摘要:
The present invention provides methods, devices and device components for fabricating patterns on substrate surfaces, particularly patterns comprising structures having microsized and/or nanosized features of selected lengths in one, two or three dimensions and including relief and recess features with variable height, depth or height and depth. Composite patterning devices comprising a plurality of polymer layers each having selected mechanical and thermal properties and physical dimensions provide high resolution patterning on a variety of substrate surfaces and surface morphologies. Gray-scale ink lithography photomasks for gray-scale pattern generation or molds for generating embossed relief features on a substrate surface are provided. The particular shape of the fabricated patterned can be manipulated by varying the three-dimensional recess pattern on an elastomeric patterning device which is brought into conformal contact with a substrate to localize patterning agent to the recess portion of the pattern.
摘要:
A tracking photovoltaic solar system, and methods for installing or for using such tracking comprising at least a dual axis tracker unit maintaining an array of photovoltaic modules aligned to the sun. Said tracker unit includes: a pair of sub-frames supporting photovoltaic modules, a torque tube supporting said subframes rotating around a primary rotation axis, a pole structure fixed and extending vertically above an anchoring basis and being rotatively connected to said longitudinal support, secondary rotating means controlling the orientation of said sub-frames around corresponding secondary rotation axis of said sub-frames, said secondary rotation axis being orthogonal to said primary rotation axis and actuators means for controlling said primary and secondary rotating means. The secondary rotation axis are located at each end of said torque tube, said pole structure being central with regard to said sub-frames and said actuators means of both primary and secondary rotating means are linear.
摘要:
An electroluminescent device having a plurality of current driven pixels arranged in rows and columns, such that when current is provided to a pixel it produces light, including each pixel having first and second electrodes and current responsive electroluminescent media disposed between the first and second electrodes; at least one chiplet having a thickness less than 20 micrometers; including transistor drive circuitry for controlling the operation of at least four pixels, the chiplet being mounted on a substrate and having connection pads; a planarization layer disposed over at least a portion of the chiplet; a first conductive layer over the planarization layer and connected to at least one of the connection pads; and a structure for providing electrical signals through the first conductive layer and at least one of the connection pads of the chiplet so that the transistor drive circuitry of the chiplet controls current to the four pixels.
摘要:
The present invention provides methods, devices and device components for fabricating patterns on substrate surfaces, particularly patterns comprising structures having microsized and/or nanosized features of selected lengths in one, two or three dimensions. The present invention provides composite patterning devices comprising a plurality of polymer layers each having selected mechanical properties, such as Young's Modulus and flexural rigidity, selected physical dimensions, such as thickness, surface area and relief pattern dimensions, and selected thermal properties, such as coefficients of thermal expansion, to provide high resolution patterning on a variety of substrate surfaces and surface morphologies.
摘要:
A method for selectively transferring active components (22) from a source substrate (20) to a destination substrate (10) includes providing a source substrate with one or more active components located on the source substrate, providing a destination substrate, locating a selectively curable adhesive layer (30) between and adjacent to the destination substrate and the source substrate, selecting one or more active components (22A), selectively curing area(s) (32A) of the adhesive layer corresponding to the selected active components to adhere the selected active components to the destination substrate, and removing the source substrate from the destination substrate leaving the selected active components adhered to the destination substrate in the selected areas.
摘要:
A concentrator photovoltaic apparatus for controlling internal condensation includes a light receiving module including one or more photovoltaic cells in a waterproof enclosure, at least one primary lens sealed to the waterproof enclosure for concentrating sunlight, a waterproof breather membrane regulating the pressure of the air located inside the enclosure, and a regenerative desiccant in a thermally decoupled dryer tube or thermally coupled to an internal surface of the enclosure. Smaller breather membrane vents and/or positive time delays between the temperature of the desiccant and the temperature of the enclosure may prolong an adsorption phase of the desiccant, which may substantially contribute to efficiency, reliability, and autonomous control of condensation.
摘要:
A method for selectively transferring active components (22) from a source substrate (20) to a destination substrate (10) includes providing a source substrate with one or more active components located on the source substrate, providing a destination substrate, locating a selectively curable adhesive layer (30) between and adjacent to the destination substrate and the source substrate, selecting one or more active components (22A), selectively curing area(s) (32A) of the adhesive layer corresponding to the selected active components to adhere the selected active components to the destination substrate, and removing the source substrate from the destination substrate leaving the selected active components adhered to the destination substrate in the selected areas.
摘要:
Provided are methods and devices for transfer printing of semiconductor elements to a receiving surface. In an aspect, the printing is by conformal contact between an elastomeric stamp inked with the semiconductor elements and a receiving surface, and during stamp removal, a shear offset is applied between the stamp and the receiving surface. The shear-offset printing process achieves high printing transfer yields with good placement accuracy. Process parameter selection during transfer printing, including time varying stamp-backing pressure application and vertical displacement, yields substantially constant delamination rates with attendant transfer printing improvement.