公开(公告)号：US20060170016A1

公开(公告)日：2006-08-03

申请号：US11047946

申请日：2005-02-01

申请人： Leo Mathew ,  Yang Du ,  Bich-Yen Nguyen ,  Voon-Yew Thean

发明人： Leo Mathew ,  Yang Du ,  Bich-Yen Nguyen ,  Voon-Yew Thean

IPC分类号： H01L29/78 ,  H01L21/336

CPC分类号： H01L29/4983 ,  H01L29/165 ,  H01L29/517 ,  H01L29/665 ,  H01L29/6653 ,  H01L29/6656 ,  H01L29/66628 ,  H01L29/66659 ,  H01L29/7843

摘要： A method of forming a semiconductor device is provided in which a substrate (102) is provided which has a gate dielectric layer (106) disposed thereon, and a gate electrode (116) having first and second sidewalls is formed over the gate dielectric layer. First (146) and second (150) extension spacer structures are formed adjacent the first and second sidewalls, respectively. In the resulting device: (a) the first and second extension spacer structures have different dimensions; (b) the first and second extension spacer structures comprise first and second distinct materials; (c) the device has asymmetric source/drain extensions (162); and/or (d) the device has an oxide layer (160) disposed between the first extension spacer structure and the gate electrode, and either (i) the device has no dielectric layer disposed between the second extension spacer structure and the gate electrode, or (ii) the device has a second dielectric layer disposed between the second extension spacer structure and the gate electrode, and the first dielectric layer is substantially thicker than the second dielectric layer.

摘要翻译： 提供一种形成半导体器件的方法，其中设置有其上设置有栅介质层（106）的衬底（102），并且在栅极介电层上形成具有第一和第二侧壁的栅电极（116）。 分别在第一和第二侧壁附近形成第一（146）和第二（150）延伸间隔结构。 在所得装置中：（a）第一和第二延伸间隔结构具有不同的尺寸; （b）第一和第二延伸间隔结构包括第一和第二不同材料; （c）该器件具有不对称的源极/漏极延伸部分（162）; 和/或（d）所述器件具有设置在所述第一延伸间隔物结构和所述栅电极之间的氧化物层（160），以及（i）所述器件在所述第二延伸间隔物结构和所述栅电极之间没有设置介电层， 或者（ii）该器件具有设置在第二延伸间隔物结构和栅极之间的第二介电层，并且第一介电层基本上比第二介电层更厚。

公开(公告)号：US20060148196A1

公开(公告)日：2006-07-06

申请号：US11028811

申请日：2005-01-03

申请人： Voon-Yew Thean ,  Brian Goolsby ,  Bich-Yen Nguyen ,  Thien Nguyen ,  Tab Stephens

发明人： Voon-Yew Thean ,  Brian Goolsby ,  Bich-Yen Nguyen ,  Thien Nguyen ,  Tab Stephens

IPC分类号： H01L21/76

CPC分类号： H01L29/66636 ,  H01L29/66772 ,  H01L29/78639

摘要： A method of forming a transistor with recessed source/drains in an silicon-on-insulator (SOI) wafer includes forming isolation structures in an active layer of the wafer, where the isolation structures preferably extend through the active layer to a BOX layer of the wafer. An upper portion of the active layer is removed to form a transistor channel structure. A gate dielectric is formed on the channel structure and a gate structure is formed on the gate dielectric. Etching through exposed portions of the gate dielectric, channel structure, and BOX layer is performed and source/drain structures are then grown epitaxially from exposed portions of the substrate bulk. The isolation structure and the BOX layer are both comprised primarily of silicon oxide and the thickness of the isolation structure prevents portions of the BOX layer from being etched.

摘要翻译： 在绝缘体上硅（SOI）晶片中形成具有凹陷源/漏极的晶体管的方法包括在晶片的有源层中形成隔离结构，其中隔离结构优选地延伸穿过有源层到BOX层的BOX层 晶圆。 去除有源层的上部以形成晶体管沟道结构。 在沟道结构上形成栅极电介质，在栅极电介质上形成栅极结构。 执行蚀刻通过栅介质，沟道结构和BOX层的暴露部分，然后从衬底体的暴露部分外延生长源极/漏极结构。 隔离结构和BOX层主要由氧化硅组成，并且隔离结构的厚度防止BOX层的部分被蚀刻。

公开(公告)号：US07067868B2

公开(公告)日：2006-06-27

申请号：US10952676

申请日：2004-09-29

申请人： Voon-Yew Thean ,  Mariam G. Sadaka ,  Ted R. White ,  Alexander L. Barr ,  Venkat R. Kolagunta ,  Bich-Yen Nguyen ,  Victor H. Vartanian ,  Da Zhang

发明人： Voon-Yew Thean ,  Mariam G. Sadaka ,  Ted R. White ,  Alexander L. Barr ,  Venkat R. Kolagunta ,  Bich-Yen Nguyen ,  Victor H. Vartanian ,  Da Zhang

IPC分类号： H01L27/108

CPC分类号： H01L29/785 ,  H01L29/42392 ,  H01L29/66628 ,  H01L29/66742 ,  H01L29/7842 ,  H01L29/78621 ,  H01L29/78648 ,  H01L29/78687

摘要： A semiconductor device (10) is formed by positioning a gate (22) overlying a semiconductor layer (16) of preferably silicon. A semiconductor material (26) of, for example only, SiGe or Ge, is formed adjacent the gate over the semiconductor layer and over source/drain regions. A thermal process diffuses the stressor material into the semiconductor layer. Lateral diffusion occurs to cause the formation of a strained channel (17) in which a stressor material layer (30) is immediately adjacent the strained channel. Extension implants create source and drain implants from a first portion of the stressor material layer. A second portion of the stressor material layer remains in the channel between the strained channel and the source and drain implants. A heterojunction is therefore formed in the strained channel. In another form, oxidation of the stressor material occurs rather than extension implants to form the strained channel.

公开(公告)号：US07037795B1

公开(公告)日：2006-05-02

申请号：US10965964

申请日：2004-10-15

申请人： Alexander L. Barr ,  Olubunmi O. Adetutu ,  Bich-Yen Nguyen ,  Marius K. Orlowski ,  Mariam G. Sadaka ,  Voon-Yew Thean ,  Ted R. White

发明人： Alexander L. Barr ,  Olubunmi O. Adetutu ,  Bich-Yen Nguyen ,  Marius K. Orlowski ,  Mariam G. Sadaka ,  Voon-Yew Thean ,  Ted R. White

IPC分类号： H01L21/336

CPC分类号： H01L29/66772 ,  H01L29/66636 ,  H01L29/78618

摘要： A semiconductor fabrication process includes forming a transistor gate overlying an SOI wafer having a semiconductor top layer over a buried oxide layer (BOX) over a semiconductor substrate. Source/drain trenches, disposed on either side of the gate, are etched into the BOX layer. Source/drain structures are formed within the trenches. A depth of the source/drain structures is greater than the thickness of the top silicon layer and an upper surface of the source/drain structures coincides approximately with the transistor channel whereby vertical overlap between the source/drain structures and the gate is negligible. The trenches preferably extend through the BOX layer to expose a portion of the silicon substrate. The source/drain structures are preferably formed epitaxially and possibly in two stages including an oxygen rich stage and an oxygen free stage. A thermally anneal between the two epitaxial stages will form an isolation dielectric between the source/drain structure and the substrate.

摘要翻译： 半导体制造工艺包括在半导体衬底上的掩埋氧化物层（BOX）上形成半导体顶层的SOI晶片的晶体管栅极。 设置在栅极两侧的源极/漏极沟槽被蚀刻到BOX层中。 源极/漏极结构形成在沟槽内。 源极/漏极结构的深度大于顶部硅层的厚度，并且源极/漏极结构的上表面大致与晶体管沟道重合，源极/漏极结构与栅极之间的垂直重叠可忽略不计。 沟槽优选地延伸穿过BOX层以暴露硅衬底的一部分。 源极/漏极结构优选外延地形成，并且可能包括富氧阶段和无氧阶段的两个阶段。 两个外延级之间的热退火将在源极/漏极结构和衬底之间形成隔离电介质。

公开(公告)号：US07018901B1

公开(公告)日：2006-03-28

申请号：US10954121

申请日：2004-09-29

申请人： Voon-Yew Thean ,  Mariam G. Sadaka ,  Ted R. White ,  Alexander L. Barr ,  Venkat R. Kolagunta ,  Bich-Yen Nguyen ,  Victor H. Vartanian ,  Da Zhang

发明人： Voon-Yew Thean ,  Mariam G. Sadaka ,  Ted R. White ,  Alexander L. Barr ,  Venkat R. Kolagunta ,  Bich-Yen Nguyen ,  Victor H. Vartanian ,  Da Zhang

IPC分类号： H01L21/336

CPC分类号： H01L21/2254 ,  H01L29/665 ,  H01L29/66787 ,  H01L29/7848 ,  H01L29/785 ,  H01L29/78648

摘要： A semiconductor device (10) is formed by positioning a gate (22) overlying a semiconductor layer (16) of preferably silicon. A semiconductor material (26) of, for example only, SiGe or Ge, is formed adjacent the gate over the semiconductor layer and over source/drain regions. A thermal process diffuses the stressor material into the semiconductor layer. Lateral diffusion occurs to cause the formation of a strained channel (17) in which a stressor material layer (30) is immediately adjacent the strained channel. Extension implants create source and drain implants from a first portion of the stressor material layer. A second portion of the stressor material layer remains in the channel between the strained channel and the source and drain implants. A heterojunction is therefore formed in the strained channel. In another form, oxidation of the stressor material occurs rather than extension implants to form the strained channel.

摘要翻译： 半导体器件（10）通过将覆盖在优选硅的半导体层（16）上的栅极（22）定位而形成。 例如仅SiGe或Ge的半导体材料（26）形成在半导体层上方的栅极和源极/漏极区域附近。 热处理将应力源材料扩散到半导体层。 发生横向扩散以形成应变通道（17），其中应力材料层（30）紧邻应变通道。 延伸植入物从应力源材料层的第一部分产生源和漏植入物。 应力源材料层的第二部分保留在应变通道和源极和漏极植入物之间的通道中。 因此，在应变通道中形成异质结。 在另一种形式中，发生应力源材料的氧化而不是延伸植入物以形成应变通道。

公开(公告)号：US07821067B2

公开(公告)日：2010-10-26

申请号：US11836844

申请日：2007-08-10

申请人： Voon-Yew Thean ,  Brian J. Goolsby ,  Linda B. McCormick ,  Bich-Yen Nguyen ,  Colita M. Parker ,  Mariam G. Sadaka ,  Victor H. Vartanian ,  Ted R. White ,  Melissa O. Zavala

发明人： Voon-Yew Thean ,  Brian J. Goolsby ,  Linda B. McCormick ,  Bich-Yen Nguyen ,  Colita M. Parker ,  Mariam G. Sadaka ,  Victor H. Vartanian ,  Ted R. White ,  Melissa O. Zavala

IPC分类号： H01L21/84

CPC分类号： H01L21/84 ,  H01L21/823807 ,  H01L21/823842 ,  H01L21/823857 ,  H01L21/823878 ,  H01L27/1203

摘要： An electronic device can include a first semiconductor portion and a second semiconductor portion, wherein the compositions of the first and second semiconductor portions are different from each other. In one embodiment, the first and second semiconductor portions can have different stresses compared to each other. In one embodiment, the electronic device may be formed by forming an oxidation mask over the first semiconductor portion. A second semiconductor layer can be formed over the second semiconductor portion of the first semiconductor layer and have a different composition compared to the first semiconductor layer. An oxidation can be performed, and a concentration of a semiconductor element (e.g., germanium) within the second portion of the first semiconductor layer can be increased. In another embodiment, a selective condensation may be performed, and a field isolation region can be formed between the first and second portions of the first semiconductor layer.

摘要翻译： 电子设备可以包括第一半导体部分和第二半导体部分，其中第一半导体部分和第二半导体部分的组成彼此不同。 在一个实施例中，第一和第二半导体部分可以具有彼此不同的应力。 在一个实施例中，可以通过在第一半导体部分上形成氧化掩模来形成电子器件。 可以在第一半导体层的第二半导体部分上形成第二半导体层，并且与第一半导体层相比具有不同的组成。 可以进行氧化，并且可以增加第一半导体层的第二部分内的半导体元素（例如锗）的浓度。 在另一个实施例中，可以执行选择性冷凝，并且可以在第一半导体层的第一和第二部分之间形成场隔离区。

公开(公告)号：US07781839B2

公开(公告)日：2010-08-24

申请号：US11694273

申请日：2007-03-30

申请人： Voon-Yew Thean ,  Bich-Yen Nguyen

发明人： Voon-Yew Thean ,  Bich-Yen Nguyen

IPC分类号： H01L27/092

CPC分类号： H01L21/84 ,  H01L21/823807 ,  H01L21/823878 ,  H01L27/1203 ,  H01L27/1207 ,  H01L29/7842

摘要： A semiconductor device (10) comprising a substrate (12) and an oxide layer (14) formed over the substrate is provided. The semiconductor device further includes a first semiconductor layer (16) having a first lattice constant formed directly over the oxide layer. The semiconductor device further includes a second semiconductor layer (26) having a second lattice constant formed directly over the first semiconductor layer, wherein the second lattice constant is different from the first lattice constant.

摘要翻译： 提供一种半导体器件（10），其包括衬底（12）和形成在衬底上的氧化物层（14）。 半导体器件还包括具有直接形成在氧化物层上的第一晶格常数的第一半导体层（16）。 半导体器件还包括具有直接形成在第一半导体层上的第二晶格常数的第二半导体层（26），其中第二晶格常数不同于第一晶格常数。

公开(公告)号：US07700420B2

公开(公告)日：2010-04-20

申请号：US11402395

申请日：2006-04-12

申请人： Voon-Yew Thean ,  Bich-Yen Nguyen ,  Mariam G. Sadaka ,  Victor H. Vartanian ,  Ted R. White

发明人： Voon-Yew Thean ,  Bich-Yen Nguyen ,  Mariam G. Sadaka ,  Victor H. Vartanian ,  Ted R. White

IPC分类号： H01L21/00 ,  H01L21/84

CPC分类号： H01L21/823807 ,  H01L21/823878 ,  H01L21/8258 ,  H01L27/1203

摘要： A substrate includes a first region and a second region. The first region comprises a III-nitride layer, and the second region comprises a first semiconductor layer. A first transistor (such as an n-type transistor) is formed in and on the III-nitride layer, and a second transistor (such as a p-type transistor) is formed in and on the first semiconductor layer. The III-nitride layer may be indium nitride. In the first region, the substrate may include a second semiconductor layer, a graded transition layer over the second semiconductor layer, and a buffer layer over the transition layer, where the III-nitride layer is over the buffer layer. In the second region, the substrate may include the second semiconductor layer and an insulating layer over the second semiconductor layer, where the first semiconductor layer is over the insulating layer.

摘要翻译： 衬底包括第一区域和第二区域。 第一区域包括III族氮化物层，第二区域包括第一半导体层。 在III族氮化物层上形成第一晶体管（例如n型晶体管），并且在第一半导体层上形成第二晶体管（例如p型晶体管）。 III族氮化物层可以是氮化铟。 在第一区域中，衬底可以包括第二半导体层，在第二半导体层上的渐变过渡层，以及过渡层上的缓冲层，其中III族氮化物层在缓冲层之上。 在第二区域中，衬底可以包括第二半导体层和在第二半导体层上的绝缘层，其中第一半导体层在绝缘层之上。

公开(公告)号：US20080237635A1

公开(公告)日：2008-10-02

申请号：US11694273

申请日：2007-03-30

申请人： Voon-Yew Thean ,  Bich-Yen Nguyen

发明人： Voon-Yew Thean ,  Bich-Yen Nguyen

IPC分类号： H01L27/092 ,  H01L21/8238

CPC分类号： H01L21/84 ,  H01L21/823807 ,  H01L21/823878 ,  H01L27/1203 ,  H01L27/1207 ,  H01L29/7842

摘要： A semiconductor device (10) comprising a substrate (12) and an oxide layer (14) formed over the substrate is provided. The semiconductor device further includes a first semiconductor layer (16) having a first lattice constant formed directly over the oxide layer. The semiconductor device further includes a second semiconductor layer (26) having a second lattice constant formed directly over the first semiconductor layer, wherein the second lattice constant is different from the first lattice constant.

摘要翻译： 提供一种半导体器件（10），其包括衬底（12）和形成在衬底上的氧化物层（14）。 半导体器件还包括具有直接形成在氧化物层上的第一晶格常数的第一半导体层（16）。 半导体器件还包括具有直接形成在第一半导体层上的第二晶格常数的第二半导体层（26），其中第二晶格常数不同于第一晶格常数。

公开(公告)号：US07419866B2

公开(公告)日：2008-09-02

申请号：US11375893

申请日：2006-03-15

申请人： Mariam G. Sadaka ,  Bich-Yen Nguyen ,  Voon-Yew Thean

发明人： Mariam G. Sadaka ,  Bich-Yen Nguyen ,  Voon-Yew Thean

IPC分类号： H01L21/8238

CPC分类号： H01L21/32 ,  H01L21/02238 ,  H01L21/02255 ,  H01L21/31662 ,  H01L21/84

摘要： A process of forming an electronic device can include forming a patterned oxidation-resistant layer over a semiconductor layer that overlies a substrate, and patterning the semiconductor layer to form a semiconductor island. The semiconductor island includes a first surface and a second surface opposite the first surface, and the first surface lies closer to the substrate, as compared to the second surface. The process can also include forming an oxidation-resistant material along a side of the semiconductor island or selectively depositing a semiconductor material along a side of the semiconductor island. The process can further include exposing the patterned oxidation-resistant layer and the semiconductor island to an oxygen-containing ambient, wherein a first portion of the semiconductor island along the first surface is oxidized during exposing the patterned oxidation-resistant layer, the semiconductor island, and the oxidation-resistant material to an oxygen-containing ambient.

摘要翻译： 形成电子器件的方法可以包括在覆盖在衬底上的半导体层上形成图案化的抗氧化层，并且图案化半导体层以形成半导体岛。 半导体岛包括与第一表面相对的第一表面和第二表面，并且第一表面与第二表面相比更靠近基底。 该方法还可以包括沿着半导体岛的一侧形成耐氧化材料或者沿半导体岛的一侧选择性地沉积半导体材料。 该方法还可以包括将图案化的抗氧化层和半导体岛暴露于含氧环境中，其中沿着第一表面的半导体岛的第一部分在曝光图案化的抗氧化层，半导体岛， 并将抗氧化材料转化为含氧环境。