LIGHTING DEVICE AND LIGHTING METHOD
    51.
    发明申请
    LIGHTING DEVICE AND LIGHTING METHOD 有权
    照明设备和照明方法

    公开(公告)号:US20080084685A1

    公开(公告)日:2008-04-10

    申请号:US11843243

    申请日:2007-08-22

    IPC分类号: F21V9/16

    摘要: A lighting device comprising at least one solid state light emitter and at least one lumiphor. If each solid state light emitter is illuminated and each lumiphor is excited, a mixture of light emitted has x, y color coordinates within an area defined by the coordinates 0.32, 0.40; 0.36, 0,48; 0.43, 0.45; 0.42, 0.42; and 0.36, 0.38. The lumiphor(s) comprises phosphor particles, in the range of from 3 to 7 micrometers (or 5-15, 10-20, or 15-25 micrometers), or having a mean particle size of 5, 10, 15, 20 micrometers. Also, a lighting device comprising at least one emitter and at least one lumiphor in which the lumiphor comprises phosphor particles having sizes as mentioned above, where the lighting device has an efficacy of at least 60 (or 70, or 80) lumens per watt.

    摘要翻译: 一种照明装置,包括至少一个固态发光体和至少一个荧光体。 如果每个固态光发射器被照亮并且每个荧光体被激发,则发射的光的混合物在由坐标0.32,0.40定义的区域内具有x,y颜色坐标; 0.36,0,48; 0.43,0.45; 0.42,0.42; 和0.36,0.38。 所述发光体包含在3至7微米(或5-15,10-20或15-25微米)范围内的荧光体颗粒,或平均粒度为5,10,15,20微米 。 而且,一种包括至少一个发射器和至少一个荧光体的照明装置,其中所述发光器包括具有如上所述尺寸的荧光体颗粒,其中所述照明装置具有至少60(或70或80)流明/瓦特的功效。

    METHODS OF MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICES INCLUDING PATTERNABLE FILMS COMPRISING TRANSPARENT SILICONE AND PHOSPHOR
    52.
    发明申请
    METHODS OF MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICES INCLUDING PATTERNABLE FILMS COMPRISING TRANSPARENT SILICONE AND PHOSPHOR 有权
    制造半导体发光器件的方法,包括包含透明硅胶和磷光体的可塑膜

    公开(公告)号:US20080076316A1

    公开(公告)日:2008-03-27

    申请号:US11944804

    申请日:2007-11-26

    申请人: Gerald Negley

    发明人: Gerald Negley

    IPC分类号: H01J1/02

    CPC分类号: H01L33/501 H01L2224/48463

    摘要: Semiconductor light emitting devices include a semiconductor light emitting element having a light emitting surface, and a patternable film including transparent silicone and phosphor on at least a portion of the light emitting surface. The patternable film may be a photopatternable film and/or a printable film including transparent silicone and phosphor. The patternable film includes an aperture therein that exposes a portion of a light emitting surface, and a bond pad is provided on the light emitting surface in the aperture. A wire bond may be provided on the bond pad. Related methods of fabricating semiconductor light emitting devices are also provided.

    摘要翻译: 半导体发光器件包括具有发光表面的半导体发光元件和在发光表面的至少一部分上的包括透明硅氧烷和磷光体的图案化膜。 可图案的膜可以是可光图案化的膜和/或包括透明硅氧烷和磷光体的可印刷膜。 可图案的膜包括其中露出发光表面的一部分的孔,并且在孔中的发光表面上设置接合焊盘。 可以在接合焊盘上提供引线接合。 还提供了制造半导体发光器件的相关方法。

    Etching of substrates of light emitting devices

    公开(公告)号:US20070173068A1

    公开(公告)日:2007-07-26

    申请号:US11710838

    申请日:2007-02-26

    申请人: Gerald Negley

    发明人: Gerald Negley

    IPC分类号: H01L21/302

    摘要: Fabrication of a light emitting device includes etching of a substrate of the light emitting device. The etch may be an aqueous etch sufficient to increase an amount of light extracted through the substrate. The etch may be a direct aqueous etch of a silicon carbide substrate. The etch may remove damage from the substrate that results from other processing of the substrate, such as damage from sawing the substrate. The etch may remove an amorphous region of silicon carbide in the substrate.

    LIGHTING DEVICE AND LIGHTING METHOD
    54.
    发明申请
    LIGHTING DEVICE AND LIGHTING METHOD 有权
    照明设备和照明方法

    公开(公告)号:US20070139920A1

    公开(公告)日:2007-06-21

    申请号:US11613714

    申请日:2006-12-20

    IPC分类号: F21V1/00

    摘要: A lighting device comprising sources of visible light comprising solid state light emitters and/or luminescent materials emitting three or four different hues. A first group of the sources, when illuminated, emit light of two hues which, if combined, would produce illumination having coordinates within an area on a 1931 CIE Chromaticity Diagram defined by points having coordinates: 0.59, 0.24; 0.40, 0.50; 0.24, 0.53; 0.17, 0.25; and 0.30, 0.12. A second group of the sources is of an additional hue. Mixing light from the first and second groups produces illumination within ten MacAdam ellipses of the blackbody locus. Also, a lighting device comprising a white light source having a CRI of 75 or less and at least one solid state light emitters and/or luminescent material. Also, methods of lighting.

    摘要翻译: 包括可见光源的照明装置,包括发射三种或四种不同色调的固态发光体和/或发光材料。 第一组照明时,发出两个色调的光,如果组合,将产生在由坐标为0.59,0.24的点定义的1931年CIE色度图中的区域内的坐标的照明; 0.40,0.50; 0.24,0.53; 0.17,0.25; 和0.30,0.12。 第二组来源有额外的色调。 来自第一和第二组的混合光在黑体轨迹的十个MacAdam椭圆内产生照明。 而且,一种包括CRI为75以下的白色光源和至少一个固态发光体和/或发光材料的照明装置。 另外,照明方法。

    Solid colloidal dispersions for backlighting of liquid crystal displays
    56.
    发明申请
    Solid colloidal dispersions for backlighting of liquid crystal displays 有权
    用于液晶显示器背光的固体胶体分散体

    公开(公告)号:US20060152651A1

    公开(公告)日:2006-07-13

    申请号:US11034240

    申请日:2005-01-12

    IPC分类号: G02F1/1335

    CPC分类号: G02B5/0247 G02F1/133606

    摘要: A display panel for a flat panel display includes an array of LCD devices and an array of LED devices that are configured to radiate light in a light path that impinges on the array of LCD devices, to provide backlighting on the array of LCD devices. A solid colloidal dispersion of particles of a first material having a first index of refraction dispersed in a second material having a second index of refraction, such as a solid foam structure, is provided in the light path to reduce spatial non-uniformity of the backlighting.

    摘要翻译: 用于平板显示器的显示面板包括一组LCD装置和一组LED装置,其被配置为在照射在LCD装置阵列上的光路中辐射光,以在LCD装置阵列上提供背光。 在光路中提供具有分散在具有第二折射率的第二材料(例如固体泡沫结构)中的具有第一折射率的第一材料的颗粒的固体胶体分散体,以减少背光的空间不均匀性 。

    Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same
    57.
    发明申请
    Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same 审中-公开
    固体金属块半导体发光器件安装衬底和包括空腔和散热器的封装以及其封装方法

    公开(公告)号:US20060097385A1

    公开(公告)日:2006-05-11

    申请号:US10972910

    申请日:2004-10-25

    申请人: Gerald Negley

    发明人: Gerald Negley

    IPC分类号: H01L23/34

    摘要: A mounting substrate for a semiconductor light emitting device includes a solid metal block having first and second opposing metal faces. The first metal face includes a cavity that is configured to mount at least one semiconductor light emitting device therein, and to reflect light that is emitted by at least one semiconductor light emitting device that is mounted therein away from the cavity. The second metal face includes heat sink fins therein. One or more semiconductor light emitting devices are mounted in the cavity. Reflective coatings, conductive traces, insulating layers, pedestals, through holes, lenses, flexible films, optical elements, phosphor, integrated circuits and/or optical coupling media also may be provided in the package. Related packaging methods also may be provided.

    摘要翻译: 用于半导体发光器件的安装衬底包括具有第一和第二相对金属面的实心金属块。 第一金属面包括被构造成在其中安装至少一个半导体发光器件的空腔,并且将由其中安装的远离腔的至少一个半导体发光器件发射的光反射。 第二金属面包括散热鳍片。 一个或多个半导体发光器件安装在腔中。 也可以在包装中提供反射涂层,导电迹线,绝缘层,基座,通孔,透镜,柔性膜,光学元件,荧光体,集成电路和/或光学耦合介质。 也可以提供相关的包装方法。

    Composite optical lens with an integrated reflector
    58.
    发明申请
    Composite optical lens with an integrated reflector 有权
    具有集成反射镜的复合光学透镜

    公开(公告)号:US20050270666A1

    公开(公告)日:2005-12-08

    申请号:US10861639

    申请日:2004-06-04

    申请人: Ban Loh Gerald Negley

    发明人: Ban Loh Gerald Negley

    摘要: A composite optical lens is disclosed. The composite optical lens includes a concave bottom surface adapted to receive light, reflective surface adapted to reflect the received light, and optical surface through which the reflected light leaves the optical lens. The concave bottom surface defines a concave cavity allowing placement of at least a portion of a light emitting device within the concave cavity. The concave bottom surface, the optical surface, or both may have predetermined optical finish to operate on the light such as diffusing or focusing the light. The reflective surface can be coated, designed, or both for total internal reflection effect.

    摘要翻译: 公开了一种复合光学透镜。 复合光学透镜包括适于接收光的凹底表面,适于反射接收的光的反射表面以及反射光通过该表面离开光学透镜的光学表面。 凹形底表面限定了凹腔,其允许在凹腔内放置发光器件的至少一部分。 凹底面,光学表面或两者可以具有预定的光学光洁度以在光上操作,例如漫射或聚焦光。 反射表面可以被涂覆,设计或两者用于全内反射效果。

    Power light emitting die package with reflecting lens and the method of making the same
    59.
    发明申请
    Power light emitting die package with reflecting lens and the method of making the same 有权
    具有反射镜的功率发光管芯封装及其制造方法

    公开(公告)号:US20050269587A1

    公开(公告)日:2005-12-08

    申请号:US10861929

    申请日:2004-06-04

    申请人: Ban Loh Gerald Negley

    发明人: Ban Loh Gerald Negley

    摘要: A light emitting die package and a method of manufacturing the die package are disclosed. The die package includes a leadframe, at least one light emitting device (LED), a molded body, and a lens. The leadframe includes a plurality of leads and has a top side and a bottom side. A portion of the leadframe defines a mounting pad. The LED device is mounted on the mounting pad. The molded body is integrated with portions of the leadframe and defines an opening on the top side of the leadframe, the opening surrounding the mounting pad. The molded body further includes latches on the bottom side of the leadframe. The lens is coupled to the molded body. A composite lens is used as both reflector and imaging tool to collect and direct light emitted by LED(s) for desired spectral and luminous performance.

    摘要翻译: 公开了一种发光管芯封装及其制造方法。 模具封装包括引线框架,至少一个发光器件(LED),成型体和透镜。 引线框架包括多个引线并且具有顶侧和底侧。 引线框架的一部分限定了安装垫。 LED装置安装在安装垫上。 成型体与引线框架的一部分一体化并且在引线框架的顶侧上限定开口,围绕安装垫的开口。 成型体还包括在引线框的底侧上的闩锁。 透镜与成型体相连。 复合透镜用作反射器和成像工具,用于收集和引导由LED发射的光以获得期望的光谱和发光性能。

    Reflector packages and methods for packaging of a semiconductor light emitting device
    60.
    发明申请
    Reflector packages and methods for packaging of a semiconductor light emitting device 有权
    用于封装半导体发光器件的反射器封装和方法

    公开(公告)号:US20050221518A1

    公开(公告)日:2005-10-06

    申请号:US11044779

    申请日:2005-01-27

    IPC分类号: H01L21/00 H01L33/52 H01L33/58

    CPC分类号: H01L33/58 H01L33/52

    摘要: Methods of packaging a semiconductor light emitting device in a reflector having a moat positioned between a lower and an upper sidewall thereof, the upper and lower sidewall defining a reflective cavity, include dispensing encapsulant material into the reflective cavity including the light emitting device therein to cover the light emitting device and to form a convex meniscus of encapsulant material in the reflective cavity extending from an edge of the moat without contacting the upper sidewall of the reflector. The encapsulant material in the reflective cavity is cured. Packaged semiconductor light emitting devices and reflectors for the same are also provided.

    摘要翻译: 将半导体发光器件封装在具有位于其下侧和上侧壁之间的护城河的反射器中的方法,所述上壁和下侧壁限定反射腔,包括将密封剂材料分配到包括其中的发光器件的反射腔中以覆盖 并且在反射腔中形成密封材料的凸弯月面,其从护城河的边缘延伸而不接触反射器的上侧壁。 反射腔中的密封材料固化。 还提供了用于其的封装的半导体发光器件和反射器。