafer via opening and a through-wafer via conductor covering the through-wafer via insulator. The method further includes thinning the substrate, forming a substrate backside insulator, forming an opening in the substrate backside insulator to expose the through-wafer via conductor, and forming a backside conductor on the through-wafer via conductor, such that the substrate backside conductor extends over the substrate backside insulator, thereby forming the decoupling composite capacitor. The substrate forms a first decoupling composite capacitor electrode and the through-wafer via conductor and substrate backside conductor form a second decoupling composite capacitor electrode.
摘要:
According to one exemplary embodiment, a one-time programmable memory cell includes an access transistor coupled to a cell transistor between a bitline and a ground, where the access transistor has a gate coupled to a wordline. The cell transistor has a source, a gate, and a body shorted together. A programming operation causes a punchthrough to occur between the source and a drain of the cell transistor in response to a programming voltage on the bitline and the wordline. A channel length of the cell transistor is substantially less than a channel length of the access transistor. In one embodiment, the access transistor is an NFET while the cell transistor is a PFET. In another embodiment, the access transistor is an NFET and the cell transistor is also an NFET. Various embodiments result in a reduction of the required programming voltage.