摘要:
A voltage converter for supporting a suspension-to-RAM (STR) mode of power management. The voltage converter has a flip-flop, a resume & initialization logic circuit for producing a resume signal, a STR logic circuit for producing a STR signal, a first voltage-conversion unit and a second voltage-conversion unit. An output terminal of the resume & initialization logic circuit is connected to a first input terminal of the flip-flop. An output terminal of the STR logic circuit is connected to a second input terminal of the flip-flop. An output terminal of the flip-flop is connected to the first voltage-conversion unit, and a complementary output terminal of the flip-flop is connected to the second voltage-conversion unit. A suspension voltage or a power voltage is applied to the voltage pin of a system memory depending on the mode of power management.
摘要:
A memory access control method and system is provided for use on a computer system having a CPU and a memory unit for controlling the memory access operation by the CPU to the memory unit. The memory unit is of the type having an auto-precharge feature. By this method and system, a CPU interface is coupled to the CPU, which is capable of promptly issuing an internal read-request signal in response to each read request from the CPU and is further capable of generating a cross-page signal concurrently with the internal read-request signal in the event that the data requested by the read request are located in a closed page in the memory unit. Furthermore, a memory control unit is coupled between the CPU interface and the memory unit, which is capable of issuing a normal read-enable signal to the memory unit in the event that the next internal read-request signal is received without having an accompanying cross-page signal before the read operation for the current read request is performed, and is further capable of issuing a read-with-auto-precharge enable signal to the memory unit in the event that the next internal read-request signal is received together with an accompanying cross-page signal before the read operation for the current read request is performed, the read-with-auto-precharge enable signal causing the memory unit to perform an auto-precharging operation after the read operation for the current read request is completed.
摘要:
A multi-option setting device is provided for use in association with a connecting pin of a chipset for the purpose of allowing user-selection from more than two setting options to set the chipset to perform one of more than two I/O functions through the associated connecting pin. The multi-option setting device includes voltage setting means for generating a user-specified input voltage; a voltage comparison circuit for use to determine which prespecified voltage range the user-specified input voltage lies; a latch circuit for latching the output of the voltage comparison circuit; and a control unit for setting the connecting pin to the user-selected I/O function corresponding to the user-specified input voltage. The user-specified input voltage is obtained from an externally-connected voltage divider and is compared by the voltage comparison circuit to determine which voltage range the user-specified input voltage lies to thereby generate an output logic signal whose value corresponds to the desired option. This allows the associated connecting pin to be optionally set to be used for a user-specified I/O function. Preferably, the connecting pin is a loudspeaker connecting pin. This multi-option setting device allows the user to select from more than two options, while nevertheless allowing the overall system to operate normally without being affected by the setting.
摘要:
A trace layout of a printed circuit board (PCB) is provided with a north bridge, at least a peripheral component interconnect (PCI) slot, and an accelerate graphics port (AGP) slot. The PCB includes at least a first trace layer and a second trace layer under the first trace layer. The AGP slot is mounted between the north bridge and the PCI slot. The PCB further includes a number of first traces, and a number of second traces. The first traces are used for connecting the north bridge to the PCI slot while the second traces are used to connect the north bridge to the AGP slot. Some of the first traces are on the second trace layer under the AGP slot, while the other of the first traces are on the first trace layer or the second trace layer and trace aside the AGP slot. Most of the second traces are on the first trace layer and the other of the second traces are on the second trace layer.
摘要:
A memory control system for controlling write-enable signals. The memory control system has a first memory slot having a write-enable pin thereon, a second memory slot having a first write-enable pin and a second write-enable pin thereon and a control chipset having a write-enable pin and a dual-purpose write-enable/memory-parity-data pin thereon. The write-enable pin of the control chipset is connected to the write-enable pin of the first memory slot and the first write-enable pin of the second memory slot. The write-enable/memory-parity-data pin of the control chipset is connected to the second write-enable pin of the second memory slot. In this invention, since the design of the write-enable system is more flexible, length of trace line on a computer board can be greatly reduced. In addition, the system permits the incorporation of one cycle (1T) timing into design of memory access commands.
摘要:
An impedance adjusting apparatus of a controlling chip on a computer mainboard. When a computer is turned on, BIOS automatically detects the actual usage of the memory sockets, and then sends corresponding control signals to adjust the impedance of the impedance adjusting apparatus for a better impedance matching between the controlling chip and the memory sockets. The signal reflection is dramatically reduced and the operation bandwidth is widened.
摘要:
A method for reducing power consumption of a computer system in a working state is provided. The computer system comprises a processor, a memory and a chipset, and the processor is connected with the chipset through a processor bus. The method comprises classifying the power saving level of the computer system into a predetermined number of power saving modes, checking at least one power saving mode transition condition to determine whether to automatically raise the power saving mode of the computer system, and raising the power saving mode of the computer system by lowering a first voltage supply level of the chipset and a second voltage supply level of the memory and decreasing a first working frequency of the processor bus and a second working frequency of the memory. The power consumption of the computer system is further reduced in comparison with a normal working state when the power saving mode of the computer system is further raised.
摘要:
A package substrate for a multi-package module. The package substrate comprises a substrate having a die region and at least one thermal channel region outwardly extending to an edge of the substrate from the die region. An array of bumps is arranged on the substrate except in the die and thermal channel regions, in which the interval between the bumps is narrower than the width of the thermal channel region. An electronic device with a package substrate is also disclosed.
摘要:
A method for dynamically increasing the data processing capability of a computer system is provided. The computer system comprises a processor, a memory and a chipset. The data processing capability of the computer system is classified into a predetermined number of performance enhancing modes. At least one performance enhancing mode transition condition is checked to determine whether to automatically raise the performance enhancing mode of the computer system. The processor is suspended from using the processor bus during the transition of the performance enhancing mode of the computer system. The performance enhancing mode of the computer system is raised by increasing a first working frequency of the processor, a second working frequency of the processor bus and a third working frequency of the memory. The data processing rate of the computer system is further increased when the performance enhancing mode of the computer system is further raised.
摘要:
A printed circuit board (PCB) with an improved thermal dissipating structure for a package substrate of a multi-package module (MPM). A first upper metal layer is on a substrate and corresponds to the package substrate. A second upper metal layer is on the substrate outside the package substrate. An inner metal layer is in the substrate. Pluralities of first and second heat conductive vias are in the substrate to thermally connect the inner metal layer to the first and second upper metal layers, respectively. An electronic device with an improved thermal dissipating structure is also disclosed.