公开(公告)号：US20080024773A1

公开(公告)日：2008-01-31

申请号：US11711863

申请日：2007-02-28

申请人： Yusuke Miyazaki ,  Takayuki Ono ,  Takahiro Jingu ,  Kenichiro Komeda ,  Kazuhiro Zama

发明人： Yusuke Miyazaki ,  Takayuki Ono ,  Takahiro Jingu ,  Kenichiro Komeda ,  Kazuhiro Zama

IPC分类号： G01N21/88

CPC分类号： G01N21/9501 ,  G01N21/4738 ,  G01N21/9503

摘要： A surface inspection apparatus comprises a radiation mechanism for radiating a light beam to the surface of an object having an edge of a non-flat surface (for example, a rounded edge) or an edge of an inclined surface, a scanning mechanism for moving the object relative to a radiation position of the light beam for scanning, and a detector for detecting light scattered from the object, and further includes the following characteristic. The scanning mechanism, when the light beam for scanning is radiated to the edge of the object, is configured to move the object in the direction that increases an incident angle of the light beam with a normal to the surface of the edge as the objection moves relative to a radiation position of the light beam.

摘要翻译： 表面检查装置包括用于将光束照射到具有非平坦表面（例如，圆形边缘）或倾斜表面的边缘的物体的表面的辐射机构，用于移动 相对于用于扫描的光束的辐射位置的物体，以及用于检测从物体散射的光的检测器，还包括以下特征。 当用于扫描的光束被辐射到物体的边缘时，扫描机构被配置为当物体移动时使物体沿着与边缘的表面垂直的方向使光束的入射角增大的方向移动物体 相对于光束的辐射位置。

公开(公告)号：US20070247616A1

公开(公告)日：2007-10-25

申请号：US11770217

申请日：2007-06-28

申请人： AKIRA HAMAMATSU ,  Minori Noguchi ,  Hidetoshi Nishiyama ,  Yoshimasa Ohshima ,  Takahiro Jingu ,  Sachio Uto

发明人： AKIRA HAMAMATSU ,  Minori Noguchi ,  Hidetoshi Nishiyama ,  Yoshimasa Ohshima ,  Takahiro Jingu ,  Sachio Uto

IPC分类号： G01N21/01 ,  G01N21/00

CPC分类号： G01N21/8806 ,  G01N21/94 ,  G01N21/9501 ,  G01N21/95623

摘要： The present invention is an apparatus for inspecting foreign particles/defects, comprises an illumination optical system, a detection optical system, a shielding unit which is provided in said detection optical system to selectively shield diffracted light pattern coming from circuit pattern existing on an inspection object and an arithmetic processing system, wherein said shielding unit comprises a micro-mirror array device or a reflected type liquid crystal, or a transmission type liquid crystal, or an object which is transferred a shielding pattern to an optical transparent substrate, or a substrate or a film which is etched so as to leave shielding patterns, or an optical transparent substrate which can be changed in transmission by heating, sudden cold, or light illumination, or change of electric field or magnetic field, or a shielding plate of cylindrical shape or plate shape.

摘要翻译： 本发明是用于检查异物的缺陷的装置，包括照明光学系统，检测光学系统，屏蔽单元，其设置在所述检测光学系统中，以选择性地屏蔽来自存在于检查对象上的电路图案的衍射光图案 以及算术处理系统，其中所述屏蔽单元包括微镜阵列器件或反射型液晶或透射型液晶，或将屏蔽图案转印到光学透明基板或基板或 蚀刻以留下屏蔽图案的薄膜，或通过加热，突然冷或光照射或电场或磁场的变化或透镜中的可变化的光学透明基板或圆柱形的屏蔽板或 板形。

公开(公告)号：US20070182958A1

公开(公告)日：2007-08-09

申请号：US11668499

申请日：2007-01-30

申请人： Yuji Manabe ,  Takahiro Jingu

发明人： Yuji Manabe ,  Takahiro Jingu

IPC分类号： G01N21/88

CPC分类号： G01N21/9501 ,  G01N21/8851 ,  G01N2021/4711 ,  G01N2021/8861

摘要： A beam emitted from a first light source is shed on the surface of a rotating wafer to form a beam spot. Scattered light arising from foreign matter and other defects on the surface of the wafer is detected in a plurality of directions and output in the form of a signal. Vertical movement of the wafer surface is detected by using white light or broadband light from a second light source. The position of the beam spot on the wafer surface is corrected in accordance with the information on the detected vertical movement for the purpose of minimizing a coordinate error that may arise from the vertical movement of the wafer surface. Further, the emission direction and emission position of light generated from the first light source are corrected to minimize a coordinate error that may arise from variations of the first light source. These corrections are made to enhance the accuracy of the coordinates of detected foreign matter and other defects. Moreover, the illumination beam spot diameter is corrected to prevent the detection sensitivity and foreign matter coordinate detection error from varying from one apparatus to another.

摘要翻译： 从第一光源发射的光束在旋转晶片的表面上脱落以形成光斑。 在多个方向上检测由晶片表面上的异物和其他缺陷引起的散射光，并以信号的形式输出。 通过使用来自第二光源的白光或宽带光来检测晶片表面的垂直移动。 为了最小化由晶片表面的垂直移动引起的坐标误差，根据关于检测到的垂直移动的信息来校正晶片表面上的光束点的位置。 此外，校正从第一光源产生的光的发射方向和发射位置，以最小化由第一光源的变化引起的坐标误差。 这些校正是为了提高检测到的异物的坐标精度和其他缺陷。 此外，校正照明光束光斑直径以防止检测灵敏度和异物坐标检测误差从一个装置变化到另一个装置。

公开(公告)号：US07248352B2

公开(公告)日：2007-07-24

申请号：US10724750

申请日：2003-12-02

申请人： Akira Hamamatsu ,  Minori Noguchi ,  Hidetoshi Nishiyama ,  Yoshimasa Ohshima ,  Takahiro Jingu ,  Sachio Uto

发明人： Akira Hamamatsu ,  Minori Noguchi ,  Hidetoshi Nishiyama ,  Yoshimasa Ohshima ,  Takahiro Jingu ,  Sachio Uto

IPC分类号： G01N21/00

CPC分类号： G01N21/8806 ,  G01N21/94 ,  G01N21/9501 ,  G01N21/95623

摘要： The present invention is an apparatus for inspecting foreign particles/defects, comprises an illumination optical system, a detection optical system, a shielding unit which is provided in said detection optical system to selectively shield diffracted light pattern coming from circuit pattern existing on an inspection object and an arithmetic processing system, wherein said shielding unit comprises a micro-mirror array device or a reflected type liquid crystal, or a transmission type liquid crystal, or an object which is transferred a shielding pattern to an optical transparent substrate, or a substrate or a film which is etched so as to leave shielding patterns, or an optical transparent substrate which can be changed in transmission by heating, sudden cold, or light illumination, or change of electric field or magnetic field, or a shielding plate of cylindrical shape or plate shape.

摘要翻译： 本发明是用于检查异物的缺陷的装置，包括照明光学系统，检测光学系统，屏蔽单元，其设置在所述检测光学系统中，以选择性地屏蔽来自存在于检查对象上的电路图案的衍射光图案 以及算术处理系统，其中所述屏蔽单元包括微镜阵列器件或反射型液晶或透射型液晶，或将屏蔽图案转印到光学透明基板或基板或 蚀刻以留下屏蔽图案的薄膜，或通过加热，突然冷或光照射或电场或磁场的变化或透镜中的可变化的光学透明基板，或圆柱形的屏蔽板或 板形。

公开(公告)号：US20060124874A1

公开(公告)日：2006-06-15

申请号：US10536715

申请日：2003-11-27

申请人： Sachio Uto ,  Minori Noguchi ,  Hidetoshi Nishiyama ,  Yoshimasa Ohshima ,  Akira Hamamatsu ,  Takahiro Jingu ,  Toshihiko Nakata ,  Masahiro Watanabe

发明人： Sachio Uto ,  Minori Noguchi ,  Hidetoshi Nishiyama ,  Yoshimasa Ohshima ,  Akira Hamamatsu ,  Takahiro Jingu ,  Toshihiko Nakata ,  Masahiro Watanabe

IPC分类号： G01N21/00 ,  G01N21/88

CPC分类号： G01N21/00 ,  G01N21/9501 ,  G06T7/0004 ,  G06T2207/30148

摘要： A defects inspecting apparatus having: a scanning stage for running into a predetermined direction while mounting an inspection target substrate thereon; an illumination optic system for irradiating an illumination light beam upon a surface of the inspection target substrate at a predetermined angle inclined thereto; a detection optic system including, an upper-directed photo-detector for receiving upper-directed reflected/scattered lights emitting upwards from the inspection target substrate, thereby converting them into an upper-directed image signal, and a side-directed photo-detector for receiving side-directed reflected/scattered lights emitting for the inspection target substrate into an inclined direction, so as to flatly intersects the illumination light beam, and thereby converting into a side-directed image signal; and a signal processing system-for detecting defects upon basis of the upper-directed image signal and the side-directed image signal.

摘要翻译： 一种缺陷检查装置，具有：在其上安装检查对象基板的同时沿预定方向行进的扫描台; 照明光学系统，用于以与其倾斜的预定角度将照明光束照射在检查对象基板的表面上; 检测光学系统，包括：用于接收从检查对象基板向上发射的上方反射/散射光的上方光检测器，从而将其转换为高定向图像信号;以及侧向光检测器， 将检测对象基板发射的侧向反射/散射光倾斜到倾斜方向，以与照明光束平坦地相交，从而转换为侧向图像信号; 以及信号处理系统 - 用于基于上限图像信号和侧向图像信号来检测缺陷。

公开(公告)号：US20060091332A1

公开(公告)日：2006-05-04

申请号：US11302847

申请日：2005-12-13

申请人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

发明人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

IPC分类号： G01N21/86

CPC分类号： G01N21/4738 ,  G01N21/8806 ,  G01N21/93 ,  G01N21/94 ,  G01N21/9501 ,  G01N2015/1486 ,  G01N2015/1493

摘要： Conventionally, a particle/defect inspection apparatus outputs a total number of detected particles/defects as the result of detection. For taking countermeasures to failures in manufacturing processes, the particles/defects detected by the inspection apparatus are analyzed. Since the inspection apparatus outputs a large number of detected particles/defects, an immense time is required for analyzing the detected particles/defects, resulting in a delay in taking countermeasures to a failure in the manufacturing processes. In the present invention, an apparatus for optically inspecting particles or defects relates a particle or defect size to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result. A failure analysis is conducted by setting a threshold for identifying a failure in each of regions on a semiconductor device or the like to statistically evaluate detected particles.

公开(公告)号：US20060030059A1

公开(公告)日：2006-02-09

申请号：US11244078

申请日：2005-10-06

申请人： Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama ,  Shunichi Matsumoto ,  Yukio Kembo ,  Ryouji Matsunaga ,  Keiji Sakai ,  Takanori Ninomiya ,  Tetsuya Watanabe ,  Hisato Nakamura ,  Takahiro Jingu ,  Yoshio Morishige ,  Shuichi Chikamatsu

发明人： Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama ,  Shunichi Matsumoto ,  Yukio Kembo ,  Ryouji Matsunaga ,  Keiji Sakai ,  Takanori Ninomiya ,  Tetsuya Watanabe ,  Hisato Nakamura ,  Takahiro Jingu ,  Yoshio Morishige ,  Shuichi Chikamatsu

IPC分类号： H01L21/66

CPC分类号： B82Y15/00 ,  G01N21/94 ,  G01N21/95623 ,  G01N21/95684 ,  G01N2021/8822 ,  G01R31/308 ,  H01J37/00 ,  H01J2237/022 ,  H01J2237/0225 ,  H01L21/67253 ,  H01L21/67288 ,  H01L21/681 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： A defect inspection method includes radiating an illumination slit-shaped beam having lights substantially parallel to a longitudinal direction to a substrate having circuit patterns in a direction inclined at a predetermined gradient relative to the direction of a line normal to the substrate and inclined at a predetermined gradient on a surface with respect to a group of main straight lines of the circuit patterns with its longitudinal direction oriented almost perpendicularly to a direction of a movement of the substrate. Scattered light reflected by a defect such as a foreign particle existing on the illuminated substrate is received and converted into a detection signal by using an image sensor, and defect judging is effected of an extracted a signal indicating a defect such as a foreign particle on the basis of the detection signal output.

公开(公告)号：US20050264798A1

公开(公告)日：2005-12-01

申请号：US11190838

申请日：2005-07-28

申请人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

发明人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

IPC分类号： G01N21/27 ,  G01N21/47 ,  G01N21/88 ,  G01N21/94 ,  G01N21/95

CPC分类号： G01N21/274 ,  G01N21/47 ,  G01N21/4738 ,  G01N21/8806 ,  G01N21/94 ,  G01N21/95 ,  G01N21/956 ,  G01N2021/8854

摘要： An apparatus for optically inspecting particles and/or defects correlates sizes of particles and/or defects to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result. A failure analysis is conducted by setting a threshold for identifying a failure in each of regions on a semiconductor device or the like to statistically evaluate detected particles.

摘要翻译： 用于光学检查颗粒和/或缺陷的装置将颗粒和/或缺陷的尺寸与检查结果中的故障原因相关联。 数据处理电路从检查结果统计中指出故障原因，并显示检查结果信息。 通过设定用于识别半导体装置等上的各区域的故障的阈值来进行故障分析，以统计学评价检测出的粒子。

公开(公告)号：US06797975B2

公开(公告)日：2004-09-28

申请号：US09931997

申请日：2001-08-17

申请人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

发明人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

IPC分类号： G01N2188

CPC分类号： G01N21/4738 ,  G01N21/8806 ,  G01N21/93 ,  G01N21/94 ,  G01N21/9501 ,  G01N2015/1486 ,  G01N2015/1493

摘要： Conventionally, a particle/defect inspection apparatus outputs a total number of detected particles/defects as the result of detection. For taking countermeasures to failures in manufacturing processes, the particles/defects detected by the inspection apparatus are analyzed. Since the inspection apparatus outputs a large number of detected particles/defects, an immense time is required for analyzing the detected particles/defects, resulting in a delay in taking countermeasures to a failure in the manufacturing processes. In the present invention, an apparatus for optically inspecting particles or defects relates a particle or defect size to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result. A failure analysis is conducted by setting a threshold for identifying a failure in each of regions on a semiconductor device or the like to statistically evaluate detected particles.

摘要翻译： 通常，作为检测结果，粒子/缺陷检查装置输出检测出的粒子/缺陷的总数。 对于制造过程中的故障采取对策，分析检查装置检测到的颗粒/缺陷。 由于检查装置输出大量检测到的粒子/缺陷，所以需要巨大的时间来分析检测到的粒子/缺陷，从而导致制造过程中的失败的对策的延迟。 在本发明中，用于光学检查颗粒或缺陷的装置在检查结果中将颗粒或缺陷尺寸与故障原因相关联。 数据处理电路从检查结果统计中指出故障原因，并显示检查结果信息。 通过设定用于识别半导体装置等上的各区域的故障的阈值来进行故障分析，以统计学评价检测出的粒子。

公开(公告)号：US6002989A

公开(公告)日：1999-12-14

申请号：US831298

申请日：1997-04-01

申请人： Masataka Shiba ,  Kenji Watanabe ,  Toshimitsu Hamada ,  Seiji Ishikawa ,  Naoki Go ,  Toshiaki Yachi ,  Tetsuya Watanabe ,  Takahiro Jingu

发明人： Masataka Shiba ,  Kenji Watanabe ,  Toshimitsu Hamada ,  Seiji Ishikawa ,  Naoki Go ,  Toshiaki Yachi ,  Tetsuya Watanabe ,  Takahiro Jingu

IPC分类号： G01N21/84 ,  B23Q41/08 ,  G05B19/418 ,  G06Q50/00 ,  G06Q50/04 ,  H01L21/66 ,  G06F15/18

CPC分类号： H01L22/20 ,  G05B19/41875 ,  H01L22/12 ,  H01L2924/0002 ,  Y02P90/14 ,  Y02P90/18 ,  Y02P90/22

摘要： Inspection apparatuses of an inspection apparatus group are connected to a network and transfer inspected result to a data collection system. The same wafer selected from a specific process is inspected by the different inspection apparatuses and the inspected data are collected and analyzed to calculate a correlation degree among the inspection apparatuses. On the other hand, the course of occurrence of failures in the same process can be analyzed to thereby calculate an average occurrence frequency of failures. An optimum inspection apparatus and inspection frequency are successively obtained on the basis of calculated results of an inter-apparatus correlation degree calculation process and a failure occurrence frequency calculation process, so that a feeding method of wafers to the inspection apparatus group is indicated through an inspection apparatus group management system. In the manufacturing of electronic components, complicated conditions such as the optimum inspection apparatus to be applied, the inspection frequency and the like can be set easily and the expected total loss value can be minimized to improve the economical efficiency of inspection remarkably.

摘要翻译： 检查装置组的检查装置连接到网络并将检查结果传送到数据收集系统。 通过不同的检查装置检查从具体处理中选出的相同的晶片，收集和分析检查数据，以计算检查装置之间的相关度。 另一方面，可以分析相同处理中的故障发生的过程，从而计算故障的平均发生频率。 基于设备间相关度计算处理和故障发生频率计算处理的计算结果连续获得最佳检查装置和检查频率，从而通过检查来指示晶片向检查装置组的馈送方法 设备组管理系统。 在电子部件的制造中，可以容易地设定诸如要应用的最佳检查装置等复杂的条件，并且可以将预期的总损失值最小化，从而提高检查的经济性。