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公开(公告)号:US20140291672A1
公开(公告)日:2014-10-02
申请号:US14220681
申请日:2014-03-20
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Shunpei YAMAZAKI , Masami JINTYOU , Yasutaka NAKAZAWA , Yukinori SHIMA
IPC: H01L27/12
Abstract: The stability of steps of processing a wiring formed using copper or the like is increased. The concentration of impurities in a semiconductor film is reduced. Electrical characteristics of a semiconductor device are improved. A semiconductor device includes a semiconductor film, a pair of first protective films in contact with the semiconductor film, a pair of conductive films containing copper or the like in contact with the pair of first protective films, a pair of second protective films in contact with the pair of conductive films on the side opposite the pair of first protective films, a gate insulating film in contact with the semiconductor film, and a gate electrode overlapping with the semiconductor film with the gate insulating film therebetween. In a cross section, side surfaces of the pair of second protective films are located on the outer side of side surfaces of the pair of conductive films.
Abstract translation: 处理使用铜等形成的布线的步骤的稳定性增加。 半导体膜中的杂质浓度降低。 提高了半导体器件的电气特性。 半导体器件包括半导体膜,与半导体膜接触的一对第一保护膜,与一对第一保护膜接触的包含铜等的一对导电膜,与第一保护膜接触的一对第二保护膜 一对导电膜位于与该对第一保护膜相对的一侧上,与该半导体膜接触的栅极绝缘膜以及与该半导体膜重叠的栅电极与该栅极绝缘膜之间。 在横截面中,一对第二保护膜的侧面位于一对导电膜的侧面的外侧。
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公开(公告)号:US20140209897A1
公开(公告)日:2014-07-31
申请号:US14161975
申请日:2014-01-23
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Daisuke KUBOTA , Ryo HATSUMI , Masami JINTYOU , Takumi SHIGENOBU , Naoto GOTO
IPC: H01L29/417 , H01L29/786
CPC classification number: H01L27/1255 , G02F1/13306 , G02F1/133305 , G02F1/133345 , G02F1/13338 , G02F1/133512 , G02F1/1339 , G02F1/1341 , G02F1/1343 , G02F1/136213 , G02F1/136286 , G02F1/1368 , G02F2001/133357 , G02F2001/13415 , G06F3/0412 , G06F3/044 , G06F2203/04108 , H01L27/1225 , H01L27/124 , H01L27/1248 , H01L27/127 , H01L28/60 , H01L29/24 , H01L29/41733 , H01L29/45 , H01L29/78633 , H01L29/7869 , H01L29/78696
Abstract: A semiconductor device having a high aperture ratio and including a capacitor capable of increasing the charge capacity is provided. A semiconductor device includes a transistor over a substrate, a first light-transmitting conductive film over the substrate, an oxide insulating film covering the transistor and having an opening over the first light-transmitting conductive film, a nitride insulating film over the oxide insulating film and in contact with the first light-transmitting conductive film in the opening, a second light-transmitting conductive film connected to the transistor and having a depressed portion in the opening, and an organic resin film with which the depressed portion of the second light-transmitting conductive film is filled.
Abstract translation: 提供了具有高开口率并且包括能够增加充电容量的电容器的半导体器件。 半导体器件包括:衬底上的晶体管,衬底上的第一透光导电膜,覆盖晶体管的氧化物绝缘膜,并且在第一透光导电膜上具有开口;氧化物绝缘膜上的氮化物绝缘膜 并且与开口部中的第一透光性导电膜接触,与该晶体管连接并具有开口部的凹部的第二透光性导电膜,以及第二透光性导电膜, 传输导电膜被填充。
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公开(公告)号:US20250159941A1
公开(公告)日:2025-05-15
申请号:US19023764
申请日:2025-01-16
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor: Shunpei YAMAZAKI , Junichi KOEZUKA , Masami JINTYOU , Yukinori SHIMA
Abstract: The semiconductor device includes a first insulating layer, a second insulating layer, an oxide semiconductor layer, and first to third conductive layers. The first conductive layer and the second conductive layer are connected to the oxide semiconductor layer. The second insulating layer includes a region in contact with the oxide semiconductor layer, and the third conductive layer includes a region in contact with the second insulating layer. The oxide semiconductor layer includes first to third regions. The first region and the second region are separated from each other, and the third region is located between the first region and the second region. The third region and the third conductive layer overlap with each other with the second insulating layer located therebetween. The first region and the second region include a region having a higher carbon concentration than the third region.
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公开(公告)号:US20250056837A1
公开(公告)日:2025-02-13
申请号:US18928429
申请日:2024-10-28
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor: Shunpei YAMAZAKI , Junichi KOEZUKA , Masami JINTYOU , Yukinori SHIMA , Takashi HAMOCHI , Yasutaka NAKAZAWA
IPC: H01L29/786 , G02F1/1333 , G02F1/1335 , G02F1/1339 , G02F1/1368 , H01L27/12 , H01L29/10 , H01L29/45 , H10K59/121
Abstract: A semiconductor device comprising an oxide semiconductor film, a gate electrode, a first insulating film, a source electrode, a drain electrode, and a second insulating film is provided. Each of a top surface of the gate electrode, a top surface of the source electrode, and a top surface of the drain electrode comprises a region in contact with the second insulating film. A top surface of the first insulating film comprises a region in contact with the gate electrode and a region in contact with the second insulating film and overlapping with the oxide semiconductor film in a cross-sectional view of the oxide semiconductor film. The oxide semiconductor film comprises a region in contact with the first insulating film and a region in contact with the second insulating film and adjacent to the region in contact with the first insulating film in the cross-sectional view.
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公开(公告)号:US20250040250A1
公开(公告)日:2025-01-30
申请号:US18790447
申请日:2024-07-31
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor: Junichi KOEZUKA , Masami JINTYOU , Yukinori SHIMA , Daisuke KUROSAKI , Masataka NAKADA , Shunpei YAMAZAKI
IPC: H01L27/12 , H01L29/786
Abstract: A semiconductor device including an oxide semiconductor in which on-state current is high is provided. The semiconductor device includes a first transistor provided in a driver circuit portion and a second transistor provided in a pixel portion; the first transistor and the second transistor have different structures. Furthermore, the first transistor and the second transistor are transistors having a top-gate structure. In an oxide semiconductor film of each of the transistors, an impurity element is contained in regions which do not overlap with a gate electrode. The regions of the oxide semiconductor film which contain the impurity element function as low-resistance regions. Furthermore, the regions of the oxide semiconductor film which contain the impurity element are in contact with a film containing hydrogen. The first transistor provided in the driver circuit portion includes two gate electrodes between which the oxide semiconductor film is provided.
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公开(公告)号:US20240272735A1
公开(公告)日:2024-08-15
申请号:US18627619
申请日:2024-04-05
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor: Shunpei YAMAZAKI , Hajime KIMURA , Masami JINTYOU , Yasuharu HOSAKA , Naoto GOTO , Takahiro IGUCHI , Daisuke KUROSAKI , Junichi KOEZUKA
CPC classification number: G06F3/0412 , G06F3/0446 , H01L27/1222 , H01L27/1225 , H01L27/124 , H01L27/1255 , H01L29/24 , H01L29/66969 , H01L29/7869 , H01L29/78696 , H10K59/40 , G06F2203/04103
Abstract: A touch panel including an oxide semiconductor film having conductivity is provided. The touch panel includes a transistor, a second insulating film, and a touch sensor. The transistor includes a gate electrode; a gate insulating film; a first oxide semiconductor film; a source electrode and a drain electrode; a first insulating film; and a second oxide semiconductor film. The second insulating film is over the second oxide semiconductor film so that the second oxide semiconductor film is positioned between the first insulating film and the second insulating film. The touch sensor includes a first electrode and a second electrode. One of the first and second electrodes includes the second oxide semiconductor film.
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公开(公告)号:US20230411526A1
公开(公告)日:2023-12-21
申请号:US18240775
申请日:2023-08-31
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor: Shunpei YAMAZAKI , Junichi KOEZUKA , Masami JINTYOU , Yukinori SHIMA , Takashi HAMOCHI , Yasutaka NAKAZAWA
IPC: H01L29/786 , G02F1/1339 , G02F1/1333 , G02F1/1335 , H01L27/12 , H01L29/10 , H01L29/45 , G02F1/1368
CPC classification number: H01L29/78606 , G02F1/13394 , G02F1/133345 , G02F1/133512 , G02F1/133514 , H01L27/124 , H01L27/1225 , H01L27/1233 , H01L27/1251 , H01L29/1033 , H01L29/45 , H01L29/7869 , H01L29/78648 , H01L29/78696 , G02F1/1368 , H10K59/1213
Abstract: A semiconductor device comprising an oxide semiconductor film, a gate electrode, a first insulating film, a source electrode, a drain electrode, and a second insulating film is provided. Each of a top surface of the gate electrode, a top surface of the source electrode, and a top surface of the drain electrode comprises a region in contact with the second insulating film. A top surface of the first insulating film comprises a region in contact with the gate electrode and a region in contact with the second insulating film and overlapping with the oxide semiconductor film in a cross-sectional view of the oxide semiconductor film. The oxide semiconductor film comprises a region in contact with the first insulating film and a region in contact with the second insulating film and adjacent to the region in contact with the first insulating film in the cross-sectional view.
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公开(公告)号:US20220293641A1
公开(公告)日:2022-09-15
申请号:US17830546
申请日:2022-06-02
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor: Junichi KOEZUKA , Masami JINTYOU , Yukinori SHIMA , Daisuke KUROSAKI , Masataka NAKADA , Shunpei YAMAZAKI
IPC: H01L27/12 , H01L29/786
Abstract: A semiconductor device including an oxide semiconductor in which on-state current is high is provided. The semiconductor device includes a first transistor provided in a driver circuit portion and a second transistor provided in a pixel portion; the first transistor and the second transistor have different structures. Furthermore, the first transistor and the second transistor are transistors having a top-gate structure. In an oxide semiconductor film of each of the transistors, an impurity element is contained in regions which do not overlap with a gate electrode. The regions of the oxide semiconductor film which contain the impurity element function as low-resistance regions. Furthermore, the regions of the oxide semiconductor film which contain the impurity element are in contact with a film containing hydrogen. The first transistor provided in the driver circuit portion includes two gate electrodes between which the oxide semiconductor film is provided.
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公开(公告)号:US20220013657A1
公开(公告)日:2022-01-13
申请号:US17398037
申请日:2021-08-10
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor: Shunpei YAMAZAKI , Masami JINTYOU , Yukinori SHIMA
IPC: H01L29/66 , H01L29/786 , H01L29/49 , H01L21/02 , H01L29/423
Abstract: Provided is a method for manufacturing a semiconductor device whose electric characteristics are prevented from being varied and whose reliability is improved. In the method, an insulating film is formed over an oxide semiconductor film, a buffer film is formed over the insulating film, oxygen is added to the buffer film and the insulating film, a conductive film is formed over the buffer film to which oxygen is added, and an impurity element is added to the oxide semiconductor film using the conductive film as a mask. An insulating film containing hydrogen and overlapping with the oxide semiconductor film may be formed after the impurity element is added to the oxide semiconductor film.
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公开(公告)号:US20220013545A1
公开(公告)日:2022-01-13
申请号:US17482492
申请日:2021-09-23
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor: Kenichi OKAZAKI , Masami JINTYOU , Takahiro IGUCHI , Yasuharu HOSAKA , Junichi KOEZUKA , Hiroyuki MIYAKE , Shunpei YAMAZAKI
IPC: H01L27/12 , H01L29/786 , G02F1/1368 , H01L29/49 , H01L49/02 , G02F1/1362
Abstract: Provided is a semiconductor device with high capacitance while the aperture ratio is increased or a semiconductor device whose manufacturing cost is low. The semiconductor device includes a transistor, a first insulating film, and a capacitor including a second insulating film between a pair of electrodes. The transistor includes a gate electrode, a gate insulating film in contact with the gate electrode, a first oxide semiconductor film overlapping with the gate electrode, and a source electrode and a drain electrode electrically connected to the first oxide semiconductor film. One of the pair of electrodes of the capacitor includes a second oxide semiconductor film. The first insulating film is over the first oxide semiconductor film. The second insulating film is over the second oxide semiconductor film so that the second oxide semiconductor film is between the first insulating film and the second insulating film.
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