-
公开(公告)号:US09142534B2
公开(公告)日:2015-09-22
申请号:US13148544
申请日:2009-10-13
申请人: Chao-Hsing Chen , Schang-Jing Hon , Alexander Chan Wang , Li-Tian Liang , Chin-Yung Fan , Chien-Kai Chung , Min-Hsun Hsieh
发明人: Chao-Hsing Chen , Schang-Jing Hon , Alexander Chan Wang , Li-Tian Liang , Chin-Yung Fan , Chien-Kai Chung , Min-Hsun Hsieh
IPC分类号: H01L27/15 , H01L27/02 , H01L25/065 , H01L25/075 , H01L27/32 , H01L33/62
CPC分类号: H01L27/15 , H01L25/0753 , H01L27/153 , H01L27/156 , H01L27/3211 , H01L33/50 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H01L2224/8592 , H01L2924/12032 , H01L2924/30107 , H01L2924/00014 , H01L2924/00
摘要: A light-emitting device is provided that is capable of being directly connected to an alternative current source, including at least one electronic element; at least one light-emitting diode array chip; at least one bonding pad, a conductive trace, and a submount for supporting the electronic element, the light-emitting diode array chip, the bonding pad, and the conductive trace. The conductive trace is electrically connected to the electronic element, the light-emitting diode array chip, and bonding pad.
摘要翻译: 提供了能够直接连接到包括至少一个电子元件的替代电流源的发光器件; 至少一个发光二极管阵列芯片; 至少一个接合焊盘,导电迹线和用于支撑电子元件的基座,发光二极管阵列芯片,接合焊盘和导电迹线。 导电迹线电连接到电子元件,发光二极管阵列芯片和接合焊盘。
-
公开(公告)号:US08623682B2
公开(公告)日:2014-01-07
申请号:US13618774
申请日:2012-09-14
申请人: Chien-Kai Chung , Ta-Cheng Hsu , Jung-Min Hwang , Min-Hsun Hsieh , Ya-Lan Yang , De-Shan Kuo , Tsun-Kai Ko , Chien-Fu Shen , Ting-Chia Ko , Schang-Jing Hon
发明人: Chien-Kai Chung , Ta-Cheng Hsu , Jung-Min Hwang , Min-Hsun Hsieh , Ya-Lan Yang , De-Shan Kuo , Tsun-Kai Ko , Chien-Fu Shen , Ting-Chia Ko , Schang-Jing Hon
IPC分类号: H01L21/00
CPC分类号: H01L33/005 , H01L21/02057 , H01L21/3043 , H01L33/0095
摘要: A method of manufacturing a light-emitting device comprising the steps of cutting a substrate by a laser beam to form a cavity in the substrate and generate a by-product directly on the substrate by the cutting, and removing the by-product by a chemical solution containing an acid under a predetermined cleaning temperature.
摘要翻译: 一种制造发光器件的方法,包括以下步骤:通过激光束切割衬底以在衬底中形成空腔,并通过切割直接在衬底上产生副产物,并通过化学物质除去副产物 溶液在预定的清洁温度下含有酸。
-
公开(公告)号:USD684127S1
公开(公告)日:2013-06-11
申请号:US29430112
申请日:2012-08-21
申请人: Chien-Fu Shen , Tsun-Kai Ko , Schang-Jing Hon
设计人: Chien-Fu Shen , Tsun-Kai Ko , Schang-Jing Hon
-
公开(公告)号:US20120061694A1
公开(公告)日:2012-03-15
申请号:US13230988
申请日:2011-09-13
申请人: Chien-Fu Shen , Chao-Hsing Chen , Tsun-Kai Ko , Schang-Jing Hon , Sheng-Jie Hsu , De-Shan Kuo , Hsin-Ying Wang , Chiu-Lin Yao , Chien-Fu Huang , Hsin-Mao Liu , Chien-Kai Chung
发明人: Chien-Fu Shen , Chao-Hsing Chen , Tsun-Kai Ko , Schang-Jing Hon , Sheng-Jie Hsu , De-Shan Kuo , Hsin-Ying Wang , Chiu-Lin Yao , Chien-Fu Huang , Hsin-Mao Liu , Chien-Kai Chung
IPC分类号: H01L33/08
CPC分类号: H01L27/156 , H01L25/0753 , H01L27/153 , H01L33/20 , H01L33/382 , H01L33/385 , H01L33/44 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要: An embodiment of the present application discloses a light-emitting structure, comprising a first unit; a second unit; a trench formed between the first unit and the second unit, and having a less steep sidewall and a steeper sidewall steeper than the less steep sidewall; and an electrical connection arranged on the less steep sidewall.
摘要翻译: 本申请的实施例公开了一种发光结构,包括第一单元; 第二单位 形成在所述第一单元和所述第二单元之间的沟槽,并且具有比所述较不陡峭的侧壁更陡峭的侧壁和更陡峭的侧壁; 以及布置在不太陡峭的侧壁上的电连接。
-
公开(公告)号:US20120049213A1
公开(公告)日:2012-03-01
申请号:US13148544
申请日:2009-10-13
申请人: Chao-Hsing Chen , Schang-Jing Hon , Alexander Chang Wang , Li-Tian Liang , Chin-Yung Fan , Chien-Kai Chung , Min-Hsun Hsieh
发明人: Chao-Hsing Chen , Schang-Jing Hon , Alexander Chang Wang , Li-Tian Liang , Chin-Yung Fan , Chien-Kai Chung , Min-Hsun Hsieh
IPC分类号: H01L27/15
CPC分类号: H01L27/15 , H01L25/0753 , H01L27/153 , H01L27/156 , H01L27/3211 , H01L33/50 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H01L2224/8592 , H01L2924/12032 , H01L2924/30107 , H01L2924/00014 , H01L2924/00
摘要: A light-emitting device is provided that is capable of being directly connected to an alternative current source, including at least one electronic element; at least one light-emitting diode array chip; at least one bonding pad, a conductive trace, and a submount for supporting the electronic element, the light-emitting diode array chip, the bonding pad, and the conductive trace. The conductive trace is electrically connected to the electronic element, the light-emitting diode array chip, and bonding pad.
摘要翻译: 提供了能够直接连接到包括至少一个电子元件的替代电流源的发光器件; 至少一个发光二极管阵列芯片; 至少一个接合焊盘,导电迹线和用于支撑电子元件的基座,发光二极管阵列芯片,接合焊盘和导电迹线。 导电迹线电连接到电子元件,发光二极管阵列芯片和接合焊盘。
-
公开(公告)号:US20120012867A1
公开(公告)日:2012-01-19
申请号:US13186218
申请日:2011-07-19
申请人: Chien-Fu Shen , Schang-Jing Hon , Tsun-Kai Ko , Alexander Chan Wang , Min-Hsun Hsieh , Cheng Nan Han
发明人: Chien-Fu Shen , Schang-Jing Hon , Tsun-Kai Ko , Alexander Chan Wang , Min-Hsun Hsieh , Cheng Nan Han
IPC分类号: H01L33/08
CPC分类号: H01L25/0753 , F21K9/00 , F21Y2105/10 , F21Y2105/12 , F21Y2113/13 , F21Y2115/10 , H01L33/50 , H01L33/505 , H01L33/60 , H01L2224/48091 , H01L2224/48137 , H01L2924/0002 , H01L2924/00014 , H01L2924/00
摘要: The present application provides a multi-dimensional light-emitting device electrically connected to a power supply system. The multi-dimensional light-emitting device comprises a substrate, a blue light-emitting diode array and one or more phosphor layers. The blue light-emitting diode array, disposed on the substrate, comprises a plurality of blue light-emitting diode chips which are electrically connected. The multi-dimensional light-emitting device comprises a central area and a plurality of peripheral areas, which are arranged around the central area. The phosphor layer covers the central area. When the power supply system provides a high voltage, the central area and the peripheral areas of the multi-dimensional light-emitting device provide a first light and a plurality of second lights, respectively. The first light and the second lights are blended into a mixed light.
摘要翻译: 本申请提供了电连接到电源系统的多维发光装置。 多维发光装置包括基板,蓝色发光二极管阵列和一个或多个荧光体层。 设置在基板上的蓝色发光二极管阵列包括电连接的多个蓝色发光二极管芯片。 多维发光装置包括围绕中心区域布置的中心区域和多个周边区域。 磷光体层覆盖中心区域。 当电源系统提供高电压时,多维发光装置的中心区域和外围区域分别提供第一光和多个第二光。 第一个光和第二个光被混合成混合光。
-
公开(公告)号:US08043878B2
公开(公告)日:2011-10-25
申请号:US12379561
申请日:2009-02-25
申请人: Ta-Cheng Hsu , Jung-Min Hwang , Min-Hsun Liu , Ya-Lan Yang , De-Shan Kuo , Tsun-Kai Ko , Chien-Fu Shen , Ting-Chia Ko , Schang-Jing Hon
发明人: Ta-Cheng Hsu , Jung-Min Hwang , Min-Hsun Liu , Ya-Lan Yang , De-Shan Kuo , Tsun-Kai Ko , Chien-Fu Shen , Ting-Chia Ko , Schang-Jing Hon
IPC分类号: H01L21/00
CPC分类号: H01L33/0095
摘要: A method for manufacturing a light-emitting device comprising the steps of cutting a light-emitting unit by a laser beam, and cleaning the light-emitting unit by an acid solution to remove by-products resulted from the laser cutting.
摘要翻译: 一种发光装置的制造方法,其特征在于,包括以下步骤:用激光束切割发光单元,用酸溶液清洗发光单元,除去激光切割产生的副产物。
-
公开(公告)号:USD644188S1
公开(公告)日:2011-08-30
申请号:US29367759
申请日:2010-08-12
申请人: Chien-Fu Shen , Tsun-Kai Ko , Schang-Jing Hon
设计人: Chien-Fu Shen , Tsun-Kai Ko , Schang-Jing Hon
-
公开(公告)号:US07675077B2
公开(公告)日:2010-03-09
申请号:US11627013
申请日:2007-01-25
申请人: Shih-Chang Shei , Schang-Jing Hon , Shih-Chen Wei , Juh-Yuh Su
发明人: Shih-Chang Shei , Schang-Jing Hon , Shih-Chen Wei , Juh-Yuh Su
IPC分类号: H01L33/00
CPC分类号: H01L33/0079 , H01L33/387 , H01L2933/0016
摘要: A light-emitting diode (LED) and a method for manufacturing the same are described. The light-emitting diode comprises: a conductive substrate including a first surface and a second surface opposite to the first surface; a metal bonding layer deposed on the first surface of the conductive substrate; a reflective metal layer deposed on the metal bonding layer; an N-type semiconductor layer deposed on the reflective metal layer; an active layer deposed on the N-type semiconductor layer; a P-type semiconductor layer deposed on the active layer; a window layer deposed on the P-type semiconductor layer, wherein a thickness of the window layer is substantially at least 50 μm, and the window layer is composed of a transparent conductive material; and a P-type electrode deposed on the window layer.
摘要翻译: 对发光二极管(LED)及其制造方法进行说明。 发光二极管包括:导电基板,包括第一表面和与第一表面相对的第二表面; 金属接合层,其设置在所述导电性基板的第一面上; 反射金属层,其设置在金属接合层上; 放置在反射金属层上的N型半导体层; 位于N型半导体层上的有源层; 位于有源层上的P型半导体层; 窗口层位于P型半导体层上,其中窗口层的厚度基本上至少为50μm,窗口层由透明导电材料构成; 以及放置在窗口层上的P型电极。
-
公开(公告)号:US20060267038A1
公开(公告)日:2006-11-30
申请号:US11496547
申请日:2006-08-01
申请人: Mu-Jen Lai , Schang-Jing Hon
发明人: Mu-Jen Lai , Schang-Jing Hon
IPC分类号: H01L33/00
CPC分类号: H01L33/50 , H01L33/08 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49107 , H01L2924/00014
摘要: A manufacturing method and device for white light emitting comprise at least two light emitting layers capable of emitting the light with the wavelengths of λ1 and λ2. Upon absorbing the light with the wavelength of one light emitting layer by at least one kind of fluorescent material, the light with the wavelength of λ3 is emitted and then mixed together with the light with the other wavelength so as to output the white light for use. Then, the fluorescent material formed on the light emitting layer of the light emitting device is packed together with said light emitting device, and then the assembly is the white light emitting device with high color rendering index of this invention.
摘要翻译: 用于白光发射的制造方法和装置包括能够发射波长为λ1和λ2的光的至少两个发光层。 在通过至少一种荧光材料吸收一个发光层的波长的光时,发射波长λ3的光,然后与另一个波长的光一起混合,以输出白光用于 。 然后,将形成在发光器件的发光层上的荧光材料与所述发光器件一起包装,然后组装为本发明的高显色指数的白色发光器件。
-
-
-
-
-
-
-
-
-