公开(公告)号：US20070023085A1

公开(公告)日：2007-02-01

申请号：US11194183

申请日：2005-08-01

申请人： Peter Andrews ,  Gerald Negley

发明人： Peter Andrews ,  Gerald Negley

IPC分类号： G05D9/12

CPC分类号： H01L21/6715 ,  H01L21/67126 ,  H01L21/67253 ,  Y10T137/7306

摘要： A method of controlling dispensing of a liquid can include detecting a predetermined shape of a surface of a liquid in a container by reflecting optical radiation from the surface to control a volume of the liquid dispensed into the container. Related apparatus and computer program products are also disclosed.

摘要翻译： 控制液体分配的方法可以包括通过反射来自表面的光辐射来检测容器中液体的表面的预定形状，以控制分配到容器中的液体的体积。 还公开了相关装置和计算机程序产品。

公开(公告)号：US20050221518A1

公开(公告)日：2005-10-06

申请号：US11044779

申请日：2005-01-27

申请人： Peter Andrews ,  Thomas Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald Negley ,  Eric Tarsa

发明人： Peter Andrews ,  Thomas Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald Negley ,  Eric Tarsa

IPC分类号： H01L21/00 ,  H01L33/52 ,  H01L33/58

CPC分类号： H01L33/58 ,  H01L33/52

摘要： Methods of packaging a semiconductor light emitting device in a reflector having a moat positioned between a lower and an upper sidewall thereof, the upper and lower sidewall defining a reflective cavity, include dispensing encapsulant material into the reflective cavity including the light emitting device therein to cover the light emitting device and to form a convex meniscus of encapsulant material in the reflective cavity extending from an edge of the moat without contacting the upper sidewall of the reflector. The encapsulant material in the reflective cavity is cured. Packaged semiconductor light emitting devices and reflectors for the same are also provided.

摘要翻译： 将半导体发光器件封装在具有位于其下侧和上侧壁之间的护城河的反射器中的方法，所述上壁和下侧壁限定反射腔，包括将密封剂材料分配到包括其中的发光器件的反射腔中以覆盖 并且在反射腔中形成密封材料的凸弯月面，其从护城河的边缘延伸而不接触反射器的上侧壁。 反射腔中的密封材料固化。 还提供了用于其的封装的半导体发光器件和反射器。

公开(公告)号：US20080087910A1

公开(公告)日：2008-04-17

申请号：US11953110

申请日：2007-12-10

申请人： Peter Andrews ,  Thomas Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald Negley ,  Eric Tarsa

发明人： Peter Andrews ,  Thomas Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald Negley ,  Eric Tarsa

IPC分类号： H01L33/00

CPC分类号： H01L33/58 ,  H01L33/52

摘要： Reflectors for a semiconductor light emitting device include a lower sidewall portion defining a reflective cavity. A substantially horizontal shoulder portion extends outwardly from the sloped lower sidewall portion. The horizontal shoulder portion has a circumferentially extending moat formed therein. An upper sidewall portion extends upwardly from the horizontal shoulder portion.

摘要翻译： 用于半导体发光器件的反射器包括限定反射腔的下侧壁部分。 大致水平的肩部从倾斜的下侧壁部分向外延伸。 水平肩部具有形成在其中的周向延伸的护城河。 上侧壁部分从水平肩部部分向上延伸。

公开(公告)号：US20050121686A1

公开(公告)日：2005-06-09

申请号：US10987894

申请日：2004-11-12

申请人： Bernd Keller ,  James Ibbetson ,  Peter Andrews ,  Gerald Negley ,  Norbert Hiller

发明人： Bernd Keller ,  James Ibbetson ,  Peter Andrews ,  Gerald Negley ,  Norbert Hiller

IPC分类号： H01L25/16 ,  H01L29/22 ,  H01L33/50 ,  H01S5/022 ,  H01S5/323

CPC分类号： H01L33/507 ,  H01L25/167 ,  H01L2224/48091 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00

摘要： A submount for a semiconductor light emitting device includes a semiconductor substrate having a cavity therein configured to receive the light emitting device. A first bond pad is positioned in the cavity to couple to a first node of a light emitting device received in the cavity. A second bond pad is positioned in the cavity to couple to a second node of a light emitting device positioned therein. Light emitting devices including a solid wavelength conversion member and methods for forming the same are also provided.

摘要翻译： 半导体发光器件的基座包括其中具有腔室的半导体衬底，其配置为接收发光器件。 第一接合焊盘定位在空腔中以耦合到容纳在空腔中的发光器件的第一节点。 第二接合焊盘定位在空腔中以耦合到定位在其中的发光器件的第二节点。 还提供了包括固体波长转换元件的发光器件及其形成方法。

公开(公告)号：US20070228387A1

公开(公告)日：2007-10-04

申请号：US11398214

申请日：2006-04-04

申请人： Gerald Negley ,  Michael Leung ,  Maryanne Becerra ,  Eric Tarsa ,  Peter Andrews

发明人： Gerald Negley ,  Michael Leung ,  Maryanne Becerra ,  Eric Tarsa ,  Peter Andrews

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/54 ,  H01L33/486 ,  H01L33/505 ,  H01L33/507 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2924/00

摘要： An emitter package comprising a light emitting diode (LED) mounted to the surface of a submount with the surface having a first meniscus forming feature around the LED. A matrix encapsulant is included on the surface and covering the LED. The outer edge of the matrix encapsulant adjacent the surface is defined by the meniscus forming feature and the encapsulant forms a substantially dome-shaped covering over said LED. A method for manufacturing an LED package by providing a body with a surface having a first meniscus holding feature. An LED is mounted to the surface with the meniscus holding feature around the LED. A liquid matrix encapsulant is introduced over the LED and the surface, the first meniscus holding feature holding the liquid matrix encapsulant in a dome-shape over the LED. The matrix encapsulant is then cured.

摘要翻译： 一种发射器封装，包括安装在底座表面的发光二极管（LED），该表面具有围绕LED的第一弯液面形成特征。 表面包含基质密封剂并覆盖LED。 靠近表面的基质密封剂的外边缘由弯液面形成特征限定，并且密封剂在所述LED上形成基本上圆顶形的覆盖物。 一种通过向身体提供具有第一弯液面保持特征的表面来制造LED封装的方法。 LED在LED周围安装有弯液面保持功能的表面。 在LED和表面上引入液体基质密封剂，第一弯液面保持特征将液体基质密封剂保持在LED上的圆顶形状。 然后固化基质密封剂。

公开(公告)号：US20070034323A1

公开(公告)日：2007-02-15

申请号：US11585515

申请日：2006-10-24

申请人： Norbert Hiller ,  Peter Andrews ,  David Slater ,  Gerald Negley

发明人： Norbert Hiller ,  Peter Andrews ,  David Slater ,  Gerald Negley

IPC分类号： B32B37/00

CPC分类号： H01L21/67144 ,  H01L21/67132 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T156/1089 ,  Y10T156/1097 ,  Y10T156/1707 ,  Y10T156/1712 ,  Y10T156/1734 ,  Y10T156/1744 ,  Y10T156/1911 ,  Y10T156/1978

摘要： A component assembly system is provided that includes a longitudinally elongated tape carrier, a longitudinally elongated submount carrier, and an assembly machine. A plurality of components may be attached to the tape carrier. The assembly machine is adapted to receiving the tape carrier, with the components attached thereto, and to receive the submount carrier. The assembly machine is further adapted to bring the tape carrier in close proximity to the submount carrier, and to attach the components to the submounts on the submount carrier.

摘要翻译： 提供了一种部件组装系统，其包括纵向细长的带状载体，纵向细长的底座载体和组装机。 多个部件可以附接到带载体。 组装机适于接收带载体的带状载体，并接收底座载体。 装配机还适于使带载体紧靠于底座托架，并将部件附接到副安装架托架上的底座上。

公开(公告)号：US20070290218A1

公开(公告)日：2007-12-20

申请号：US11849530

申请日：2007-09-04

申请人： Peter Andrews ,  Thomas Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald Negley ,  Eric Tarsa

发明人： Peter Andrews ,  Thomas Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald Negley ,  Eric Tarsa

IPC分类号： H01L33/00

CPC分类号： H01L33/58 ,  H01L33/52 ,  H01L33/60 ,  H01L2924/181 ,  H01L2924/00012

摘要： Packaged semiconductor light emitting device are provided including a reflector having a lower sidewall portion defining a reflective cavity. A light emitting device is positioned in the reflective cavity. A first quantity of cured encapsulant material having a first index of refraction is provided in the reflective cavity including the light emitting device. A second quantity of cured encapsulant material having a second index of refraction, different from the first index of refraction, is provided on the first quantity of cured encapsulant material. The first and second index of refraction are selected to provide a buried lens in the reflective cavity.

摘要翻译： 包装半导体发光器件包括具有限定反射腔的下侧壁部分的反射器。 发光器件位于反射腔中。 具有第一折射率的第一量固化的密封剂材料设置在包括发光器件的反射腔中。 在第一量的固化的密封剂材料上提供第二量的具有与第一折射率不同的第二折射率的固化的密封剂材料。 选择第一和第二折射率以在反射腔中提供掩埋透镜。

公开(公告)号：US20070241360A1

公开(公告)日：2007-10-18

申请号：US11772419

申请日：2007-07-02

申请人： David Slater, Jr. ,  Jayesh Bharathan ,  John Edmond ,  Mark Raffetto ,  Anwar Mohammed ,  Peter Andrews ,  Gerald Negley

发明人： David Slater, Jr. ,  Jayesh Bharathan ,  John Edmond ,  Mark Raffetto ,  Anwar Mohammed ,  Peter Andrews ,  Gerald Negley

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L33/38 ,  H01L2224/04026 ,  H01L2224/26175 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12032 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

摘要： Light emitting device die having a mesa configuration on a substrate and an electrode on the mesa are attached to a submount in a flip-chip configuration by forming predefined pattern of conductive die attach material on at least one of the electrode and the submount and mounting the light emitting device die to the submount. The predefined pattern of conductive die attach material is selected so as to prevent the conductive die attach material from contacting regions of having opposite conductivity types when the light emitting device die is mounted to the submount. The predefined pattern of conductive die attach material may provide a volume of die attach material that is less than a volume defined by an area of the electrode and a distance between the electrode and the submount. Light emitting device dies having predefined patterns of conductive die attach material are also provided. Light emitting devices having a gallium nitride based light emitting region on a substrate, such as a silicon carbide substrate, may also be mounted in a flip-chip configuration by mounting an electrode of the gallium nitride based light emitting region to a submount utilizing a B-stage curable die epoxy. Light emitting device dies having a B-stage curable die epoxy are also provided.

摘要翻译： 通过在电极和底座中的至少一个上形成预定图案的导电芯片附着材料，并将其安装在基板上，并将底板上的电极和底板上的电极的底板配置在倒装芯片结构的底座上， 发光器件死到底座。 选择导电芯片附着材料的预定图案，以便当发光器件裸片安装到底座时，防止导电芯片附着材料接触具有相反导电类型的区域。 导电芯片附接材料的预定图案可以提供小于由电极区域限定的体积以及电极和底座之间的距离的管芯附着材料的体积。 还提供具有预定图案的导电芯片附着材料的发光器件裸片。 在碳化硅基板等基板上具有氮化镓系发光区域的发光元件也可以通过将氮化镓系发光区域的电极安装在利用B的基板的倒装芯片配置中 级环氧树脂。 还提供了具有B级可固化模具环氧树脂的发光器件模具。

公开(公告)号：US20050130390A1

公开(公告)日：2005-06-16

申请号：US10733845

申请日：2003-12-11

申请人： Peter Andrews ,  Elbert Brown ,  Gerald Negley

发明人： Peter Andrews ,  Elbert Brown ,  Gerald Negley

IPC分类号： B23K26/40 ,  B28D1/22 ,  B28D5/00 ,  H01L21/78 ,  H01L33/00 ,  H01L21/50 ,  H01L23/544

CPC分类号： H01L21/78 ,  B23K26/3568 ,  B23K26/359 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D1/221 ,  B28D5/0011 ,  H01L33/0095 ,  H01L2924/10155

摘要： A method for forming semiconductor devices using a semiconductor substrate having first and second opposed surfaces and including first and second device regions includes directing a beam of laser light at the substrate such that the beam of laser light is focused within the substrate between the first and second surfaces thereof and the beam of laser light forms a thermally weakened zone (TWZ) in the substrate. The TWZ extends between the first and second device regions and defines a break line.

摘要翻译： 使用具有第一和第二相对表面并且包括第一和第二器件区域的半导体衬底形成半导体器件的方法包括将激光束引导到衬底，使得激光束聚焦在衬底内的第一和第二 其表面和激光束在衬底中形成热弱化区（TWZ）。 TWZ在第一和第二装置区域之间延伸并且限定断裂线。

公开(公告)号：US08969908B2

公开(公告)日：2015-03-03

申请号：US11398214

申请日：2006-04-04

申请人： Gerald Negley ,  Michael Leung ,  Maryanne Becerra ,  Eric Tarsa ,  Peter Andrews

发明人： Gerald Negley ,  Michael Leung ,  Maryanne Becerra ,  Eric Tarsa ,  Peter Andrews

IPC分类号： H01L33/00 ,  H01L33/50 ,  H01L33/48

CPC分类号： H01L33/54 ,  H01L33/486 ,  H01L33/505 ,  H01L33/507 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2924/00

摘要： An emitter package comprising a light emitting diode (LED) mounted to the surface of a submount with the surface having a first meniscus forming feature around the LED. A matrix encapsulant is included on the surface and covering the LED. The outer edge of the matrix encapsulant adjacent the surface is defined by the meniscus forming feature and the encapsulant forms a substantially dome-shaped covering over said LED. A method for manufacturing an LED package by providing a body with a surface having a first meniscus holding feature. An LED is mounted to the surface with the meniscus holding feature around the LED. A liquid matrix encapsulant is introduced over the LED and the surface, the first meniscus holding feature holding the liquid matrix encapsulant in a dome-shape over the LED. The matrix encapsulant is then cured.

摘要翻译： 一种发射器封装，包括安装在底座表面的发光二极管（LED），该表面具有围绕LED的第一弯液面形成特征。 表面包含基质密封剂并覆盖LED。 靠近表面的基质密封剂的外边缘由弯液面形成特征限定，并且密封剂在所述LED上形成基本上圆顶形的覆盖物。 一种通过向身体提供具有第一弯液面保持特征的表面来制造LED封装的方法。 LED在LED周围安装有弯液面保持功能的表面。 在LED和表面上引入液体基质密封剂，第一弯液面保持特征将液体基质密封剂保持在LED上的圆顶形状。 然后固化基质密封剂。