公开(公告)号：US20150372636A1

公开(公告)日：2015-12-24

申请号：US14765600

申请日：2014-02-05

申请人： Etienne MENARD ,  Helioslite

发明人： Etienne Menard

IPC分类号： H02S20/32

CPC分类号： H02S20/32 ,  F24S25/12 ,  F24S25/50 ,  F24S30/455 ,  F24S50/20 ,  F24S2030/115 ,  F24S2030/131 ,  F24S2030/133 ,  F24S2030/136 ,  H02S20/30 ,  Y02B10/20 ,  Y02E10/47 ,  Y02E10/50 ,  Y10T29/49632

摘要： A tracking photovoltaic solar system, and methods for installing or for using such tracking comprising at least a dual axis tracker unit maintaining an array of photovoltaic modules aligned to the sun. Said tracker unit includes: a pair of sub-frames supporting photovoltaic modules, a torque tube supporting said subframes rotating around a primary rotation axis, a pole structure fixed and extending vertically above an anchoring basis and being rotatively connected to said longitudinal support, secondary rotating means controlling the orientation of said sub-frames around corresponding secondary rotation axis of said sub-frames, said secondary rotation axis being orthogonal to said primary rotation axis and actuators means for controlling said primary and secondary rotating means. The secondary rotation axis are located at each end of said torque tube, said pole structure being central with regard to said sub-frames and said actuators means of both primary and secondary rotating means are linear.

摘要翻译： 跟踪光伏太阳能系统以及用于安装或使用这种跟踪的方法，包括至少保持与太阳对准的光伏模块阵列的双轴跟踪器单元。 所述跟踪单元包括：支撑光伏模块的一对子框架，支撑围绕主旋转轴线旋转的所述子框架的扭矩管，固定并垂直于锚固基础延伸并且可旋转地连接到所述纵向支撑件的杆结构，二次旋转 意味着控制所述子框架在所述子框架的相应次旋转轴线周围的取向，所述副旋转轴线与所述主旋转轴线正交，并且用于控制所述初级和次级旋转装置的致动器装置。 副旋转轴位于所述扭矩管的每一端，所述极结构相对于所述子框架是中心的，并且初级和次级旋转装置的所述致动器装置是线性的。

公开(公告)号：US09412727B2

公开(公告)日：2016-08-09

申请号：US13237375

申请日：2011-09-20

申请人： Etienne Menard ,  John A. Rogers ,  Seok Kim ,  Andrew Carlson

发明人： Etienne Menard ,  John A. Rogers ,  Seok Kim ,  Andrew Carlson

IPC分类号： B29C59/02 ,  H01L21/683 ,  H01L25/00 ,  H01L23/482

CPC分类号： H01L21/67132 ,  B32B9/005 ,  B32B37/025 ,  B32B37/16 ,  B32B41/00 ,  B32B2313/00 ,  B32B2457/14 ,  B41F16/00 ,  H01L21/67144 ,  H01L21/6835 ,  H01L23/4821 ,  H01L25/50 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/32145 ,  H01L2224/83192

摘要： In a method of printing a transferable component, a stamp including an elastomeric post having three-dimensional relief features protruding from a surface thereof is pressed against a component on a donor substrate with a first pressure that is sufficient to mechanically deform the relief features and a region of the post between the relief features to contact the component over a first contact area. The stamp is retracted from the donor substrate such that the component is adhered to the stamp. The stamp including the component adhered thereto is pressed against a receiving substrate with a second pressure that is less than the first pressure to contact the component over a second contact area that is smaller than the first contact area. The stamp is then retracted from the receiving substrate to delaminate the component from the stamp and print the component onto the receiving substrate. Related apparatus and stamps are also discussed.

摘要翻译： 在印刷可转印部件的方法中，包括具有从其表面突出的三维浮雕特征的弹性体柱的印模被压制在供体基板上的部件上，该第一压力足以使浮雕特征机械地变形，并且 位于浮雕特征之间的柱的区域，以在第一接触区域上接触部件。 印模从供体基板缩回，使得该部件粘附到印模上。 包括附着在其上的部件的印模被压在接受基板上，第二压力小于在小于第一接触面积的第二接触面积上接触部件的第一压力。 然后将印模从接收基板缩回以从印模分离该部件并将该部件打印到接收基板上。 还讨论了相关装置和邮票。

公开(公告)号：US09165989B2

公开(公告)日：2015-10-20

申请号：US13395813

申请日：2010-09-16

申请人： Christopher Bower ,  Etienne Menard ,  John Hamer ,  Ronald S. Cok

发明人： Christopher Bower ,  Etienne Menard ,  John Hamer ,  Ronald S. Cok

IPC分类号： H01L27/32

CPC分类号： H01L27/3255 ,  G01R31/28 ,  H01L27/3225 ,  H01L27/3248 ,  H01L27/3276 ,  H01L2227/323

摘要： A large-format substrate with distributed control elements is formed by providing a substrate and a wafer, the wafer having a plurality of separate, independent chiplets formed thereon; imaging the wafer and analyzing the wafer image to determine which of the chiplets are defective; removing the defective chiplet(s) from the wafer leaving remaining chiplets in place on the wafer; printing the remaining chiplet(s) onto the substrate forming empty chiplet location(s); and printing additional chiplet(s) from the same or a different wafer into the empty chiplet location(s).

摘要翻译： 具有分布式控制元件的大格式基板通过提供基板和晶片形成，晶片具有形成在其上的多个独立的独立小芯片; 对晶片成像并分析晶片图像以确定哪些小芯片是有缺陷的; 从晶片上除去有缺陷的小芯片，剩下的小芯片就位于晶片上; 将剩余的小瓶印刷到形成空的小瓶位置的基底上; 以及从相同或不同的晶片将另外的一个或多个微芯片打印到空的小瓶位置。

公开(公告)号：US20120228669A1

公开(公告)日：2012-09-13

申请号：US13395813

申请日：2010-09-16

申请人： Christopher Bower ,  Etienne Menard ,  John Hamer ,  Ronald S. Cok

发明人： Christopher Bower ,  Etienne Menard ,  John Hamer ,  Ronald S. Cok

IPC分类号： H01L33/00 ,  H01L21/66

CPC分类号： H01L27/3255 ,  G01R31/28 ,  H01L27/3225 ,  H01L27/3248 ,  H01L27/3276 ,  H01L2227/323

摘要： A large-format substrate with distributed control elements is formed by providing a substrate and a wafer, the wafer having a plurality of separate, independent chiplets formed thereon; imaging the wafer and analyzing the wafer image to determine which of the chiplets are defective; removing the defective chiplet(s) from the wafer leaving remaining chiplets in place on the wafer; printing the remaining chiplet(s) onto the substrate forming empty chiplet location(s); and printing additional chiplet(s) from the same or a different wafer into the empty chiplet location(s).

摘要翻译： 具有分布式控制元件的大格式基板通过提供基板和晶片形成，晶片具有形成在其上的多个独立的独立小芯片; 对晶片成像并分析晶片图像以确定哪些小芯片是有缺陷的; 从晶片上除去有缺陷的小芯片，剩下的小芯片就位于晶片上; 将剩余的小瓶印刷到形成空的小瓶位置的基底上; 以及从相同或不同的晶片将另外的一个或多个微芯片打印到空的小瓶位置。

公开(公告)号：US07943491B2

公开(公告)日：2011-05-17

申请号：US11423192

申请日：2006-06-09

申请人： Ralph G. Nuzzo ,  John A. Rogers ,  Etienne Menard ,  Keon Jae Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu

发明人： Ralph G. Nuzzo ,  John A. Rogers ,  Etienne Menard ,  Keon Jae Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu

IPC分类号： H01L29/72

CPC分类号： H01L29/0665 ,  B82Y10/00 ,  B82Y20/00 ,  H01L29/0673 ,  H01L29/1606 ,  H01L29/78603 ,  H01L31/035281 ,  H01L31/0392 ,  H01L31/03925 ,  H01L31/072 ,  H01L31/109 ,  H01L31/18 ,  H01L31/1804 ,  H01L31/1892 ,  H01L2924/12041 ,  H01L2924/13091 ,  Y02E10/547 ,  Y02P70/521 ,  H01L2924/00

摘要： The present invention provides methods, systems and system components for transferring, assembling and integrating features and arrays of features having selected nanosized and/or microsized physical dimensions, shapes and spatial orientations. Methods of the present invention utilize principles of ‘soft adhesion’ to guide the transfer, assembly and/or integration of features, such as printable semiconductor elements or other components of electronic devices. Methods of the present invention are useful for transferring features from a donor substrate to the transfer surface of an elastomeric transfer device and, optionally, from the transfer surface of an elastomeric transfer device to the receiving surface of a receiving substrate. The present methods and systems provide highly efficient, registered transfer of features and arrays of features, such as printable semiconductor element, in a concerted manner that maintains the relative spatial orientations of transferred features.

摘要翻译： 本发明提供用于传送，组装和集成特征的阵列的方法，系统和系统组件，其具有所选择的纳米尺寸和/或微尺寸的物理尺寸，形状和空间取向。 本发明的方法利用“软粘附”的原理来引导诸如可印刷半导体元件或电子器件的其它部件的特征的转移，组装和/或集成。 本发明的方法可用于将特征从供体基底转移到弹性体转移装置的转移表面，并且可选地从弹性体转移装置的转移表面转移到接收基底的接收表面。 本方法和系统以一致的方式提供特征和特征阵列的高效，注册传输，例如可印刷半导体元件，其保持所传送特征的相对空间取向。

公开(公告)号：US07932123B2

公开(公告)日：2011-04-26

申请号：US11858788

申请日：2007-09-20

申请人： John A. Rogers ,  Ralph G. Nuzzo ,  Matthew Meitl ,  Heung Cho Ko ,  Jongseung Yoon ,  Etienne Menard ,  Alfred J. Baca

发明人： John A. Rogers ,  Ralph G. Nuzzo ,  Matthew Meitl ,  Heung Cho Ko ,  Jongseung Yoon ,  Etienne Menard ,  Alfred J. Baca

IPC分类号： H01L21/00 ,  H01L21/31

CPC分类号： H01L31/0735 ,  B81C1/0046 ,  B81C2201/0191 ,  B82Y10/00 ,  B82Y20/00 ,  B82Y40/00 ,  H01L21/7813 ,  H01L29/155 ,  H01L29/20 ,  H01L31/03046 ,  H01L31/068 ,  H01L31/0687 ,  H01L31/072 ,  H01L31/0725 ,  H01L31/184 ,  H01L31/1844 ,  H01L33/0079 ,  H01L2924/0002 ,  Y02E10/52 ,  Y02E10/544 ,  Y02E10/547 ,  Y02P70/521 ,  Y10T156/1195 ,  H01L2924/00

摘要： Provided are methods for making a device or device component by providing a multilayer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.

摘要翻译： 提供了通过提供具有多个功能层和多个释放层的多层结构来制造器件或器件部件的方法，并且通过分离一个或多个释放层从多层结构释放功能层以产生多个 可转让结构。 可转移结构被印刷到由器件衬底支撑的器件衬底或器件部件上。 该方法和系统提供制造高质量和低成本的光伏器件，可转移的半导体结构（光电）器件和器件部件的手段。

公开(公告)号：US07927976B2

公开(公告)日：2011-04-19

申请号：US12177963

申请日：2008-07-23

申请人： Etienne Menard

发明人： Etienne Menard

IPC分类号： H01L21/00 ,  B41L47/04 ,  B29C33/40 ,  B29C39/22 ,  B29C65/70

CPC分类号： G03F7/0002 ,  B82Y10/00 ,  B82Y40/00

摘要： Provided are reinforced composite stamps, devices and methods of making the reinforced composite stamps disclosed herein. Reinforced composite stamps of certain aspects of the present invention have a composition and architecture optimized for use in printing systems for dry transfer printing of semiconductor structures, and impart excellent control over relative spatial placement accuracy of the semiconductor structures being transferred. In some embodiments, for example, reinforced composite stamps of the present invention allow for precise and repeatable vertical motion of the patterned surface of the printing apparatus with self-leveling of the stamp to the surface of a contacted substrate. Reinforced composite stamps of certain aspect of the present invention achieve a uniform distribution of contact forces between the printing apparatus patterned surface and the top surface of a substrate being contacted by the reinforced composite stamp of the printing apparatus.

摘要翻译： 提供了制造本文公开的增强复合印模的增强复合印模，装置和方法。 本发明的某些方面的加强复合印模具有优化用于半导体结构的干转移印刷的印刷系统中的组成和结构，并且对被转印的半导体结构的相对空间放置精度赋予优异的控制。 在一些实施例中，例如，本发明的增强复合印模允许印刷设备的图案化表面的精确和可重复的垂直运动，其中印模自动调平到接触的基底的表面。 本发明某一方面的加强复合印模实现了打印设备图案化表面与基片顶表面之间的接触力的均匀分布，该印刷设备的表面与印刷设备的增强复合印模接触。

公开(公告)号：US20100018420A1

公开(公告)日：2010-01-28

申请号：US12177963

申请日：2008-07-23

申请人： Etienne Menard

发明人： Etienne Menard

IPC分类号： B41K1/42

CPC分类号： G03F7/0002 ,  B82Y10/00 ,  B82Y40/00

摘要： Provided are reinforced composite stamps, devices and methods of making the reinforced composite stamps disclosed herein. Reinforced composite stamps of certain aspects of the present invention have a composition and architecture optimized for use in printing systems for dry transfer printing of semiconductor structures, and impart excellent control over relative spatial placement accuracy of the semiconductor structures being transferred. In some embodiments, for example, reinforced composite stamps of the present invention allow for precise and repeatable vertical motion of the patterned surface of the printing apparatus with self-leveling of the stamp to the surface of a contacted substrate. Reinforced composite stamps of certain aspect of the present invention achieve a uniform distribution of contact forces between the printing apparatus patterned surface and the top surface of a substrate being contacted by the reinforced composite stamp of the printing apparatus.

摘要翻译： 提供了制造本文公开的增强复合印模的增强复合印模，装置和方法。 本发明的某些方面的加强复合印模具有优化用于半导体结构的干转移印刷的印刷系统中的组成和结构，并且对被转印的半导体结构的相对空间放置精度赋予优异的控制。 在一些实施例中，例如，本发明的增强复合印模允许印刷设备的图案化表面的精确和可重复的垂直运动，其中印模自动调平到接触的基底的表面。 本发明某一方面的加强复合印模实现了打印设备图案化表面与基片顶表面之间的接触力的均匀分布，该印刷设备的表面与印刷设备的增强复合印模接触。

公开(公告)号：US07622367B1

公开(公告)日：2009-11-24

申请号：US11145574

申请日：2005-06-02

申请人： Ralph G. Nuzzo ,  John A. Rogers ,  Etienne Menard ,  Keon Jae Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu

发明人： Ralph G. Nuzzo ,  John A. Rogers ,  Etienne Menard ,  Keon Jae Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu

IPC分类号： H01L21/322

CPC分类号： H01L29/76 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02521 ,  H01L21/02603 ,  H01L21/02628 ,  H01L21/308 ,  H01L21/322 ,  H01L21/6835 ,  H01L23/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/04 ,  H01L29/06 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/12 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03926 ,  H01L31/1804 ,  H01L31/1864 ,  H01L31/1896 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/32 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/03 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/03614 ,  H01L2224/0362 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2224/08225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/80 ,  H01L2224/80006 ,  H01L2224/80121 ,  H01L2224/80862 ,  H01L2224/80895 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15788 ,  H01L2924/1579 ,  Y02E10/547 ,  Y02P70/521 ,  Y10S977/707 ,  Y10S977/724 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

摘要翻译： 本发明提供了用于制造可印刷半导体元件并将可印制半导体元件组装到衬底表面上的方法和装置。 本发明的方法，装置和装置部件能够在包含聚合物材料的基底上产生宽范围的灵活的电子和光电器件和器件阵列。 本发明还提供了拉伸配置中能够具有良好性能的可拉伸半导体结构和可拉伸电子器件。

公开(公告)号：US07557367B2

公开(公告)日：2009-07-07

申请号：US11145542

申请日：2005-06-02

申请人： John A. Rogers ,  Dahl-Young Khang ,  Etienne Menard

发明人： John A. Rogers ,  Dahl-Young Khang ,  Etienne Menard

IPC分类号： H01L29/72

CPC分类号： H01L29/76 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02521 ,  H01L21/02603 ,  H01L21/02628 ,  H01L21/308 ,  H01L21/322 ,  H01L21/6835 ,  H01L23/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/04 ,  H01L29/06 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/12 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03926 ,  H01L31/1804 ,  H01L31/1864 ,  H01L31/1896 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/32 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/03 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/03614 ,  H01L2224/0362 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2224/08225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/80 ,  H01L2224/80006 ,  H01L2224/80121 ,  H01L2224/80862 ,  H01L2224/80895 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15788 ,  H01L2924/1579 ,  Y02E10/547 ,  Y02P70/521 ,  Y10S977/707 ,  Y10S977/724 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

摘要翻译： 本发明提供了用于制造可印刷半导体元件并将可印刷半导体元件组装到衬底表面上的方法和装置。 本发明的方法，装置和装置部件能够在包含聚合物材料的基底上产生宽范围的灵活的电子和光电器件和器件阵列。 本发明还提供了拉伸配置中能够具有良好性能的可拉伸半导体结构和可拉伸电子器件。