摘要:
A curable organopolysiloxane composition that maintains flowability under moisture-free and light blocking conditions, more rapidly forms a nonflowable adhesive when irradiated with high energy beams such as ultraviolet rays and electron beams, and forms an elastic body by further curing when exposed to atmospheric moisture. It also involves a method for adhering a substrate to an adherend using the composition. The curable organosiloxane composition has a viscosity of 3,000 Pa.s or less and is made up of a silicone resin containing no alkenyl groups, a polydiorganosiloxane having terminal units containing a mercapto group, an alkenyl-containing organopolysiloxane, and a condensation-reaction-promoting catalyst. An assembly which has a substrates adhered to an adherend is made by spreading the composition on the substrate, irradiating it with a high energy beam, contacting the irradiated surface with an adherend, and letting it stand in air, so that the substrate is adhered to the adherend.
摘要:
A method of producing acryloxy containing organopolysiloxanes by reacting an epoxy containing organopolysiloxane with an acrylic acid or methacrylic acid followed by a reaction with acryloyl chloride or methacryloyl chloride. The novel acryloxy or methacryloxy cyclohexyl containing organopolysiloxanes are useful as compositions which cure by radiation, such as ultraviolet or electron beam. The compositions containing the acryloxy or methacryloxy cyclohexyl containing organopolysiloxanes can also contain other ingredients which are useful in radiation curable compositions, such as photoinitiators in ultraviolet radiation curable compositions.
摘要:
A curable silicone composition which comprises: (A) an organopolysiloxane represented by an average unit formula; (B) an organopolysiloxane that has not more than 10 silicon atoms wherein from 30 to 60 mole % of all silicon-bonded organic groups therein are C2-6191 alkenyl groups; (C) an organopolysiloxane represented by a general formula; (D) an organopolysiloxane that has at least two silicon-bonded hydrogen atoms in one molecule wherein from 20 to 70 mole % of all silicon-bonded organic groups therein are phenyl groups; (E) a hydrosilylation reaction catalyst; (F) a white pigment; (G) a nonspherical silica or a glass fiber; and (H) a spherical silica, exhibits an excellent moldability and forms a cured product that exhibits little heat- and/or light-induced discoloration, little heat- and/or light-induced decline in mechanical strength, a high light reflectance, and an excellent dimensional stability.
摘要:
A curable organopolysiloxane composition comprising: (A) a branched-chain organopolysiloxane that contains in one molecule at least three alkenyl groups and at least 30 mole % of all silicon-bonded organic groups in the form of aryl groups; (B) a linear-chain organopolysiloxane that contains aryl groups and has both molecular terminals capped with diorganohydrogensiloxy groups; (C) a branched-chain organopolysiloxane that contains in one molecule at least three diorganohydrogensiloxy groups and at least 15 mole % of all silicon-bonded organic groups in the form of aryl groups; and (D) a hydrosilylation catalyst. The composition is capable of forming a cured body that has a high index of refraction and strong adhesion to substrates.
摘要:
A cross-linkable silicone composition comprising at least the following components: (A) an organopolysiloxane represented by an average unit formula and containing phenyl and alkenyl groups; (B) an organopolysiloxane represented by a general formula and containing phenyl and alkenyl groups; (C) an organopolysiloxane having in one molecule at least one phenyl group and two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst, can be cross-linked by a hydrosilylation reaction and forms a solid body which has high hardness at room temperature and becomes significantly soft or a liquefied at high temperature.
摘要:
A curable organopolysiloxane composition and an optical semiconductor element sealant, each comprising (A) a diorganopolysiloxane that has at least 2 alkenyl groups wherein at least 70 mole % of all the siloxane units are methylphenylsiloxane units and the total content of 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane is no more than 5 weight %, (B) an organopolysiloxane that has at least 2 silicon-bonded hydrogen atoms wherein at least 15 mole % of the silicon-bonded organic groups are phenyl groups, and (C) a hydrosilylation reaction catalyst. An optical semiconductor device in which an optical semiconductor element within a housing is sealed with the cured product from the aforementioned composition.
摘要:
A curable organopolysiloxane resin composition having a viscosity at 25° C. in the range of 0.001 to 5,000 Pa·s, a total acid number as specified by JIS K 2501 (1992) in the range of 0.0001 to 0.2 mg/g, and light transmittance in a cured state equal to or greater than 80%; an optical part comprised of a cured body of the aforementioned composition. The curable organopolysiloxane resin composition of the invention is characterized by good transparency, low decrease in transmittance when exposed to high temperatures, and excellent adhesion when required.
摘要:
The present invention relates to an active energy ray-curable organopolysiloxane resin composition that comprises an organopolysiloxane resin having an epoxy group and an aromatic hydrocarbon group and a photopolymerization initiator, as well as to a light-transmitting component that comprises cured bodies produced by irradiating the aforementioned organopolysiloxane resin with active-energy rays in the presence of the aforementioned photopolymerization initiator, and to a method for manufacturing the aforementioned light-transmitting component.
摘要:
An addition-curable organopolysiloxane resin composition having, in a state of cued body, a hardness of 60 to 100 at 25 degree C. and 40 to 100 at 150 degree C. as measured in accordance with the provisions of ASTM D2240-86, said composition comprising: (A) 100 parts by weight of an organopolysiloxane resin comprised of at least alkenyl groups and phenyl groups; (B) 10 to 50 parts by weight of an organooligosiloxane comprised of at least alkeyl groups and phenyl groups; (C) 20 to 100 parts by weight of an organohydrogenoligosiloxane of organohydrogenpolysiloxane; and (D) an addition-reaction catalyst in a catalytic quantity; an optical material that is comprised of a cured body produced from aforementioned components (A), (B), and (C) and possesses the aforementioned characteristics.
摘要:
A curable organopolysiloxane composition comprises at least the following components: an organopolysiloxane (A) represented by the following general formula: R13SiO(R12SiO)mSiR13 (where R1 is a monovalent hydrocarbon group, and “m” is an integer from 0 to 100); an organopolysiloxane (B) represented by the following average unit formula: (R2SiO3/2)a(R22SiO2/2)b(R23SiO1/2)c (where R2 is a monovalent hydrocarbon group, and “a”, “b”, and “c” are specific numbers); an organopolysiloxane (C) having in one molecule on average at least two silicon-bonded aryl groups and on average at least two silicon-bonded hydrogen atoms; and a hydrosilylation-reaction catalyst (D); is characterized by good fillability and curability and that, when cured, forms a cured body that possesses a high refractive index, high light transmissivity, and strong adhesion to various substrates.