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公开(公告)号:US20250169113A1
公开(公告)日:2025-05-22
申请号:US18930006
申请日:2024-10-29
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor: Shunpei YAMAZAKI , Toshimitsu OBONAI , Junichi KOEZUKA , Kenichi OKAZAKI
IPC: H10D30/67
Abstract: A semiconductor device with favorable electrical characteristics is provided. A semiconductor device with stable electrical characteristics is provided. A highly reliable display device is provided. The semiconductor device includes a first conductive layer, a first insulating layer, a semiconductor layer, and a pair of second conductive layers. The first insulating layer is in contact with a top surface of the first conductive layer. The semiconductor layer is in contact with a top surface of the first insulating layer. The pair of second conductive layers are in contact with a top surface of the semiconductor layer. The pair of second conductive layers are apart from each other in a region overlapping with the first conductive layer. The semiconductor layer contains indium and oxygen and has a composition falling within a range obtained by connecting first coordinates (1:0:0), second coordinates (2:1:0), third coordinates (14:7:1), fourth coordinates (7:2:2), fifth coordinates (14:4:21), sixth coordinates (2:0:3), and the first coordinates in this order with a straight line in a ternary diagram showing atomic ratios of indium to an element M and zinc. In addition, the element M is one or more of gallium, aluminum, yttrium, and tin.
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公开(公告)号:US20250160123A1
公开(公告)日:2025-05-15
申请号:US18835069
申请日:2023-03-06
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Yasuharu HOSAKA , Yukinori SHIMA , Masami JINTYOU , Masataka NAKADA , Junichi KOEZUKA , Kenichi OKAZAKI
IPC: H10K59/121 , H10K59/12
Abstract: A semiconductor device including a transistor having a minute size is provided. The semiconductor device includes a transistor, a first insulating layer, and a second insulating layer. The transistor includes a first semiconductor layer, a first conductive layer, a second conductive layer including a region overlapping with the first conductive layer with the first insulating layer therebetween, a third conductive layer, and a third insulating layer. The second conductive layer and the first insulating layer have a first opening reaching the first conductive layer. The first semiconductor layer is in contact with a top surface and a side surface of the second conductive layer, a side surface of the first insulating layer, and a top surface of the first conductive layer. The third insulating layer is provided over the first insulating layer, the first semiconductor layer, and the second conductive layer. The third conductive layer is provided over the third insulating layer. The second insulating layer is provided over the third conductive layer and the third insulating layer.
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公开(公告)号:US20250113716A1
公开(公告)日:2025-04-03
申请号:US18728173
申请日:2023-01-11
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Yasuharu HOSAKA , Yukinori SHIMA , Masami JINTYOU , Masataka NAKADA , Junichi KOEZUKA , Kenichi OKAZAKI
IPC: H10K59/131 , H10K59/12
Abstract: A semiconductor device including a miniaturized transistor is provided. The semiconductor device includes a semiconductor layer, a first conductive layer, a second conductive layer, a third conductive layer, a first insulating layer, and a second insulating layer. The first insulating layer is provided over the first conductive layer and includes a first opening reaching the first conductive layer. The second conductive layer is provided over the first insulating layer and includes a second opening in a region overlapping with the first opening. The semiconductor layer is in contact with a top surface of the first conductive layer, a side surface of the first insulating layer, and a top surface and a side surface of the second conductive layer. The second insulating layer is provided over the semiconductor layer. The third conductive layer is provided over the second insulating layer. The first insulating layer has a stacked-layer structure of a third insulating layer and a fourth insulating layer over the third insulating layer. The fourth insulating layer includes a region having a higher film density than the third insulating layer.
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公开(公告)号:US20240428737A1
公开(公告)日:2024-12-26
申请号:US18742105
申请日:2024-06-13
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Manabu SATO , Hironori MATSUMOTO , Takayuki ABE , Junichi KOEZUKA
IPC: G09G3/3241 , G09G3/3275
Abstract: A highly reliable semiconductor device or display device is provided. The semiconductor device has a function of inhibiting hot-carrier degradation of a transistor and includes a switch which includes a plurality of transistors connected in series and a diode connected to a node between the transistors. An appropriate potential supplied from the diode to the node can lower a source-drain voltage before the transistor is turned on, so that hot-carrier degradation can be inhibited.
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公开(公告)号:US20240079502A1
公开(公告)日:2024-03-07
申请号:US18505562
申请日:2023-11-09
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Junichi KOEZUKA , Kenichi OKAZAKI , Yukinori SHIMA , Yasutaka NAKAZAWA , Yasuharu HOSAKA , Shunpei YAMAZAKI
CPC classification number: H01L29/78696 , G06F3/0412 , G06F3/044 , H01L21/02554 , H01L21/02565 , H01L21/02631 , H01L27/0296 , H01L27/1225 , H01L27/1259 , H01L27/127 , H01L29/24 , H01L29/66969 , H01L29/78606 , H01L29/78648 , H01L29/7869 , G02F1/1368
Abstract: A semiconductor device with favorable electrical characteristics is to be provided. A highly reliable semiconductor device is to be provided. A semiconductor device with lower power consumption is to be provided. The semiconductor device includes a gate electrode, a first insulating layer over the gate electrode, a metal oxide layer over the first insulating layer, a pair of electrodes over the metal oxide layer, and a second insulating layer over the pair of electrodes. The first insulating layer includes a first region and a second region. The first region has a region being in contact with the metal oxide layer and containing more oxygen than the second region. The second region has a region containing more nitrogen than the first region. The metal oxide layer has at least a concentration gradient of oxygen in a thickness direction, and the concentration gradient becomes high on a first region side and on a second region side.
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公开(公告)号:US20220359575A1
公开(公告)日:2022-11-10
申请号:US17861430
申请日:2022-07-11
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Masashi OOTA , Noritaka ISHIHARA , Motoki NAKASHIMA , Yoichi KUROSAWA , Shunpei YAMAZAKI , Yasuharu HOSAKA , Toshimitsu OBONAI , Junichi KOEZUKA
IPC: H01L27/12 , H01L21/02 , H01L49/02 , H01L29/66 , H01L29/786 , H01L21/425 , H01L21/477
Abstract: To provide a method for manufacturing a semiconductor device including an oxide semiconductor film having conductivity, or a method for manufacturing a semiconductor device including an oxide semiconductor film having a light-transmitting property and conductivity. The method for manufacturing a semiconductor device includes the steps of forming an oxide semiconductor film over a first insulating film, performing first heat treatment in an atmosphere where oxygen contained in the oxide semiconductor film is released, and performing second heat treatment in a hydrogen-containing atmosphere, so that an oxide semiconductor film having conductivity is formed.
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公开(公告)号:US20220319866A1
公开(公告)日:2022-10-06
申请号:US17843083
申请日:2022-06-17
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor: Masami JINTYOU , Junichi KOEZUKA , Takashi HAMOCHI , Yasuharu HOSAKA
IPC: H01L21/385 , H01L21/02 , H01L21/44 , H01L21/443 , H01L21/4757 , H01L29/04 , H01L29/49 , H01L29/66 , H01L29/786
Abstract: The field-effect mobility and reliability of a transistor including an oxide semiconductor film are improved. Provided is a semiconductor device including an oxide semiconductor film. The semiconductor device includes a first insulating film, an oxide semiconductor film over the first insulating film, a second insulating film and a third insulating film over the oxide semiconductor film, and a gate electrode over the second insulating film. The second insulating film comprises a silicon oxynitride film. When excess oxygen is added to the second insulating film by oxygen plasma treatment, oxygen can be efficiently supplied to the oxide semiconductor film.
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公开(公告)号:US20220293795A1
公开(公告)日:2022-09-15
申请号:US17830376
申请日:2022-06-02
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor: Shunpei YAMAZAKI , Junichi KOEZUKA , Masami JINTYOU , Yukinori SHIMA , Takashi HAMOCHI , Yasutaka NAKAZAWA
IPC: H01L29/786 , H01L27/12 , H01L29/10 , H01L29/45 , G02F1/1333 , G02F1/1335 , G02F1/1339 , G02F1/1368
Abstract: A semiconductor device comprising an oxide semiconductor film, a gate electrode, a first insulating film, a source electrode, a drain electrode, and a second insulating film is provided. Each of a top surface of the gate electrode, a top surface of the source electrode, and a top surface of the drain electrode comprises a region in contact with the second insulating film. A top surface of the first insulating film comprises a region in contact with the gate electrode and a region in contact with the second insulating film and overlapping with the oxide semiconductor film in a cross-sectional view of the oxide semiconductor film. The oxide semiconductor film comprises a region in contact with the first insulating film and a region in contact with the second insulating film and adjacent to the region in contact with the first insulating film in the cross-sectional view.
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公开(公告)号:US20220285562A1
公开(公告)日:2022-09-08
申请号:US17750487
申请日:2022-05-23
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Junichi KOEZUKA , Yukinori SHIMA , Hajime TOKUNAGA , Toshinari SASAKI , Keisuke MURAYAMA , Daisuke MATSUBAYASHI
IPC: H01L29/786 , H01L21/02 , H01L29/51 , H01L29/66 , H01L29/24
Abstract: In a semiconductor device including a transistor including a gate electrode formed over a substrate, a gate insulating film covering the gate electrode, a multilayer film overlapping with the gate electrode with the gate insulating film provided therebetween, and a pair of electrodes in contact with the multilayer film, a first oxide insulating film covering the transistor, and a second oxide insulating film formed over the first oxide insulating film, the multilayer film includes an oxide semiconductor film and an oxide film containing In or Ga, the oxide semiconductor film has an amorphous structure or a microcrystalline structure, the first oxide insulating film is an oxide insulating film through which oxygen is permeated, and the second oxide insulating film is an oxide insulating film containing more oxygen than that in the stoichiometric composition.
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公开(公告)号:US20220285555A1
公开(公告)日:2022-09-08
申请号:US17743956
申请日:2022-05-13
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Shunpei YAMAZAKI , Junichi KOEZUKA , Kenichi OKAZAKI , Yukinori SHIMA , Shinpei MATSUDA , Haruyuki BABA , Ryunosuke HONDA
IPC: H01L29/786 , H01L27/12 , H01L29/66 , H01L29/778
Abstract: To improve field-effect mobility and reliability in a transistor including an oxide semiconductor film. A semiconductor device includes a transistor including an oxide semiconductor film. The transistor includes a region where the maximum value of field-effect mobility of the transistor at a gate voltage of higher than 0 V and lower than or equal to 10 V is larger than or equal to 40 and smaller than 150; a region where the threshold voltage is higher than or equal to minus 1 V and lower than or equal to 1 V; and a region where the S value is smaller than 0.3 V/decade.
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