Curable organopolysiloxane composition and method for adhering a
substrate to an adherend using the composition
    51.
    发明授权
    Curable organopolysiloxane composition and method for adhering a substrate to an adherend using the composition 失效
    可固化的有机聚硅氧烷组合物和使用该组合物将基材粘合到被粘物上的方法

    公开(公告)号:US5684113A

    公开(公告)日:1997-11-04

    申请号:US748219

    申请日:1996-11-12

    摘要: A curable organopolysiloxane composition that maintains flowability under moisture-free and light blocking conditions, more rapidly forms a nonflowable adhesive when irradiated with high energy beams such as ultraviolet rays and electron beams, and forms an elastic body by further curing when exposed to atmospheric moisture. It also involves a method for adhering a substrate to an adherend using the composition. The curable organosiloxane composition has a viscosity of 3,000 Pa.s or less and is made up of a silicone resin containing no alkenyl groups, a polydiorganosiloxane having terminal units containing a mercapto group, an alkenyl-containing organopolysiloxane, and a condensation-reaction-promoting catalyst. An assembly which has a substrates adhered to an adherend is made by spreading the composition on the substrate, irradiating it with a high energy beam, contacting the irradiated surface with an adherend, and letting it stand in air, so that the substrate is adhered to the adherend.

    摘要翻译: 一种可固化的有机聚硅氧烷组合物,其在无水和光遮蔽条件下保持流动性,当用诸如紫外线和电子束的高能量束照射时,更迅速地形成不可流动的粘合剂,并且当暴露于大气湿气时通过进一步固化形成弹性体。 它还涉及使用该组合物将基底粘附到被粘物上的方法。 可固化的有机硅氧烷组合物的粘度为3,000Pa·s或更低,并且由不含烯基的有机硅树脂,具有含巯基的末端单元的聚二有机硅氧烷,含链烯基的有机聚硅氧烷和缩合反应促进 催化剂。 具有粘附到被粘物上的基板的组件是通过将该组合物铺展在基板上,用高能束照射,使被照射表面与被粘物接触,并将其放置在空气中,使基板粘附到 被粘物

    Method for the production of acryloxy-containing organopolysiloxane and
the acryloxy cyclohexyl organopolysiloxanes
    52.
    发明授权
    Method for the production of acryloxy-containing organopolysiloxane and the acryloxy cyclohexyl organopolysiloxanes 失效
    制备含丙烯酰氧基的有机聚硅氧烷和丙烯酰氧基环己基有机聚硅氧烷的方法

    公开(公告)号:US4777233A

    公开(公告)日:1988-10-11

    申请号:US125649

    申请日:1987-11-25

    CPC分类号: C08G77/38

    摘要: A method of producing acryloxy containing organopolysiloxanes by reacting an epoxy containing organopolysiloxane with an acrylic acid or methacrylic acid followed by a reaction with acryloyl chloride or methacryloyl chloride. The novel acryloxy or methacryloxy cyclohexyl containing organopolysiloxanes are useful as compositions which cure by radiation, such as ultraviolet or electron beam. The compositions containing the acryloxy or methacryloxy cyclohexyl containing organopolysiloxanes can also contain other ingredients which are useful in radiation curable compositions, such as photoinitiators in ultraviolet radiation curable compositions.

    摘要翻译: 通过使含环氧基的有机聚硅氧烷与丙烯酸或甲基丙烯酸反应,然后与丙烯酰氯或甲基丙烯酰氯反应来生产含有丙烯酰氧基的有机聚硅氧烷的方法。 新型丙烯酰氧基或甲基丙烯酰环己基的有机聚硅氧烷可用作通过辐射固化的组合物,例如紫外线或电子束。 包含丙烯酰氧基或甲基丙烯酰氧基环己基的有机聚硅氧烷的组合物还可以含有其它可用于可辐射固化组合物的成分,例如紫外线辐射固化组合物中的光引发剂。

    Curable silicone composition, cured product thereof, and optical semiconductor device
    53.
    发明授权
    Curable silicone composition, cured product thereof, and optical semiconductor device 有权
    可固化硅酮组合物,其固化产物和光学半导体装置

    公开(公告)号:US09045667B2

    公开(公告)日:2015-06-02

    申请号:US14344919

    申请日:2012-09-13

    摘要: A curable silicone composition which comprises: (A) an organopolysiloxane represented by an average unit formula; (B) an organopolysiloxane that has not more than 10 silicon atoms wherein from 30 to 60 mole % of all silicon-bonded organic groups therein are C2-6191 alkenyl groups; (C) an organopolysiloxane represented by a general formula; (D) an organopolysiloxane that has at least two silicon-bonded hydrogen atoms in one molecule wherein from 20 to 70 mole % of all silicon-bonded organic groups therein are phenyl groups; (E) a hydrosilylation reaction catalyst; (F) a white pigment; (G) a nonspherical silica or a glass fiber; and (H) a spherical silica, exhibits an excellent moldability and forms a cured product that exhibits little heat- and/or light-induced discoloration, little heat- and/or light-induced decline in mechanical strength, a high light reflectance, and an excellent dimensional stability.

    摘要翻译: 一种可固化有机硅组合物,其包含:(A)由平均单元式表示的有机聚硅氧烷; (B)具有不超过10个硅原子的有机聚硅氧烷,其中所有与硅键合的有机基团的30至60摩尔%为C2-6191烯基; (C)由通式表示的有机聚硅氧烷; (D)在一个分子中具有至少两个与硅键合的氢原子的有机聚硅氧烷,其中所有与硅键合的有机基团的20至70摩尔%为苯基; (E)氢化硅烷化反应催化剂; (F)白色颜料; (G)非球形二氧化硅或玻璃纤维; 和(H)球形二氧化硅,显示出优异的成型性,并形成固化产物,其几乎不发生热和/或光诱导的变色,几乎没有热和/或光诱导的机械强度下降,高反射率和 极好的尺寸稳定性。

    Cross-Linkable Silicone Composition And Cross-Linked Product Thereof
    55.
    发明申请
    Cross-Linkable Silicone Composition And Cross-Linked Product Thereof 有权
    可交联硅胶组合物及其交联产品

    公开(公告)号:US20140221581A1

    公开(公告)日:2014-08-07

    申请号:US14126140

    申请日:2012-06-07

    申请人: Makoto Yoshitake

    发明人: Makoto Yoshitake

    IPC分类号: C08G77/38

    摘要: A cross-linkable silicone composition comprising at least the following components: (A) an organopolysiloxane represented by an average unit formula and containing phenyl and alkenyl groups; (B) an organopolysiloxane represented by a general formula and containing phenyl and alkenyl groups; (C) an organopolysiloxane having in one molecule at least one phenyl group and two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst, can be cross-linked by a hydrosilylation reaction and forms a solid body which has high hardness at room temperature and becomes significantly soft or a liquefied at high temperature.

    摘要翻译: 一种可交联的硅氧烷组合物,其至少包含以下组分:(A)由平均单元式表示并含有苯基和烯基的有机聚硅氧烷; (B)由通式表示并含有苯基和烯基的有机聚硅氧烷; (C)在一个分子中具有至少一个苯基和两个与硅键合的氢原子的有机聚硅氧烷; 和(D)氢化硅烷化催化剂可以通过氢化硅烷化反应进行交联,并形成在室温下具有高硬度并变得显着柔软或在高温下液化的固体。

    Curable Organopolysiloxane Composition, Optical Semiconductor Element Sealant, and Optical Semiconductor Device
    56.
    发明申请
    Curable Organopolysiloxane Composition, Optical Semiconductor Element Sealant, and Optical Semiconductor Device 有权
    固化有机聚硅氧烷组合物,光半导体元件密封剂和光半导体器件

    公开(公告)号:US20110227235A1

    公开(公告)日:2011-09-22

    申请号:US13062374

    申请日:2009-09-04

    IPC分类号: H01L23/28 C08G77/04

    摘要: A curable organopolysiloxane composition and an optical semiconductor element sealant, each comprising (A) a diorganopolysiloxane that has at least 2 alkenyl groups wherein at least 70 mole % of all the siloxane units are methylphenylsiloxane units and the total content of 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane is no more than 5 weight %, (B) an organopolysiloxane that has at least 2 silicon-bonded hydrogen atoms wherein at least 15 mole % of the silicon-bonded organic groups are phenyl groups, and (C) a hydrosilylation reaction catalyst. An optical semiconductor device in which an optical semiconductor element within a housing is sealed with the cured product from the aforementioned composition.

    摘要翻译: 一种可固化的有机聚硅氧烷组合物和光学半导体元件密封剂,每个包含(A)具有至少2个烯基的二有机聚硅氧烷,其中所有硅氧烷单元的至少70摩尔%是甲基苯基硅氧烷单元, 三甲基-1,3,5-三苯基环三硅氧烷和1,3,5,7-四甲基-1,3,5,7-四苯基环四硅氧烷不超过5重量%,(B)具有至少2个硅键合的有机聚硅氧烷 其中至少15摩尔%的与硅键合的有机基团是苯基的氢原子,和(C)氢化硅烷化反应催化剂。 一种光学半导体器件,其中壳体内的光学半导体元件由上述组合物用固化产物密封。

    Additional-curable organopolysiloxane resin composition and an optical material
    59.
    发明授权
    Additional-curable organopolysiloxane resin composition and an optical material 有权
    可额外固化的有机聚硅氧烷树脂组合物和光学材料

    公开(公告)号:US07625986B2

    公开(公告)日:2009-12-01

    申请号:US10581422

    申请日:2004-11-29

    IPC分类号: C08G77/12

    摘要: An addition-curable organopolysiloxane resin composition having, in a state of cued body, a hardness of 60 to 100 at 25 degree C. and 40 to 100 at 150 degree C. as measured in accordance with the provisions of ASTM D2240-86, said composition comprising: (A) 100 parts by weight of an organopolysiloxane resin comprised of at least alkenyl groups and phenyl groups; (B) 10 to 50 parts by weight of an organooligosiloxane comprised of at least alkeyl groups and phenyl groups; (C) 20 to 100 parts by weight of an organohydrogenoligosiloxane of organohydrogenpolysiloxane; and (D) an addition-reaction catalyst in a catalytic quantity; an optical material that is comprised of a cured body produced from aforementioned components (A), (B), and (C) and possesses the aforementioned characteristics.

    摘要翻译: 一种可加成固化的有机基聚硅氧烷树脂组合物,其具有在保证身体状态下在25℃下的硬度为60至100,在150℃下为40至100,根据ASTM D2240-86的规定测量, 组合物,其包含:(A)100重量份至少包含烯基和苯基的有机聚硅氧烷树脂; (B)10至50重量份至少包含烷基和苯基的有机低聚硅氧烷; (C)20〜100重量份的有机氢聚硅氧烷的有机氢聚硅氧烷; 和(D)催化剂的加成反应催化剂; 由上述(A),(B)和(C)成分制成的固化体构成的光学材料,具有上述特性。

    Curable Organopolysiloxane Composition and Semiconductor Device
    60.
    发明申请
    Curable Organopolysiloxane Composition and Semiconductor Device 有权
    固化有机聚硅氧烷组合物和半导体器件

    公开(公告)号:US20090179180A1

    公开(公告)日:2009-07-16

    申请号:US12306049

    申请日:2007-06-18

    IPC分类号: C08F283/12 H01J63/02

    摘要: A curable organopolysiloxane composition comprises at least the following components: an organopolysiloxane (A) represented by the following general formula: R13SiO(R12SiO)mSiR13 (where R1 is a monovalent hydrocarbon group, and “m” is an integer from 0 to 100); an organopolysiloxane (B) represented by the following average unit formula: (R2SiO3/2)a(R22SiO2/2)b(R23SiO1/2)c (where R2 is a monovalent hydrocarbon group, and “a”, “b”, and “c” are specific numbers); an organopolysiloxane (C) having in one molecule on average at least two silicon-bonded aryl groups and on average at least two silicon-bonded hydrogen atoms; and a hydrosilylation-reaction catalyst (D); is characterized by good fillability and curability and that, when cured, forms a cured body that possesses a high refractive index, high light transmissivity, and strong adhesion to various substrates.

    摘要翻译: 可固化的有机基聚硅氧烷组合物至少包含以下组分:由以下通式表示的有机聚硅氧烷(A):R13SiO(R12SiO)mSiR13(其中R1是一价烃基,“m”是0-100的整数); 由下列平均单元式表示的有机聚硅氧烷(B):(R2SiO3 / 2)a(R22SiO2 / 2)b(R23SiO1 / 2)c(其中R2是一价烃基,“a”,“b”和 “c”是具体数字); 在一个分子中平均具有至少两个与硅键合的芳基并且平均具有至少两个与硅键合的氢原子的有机聚硅氧烷(C); 和氢化硅烷化反应催化剂(D); 其特征在于良好的填充性和固化性,并且当固化时,形成具有高折射率,高透光率和对各种基材的强粘附性的固化体。