公开(公告)号：US20100036229A1

公开(公告)日：2010-02-11

申请号：US12518278

申请日：2007-12-07

申请人： Johannes Wilhelmus Weekamp ,  Johannes Herman Savenije ,  Aaldert Elevelt ,  Marcus Jozef Van Bommel

发明人： Johannes Wilhelmus Weekamp ,  Johannes Herman Savenije ,  Aaldert Elevelt ,  Marcus Jozef Van Bommel

IPC分类号： A61B5/04

CPC分类号： A61B5/0421 ,  A61J15/0003 ,  A61J15/0073 ,  A61J15/0084

摘要： The invention is related to a feeding tube (1, 11, 15) in particular for total parental nutrition and/or medicine dosing including at least one inner tubing (9), at least one lumen (2, 13), at least one sensing element, in particular an electrode (3), the sensing element being connected to at least one monitoring device by a wiring (4, 12, 17) for internal monitoring of a patient's vital functions. The wiring (4, 12, 17) is at least partially wounded in tight contact with a surface of the inner tubing (9). Wherein the inner tubing (9) is at least partially surrounded by an outer tubing (8) in order to cover the inner tubing (9) and/or the wiring (4, 12, 17).

摘要翻译： 本发明涉及一种特别用于全部家长营养和/或药物给药的进料管（1,11,15），包括至少一个内管（9），至少一个内腔（2,13），至少一个感测 元件，特别是电极（3），感测元件通过布线（4,12,17）连接到至少一个监视装置，用于对患者的重要功能进行内部监视。 布线（4,12,17）至少部分地与内管（9）的表面紧密接触地受伤。 其中内管（9）至少部分地被外管（8）包围，以便覆盖内管（9）和/或布线（4,12,17）。

公开(公告)号：US20080298061A1

公开(公告)日：2008-12-04

申请号：US12094614

申请日：2006-11-20

申请人： Johannes Wilhelmus Weekamp ,  Willem Hoving ,  Eric Cornelis Egbertus Van Grunsven ,  Piet Christiaan Jozef Van Rens ,  Gerard Maria Janssen

发明人： Johannes Wilhelmus Weekamp ,  Willem Hoving ,  Eric Cornelis Egbertus Van Grunsven ,  Piet Christiaan Jozef Van Rens ,  Gerard Maria Janssen

IPC分类号： F21K7/00 ,  G02B27/00 ,  H01L21/00

CPC分类号： G02B27/145 ,  F21K9/00 ,  F21V29/763 ,  F21Y2113/13 ,  F21Y2115/10 ,  F21Y2115/30 ,  G02B27/102 ,  G02B27/1073 ,  G02B27/144 ,  H01S5/4012 ,  H01S5/4025 ,  H04N9/315

摘要： A light emitting module (19), comprising at least one semi-conductor light source (20a-c) capable of emitting light, and a light-modifying member (21) arranged adjacent to the at least one semiconductor light source (20a-c) in a direction of emission of the light. The light-modifying member (21) is formed by a stacked sheet element (21) separated from an integral stacked sheet structure comprising first and second stacked sheets, so that the stacked sheet element (21) includes first and second sheet portions of the first and second stacked sheets, and at least the first sheet portion is configured to modify the emitted light. By providing the light-modifying member as a stacked sheet element which has been separated from an integral stacked sheet structure, batch manufacturing of the light-modifying member and/or the light emitting module is enabled, such that manufacturing steps requiring manual labor, or use of expensive equipment may be performed to produce the integral stacked sheet structure. The costs for these manufacturing steps may then be distributed over a large number of components, thereby reducing manufacturing costs.

摘要翻译： 一种发光模块（19），包括能够发光的至少一个半导体光源（20a-c）和邻近所述至少一个半导体光源（20a-c）布置的光修饰构件（21） ）在光的发射方向上。 光修饰构件（21）由层叠的片状元件（21）形成，所述片状元件（21）与包括第一和第二层叠片材的整体堆叠片状结构分离，使得所述堆叠的片状元件（21）包括第一和第二片状部分 和第二堆叠片材，并且至少第一片材部分被配置为修改发射的光。 通过将光修改构件设置为与整体堆叠的片状结构分离的堆叠的片状元件，能够批量制造光修改构件和/或发光模块，使得需要体力劳动的制造步骤或 可以执行使用昂贵的设备以产生整体堆叠的片材结构。 然后，这些制造步骤的成本可以分布在大量组件上，从而降低制造成本。

公开(公告)号：US20080276454A1

公开(公告)日：2008-11-13

申请号：US12092835

申请日：2006-10-26

申请人： Johannes Wilhelmus Weekamp ,  Antonius Constant Johanna Cornelis Van Den Ackerveken ,  Will J.H. Ansems

发明人： Johannes Wilhelmus Weekamp ,  Antonius Constant Johanna Cornelis Van Den Ackerveken ,  Will J.H. Ansems

IPC分类号： H05K3/00 ,  H01R43/00

CPC分类号： H05K7/00 ,  B01L3/502707 ,  B01L2200/12 ,  B01L2300/0627 ,  B01L2300/0645 ,  B01L2300/0816 ,  B01L2300/0838 ,  H01L2224/85385 ,  H05K1/0284 ,  H05K1/182 ,  H05K3/0014 ,  H05K3/20 ,  H05K13/046 ,  H05K2201/09118 ,  H05K2201/10151 ,  Y10T29/49002 ,  Y10T29/49004 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49169 ,  Y10T29/4981

摘要： A package enclosing at least one microelectronic element (60) such as a sensor die and having electrically conductive connection pads (31) for electric connection of the package to another device is manufactured by providing a sacrificial carrier; applying an electrically conductive pattern (30) to one side of the carrier; bending the carrier in order to create a shape of the carrier in which the carrier has an elevated portion and recessed portions; forming a body member (45) on the carrier at the side where the electrically conductive pattern (30) is present; removing the sacrificial carrier; and placing a microelectronic element (60) in a recess (47) which has been created in the body member (45) at the position where the elevated portion of the carrier has been, and connecting the microelectronic element (60) to the electrically conductive pattern (30). Furthermore, a hole (41) is arranged in the package for providing access to a sensitive surface of the microelectronic element (60).

摘要翻译： 封装至少一个微电子元件（60）的封装（例如传感器裸片）并且具有导电连接焊盘（31），用于通过提供牺牲载体来将封装电连接到另一器件。 将导电图案（30）施加到所述载体的一侧; 弯曲载体以便形成载体的形状，其中载体具有升高部分和凹陷部分; 在所述载体上在所述导电图案（30）的一侧形成本体构件（45）; 去除牺牲载体; 以及将微电子元件（60）放置在已经在所述载体的所述升高部分的位置处已经在所述本体构件（45）中形成的凹部（47）中，并且将所述微电子元件（60）连接到所述导电 图案（30）。 此外，在封装中布置有一个孔（41），用于提供对微电子元件（60）敏感表面的通路。

公开(公告)号：US20080247910A1

公开(公告)日：2008-10-09

申请号：US12092840

申请日：2006-10-30

申请人： Johannes Wilhelmus Weekamp ,  Menno Willem Jose Prins ,  Albert Hendrik Jan Immink

发明人： Johannes Wilhelmus Weekamp ,  Menno Willem Jose Prins ,  Albert Hendrik Jan Immink

IPC分类号： G01N21/00 ,  B01J19/00

CPC分类号： B01L3/5029 ,  A61B10/0051 ,  A61B2010/0009 ,  B01L3/502715 ,  B01L2200/027 ,  B01L2300/0654 ,  B01L2300/0825 ,  B01L2400/0406 ,  B01L2400/065

摘要： A device (1) for testing a fluid comprises an elongated carrier (3); two foam members (5a, 5b) for absorbing the fluid, which are arranged at an end (4) of the carrier (3); a positioning member (6) comprising a sleeve (7) which is slidably arranged on the carrier (3); and a diagnostic device (2), which is arranged in the positioning member (6), and which comprises a sensor die (40) adapted to detecting at least one property of the fluid and means for supplying the fluid to a sensitive surface of the sensor die (40). After the fluid has been supplied to the foam members (5a, 5b), the positioning member (6) is moved towards the end (4) of the carrier (3) where the foam members (5a, 5b) are located. When the diagnostic device (2) comes into contact with one of the foam members (5a, 5b), the fluid is squeezed from the foam member (5a) and supplied to the sensitive surface of the sensor die (40), through the fluid supplying means of the diagnostic device (2).

摘要翻译： 用于测试流体的装置（1）包括细长载体（3）; 布置在载体（3）的端部（4）处的用于吸收流体的两个泡沫构件（5a，5b）; 定位构件（6），其包括可滑动地布置在所述载体（3）上的套筒（7）; 以及诊断装置（2），其布置在所述定位构件（6）中，并且包括适于检测所述流体的至少一种性质的传感器模具（40）和用于将所述流体供应到所述流体的敏感表面的装置 传感器模具（40）。 在将流体供应到泡沫构件（5a，5b）之后，定位构件（6）朝着载体（3）的端部（4）移动，其中泡沫构件（5a，5b） 位于。 当诊断装置（2）与一个泡沫构件（5a，5b）接触时，流体从泡沫构件（5a）被挤压并供应到传感器模具（40）的敏感表面， 通过诊断装置（2）的流体供给装置。

公开(公告)号：US20080218934A1

公开(公告)日：2008-09-11

申请号：US12065774

申请日：2006-08-24

申请人： Geert Langereis ,  Johannes Wilhelmus Weekamp ,  Jacobus Bernardus Giesbers

发明人： Geert Langereis ,  Johannes Wilhelmus Weekamp ,  Jacobus Bernardus Giesbers

IPC分类号： H01G7/00 ,  B32B37/30

CPC分类号： F04B43/043 ,  B01L3/5027 ,  B01L3/502707 ,  B01L3/50273 ,  B01L3/502738 ,  B01L2200/10 ,  B01L2200/12 ,  B01L2300/0645 ,  B01L2300/0874 ,  B01L2300/0887 ,  B01L2300/1827 ,  B01L2400/0481 ,  B01L2400/0638 ,  B81C1/00119 ,  B81C1/00182 ,  B81C99/0095 ,  B81C2201/019 ,  F16K99/0001 ,  F16K99/0007 ,  F16K99/0015 ,  F16K99/0034 ,  F16K99/0051 ,  F16K2099/008 ,  F16K2099/0084

摘要： The invention relates to a method of manufacturing a microsystem and further to such microsystem. With the method a microsystem can be manufactured by stacking pre-processed foils (10) having a conductive layer (11a, 11b) on at least one side. After stacking, the foils (10) are sealed, using pressure and heat. Finally the microsystems are separated from the stack (S). The pre-processing of the foils (preferably done by means of a laser beam) comprises a selection of the following steps: (A) leaving the foil intact, (B) locally removing the conductive layer, (C) removing the conductive layer and partially evaporating the foil (10), and (D) removing both the conductive layer as well as foil (10), thus making holes in the foil (10). In combination with said stacking, it is possible to create cavities, freely suspended cantilevers and membranes. This opens up the possibility of manufacturing various microsystems, like MEMS devices and microfluidic systems.

摘要翻译： 本发明涉及一种制造微系统并进一步涉及这种微系统的方法。 利用该方法，可以通过在至少一侧上堆叠具有导电层（11a，11b）的预处理箔（10）来制造微系统。 堆叠后，使用压力和热量将箔（10）密封。 最后，微系统与堆栈（S）分离。 箔的预处理（优选通过激光束进行）包括以下步骤的选择：（A）完全保留箔，（B）局部去除导电层，（C）去除导电层和 部分地蒸发箔（10），以及（D）去除导电层以及箔（10），从而在箔（10）中形成孔。 结合所述堆叠，可以产生空腔，自由悬挂的悬臂和膜。 这开辟了制造各种微系统的可能性，如MEMS器件和微流体系统。