公开(公告)号：US07729606B2

公开(公告)日：2010-06-01

申请号：US11682275

申请日：2007-03-05

申请人： Steven Webster ,  Ying-Cheng Wu ,  Chun-Hung Lin

发明人： Steven Webster ,  Ying-Cheng Wu ,  Chun-Hung Lin

IPC分类号： G02B7/04 ,  G02B7/02 ,  G03B3/00 ,  G03B13/00 ,  H04N5/225

CPC分类号： G02B7/021 ,  G02B7/023 ,  G02B7/025 ,  H04N5/2257

摘要： A digital camera module (100) includes a lens module (20) and a chip package (50) mounted in a light path of the lens module. The lens module includes a first lens assembly (21) and a second lens assembly (23). The first lens assembly includes a first fixture (211) having a through hole (212) defined therein and at least one lens (218) received in the through hole. The second assembly includes a second fixture (23) having a through hole (232) defined therein and at least one lens (238) attached therein. One of the first fixture and the second fixture has a slotted annular ring (213) protruding therefrom with an annular slot (214) defined therein. The other has a male annular ring (235) extending therefrom, and the slotted annular ring and the male annular ring matingly engage with each other to fix the first lens assembly and second assembly together.

摘要翻译： 数字照相机模块（100）包括安装在透镜模块的光路中的透镜模块（20）和芯片封装（50）。 透镜模块包括第一透镜组件（21）和第二透镜组件（23）。 第一透镜组件包括其中限定有通孔（212）的第一固定件（211）和容纳在通孔中的至少一个透镜（218）。 第二组件包括具有限定在其中的通孔（232）的第二固定件（23）和附接在其中的至少一个透镜（238）。 第一固定装置和第二固定装置之一具有从其中突出的开槽环形圈（213），其中限定有环形槽（214）。 另一个具有从其延伸的阳环形环（235），并且开槽的环形环和阳环形环彼此配合地接合以将第一透镜组件和第二组件固定在一起。

公开(公告)号：US07638864B2

公开(公告)日：2009-12-29

申请号：US11695441

申请日：2007-04-02

申请人： Ying-Cheng Wu ,  Chun-Hung Lin

发明人： Ying-Cheng Wu ,  Chun-Hung Lin

IPC分类号： H01L23/02

CPC分类号： H01L31/0203 ,  H01L24/48 ,  H01L24/85 ,  H01L27/14618 ,  H01L27/14627 ,  H01L31/0232 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/16195 ,  H01L2924/18165 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A digital camera module (100) includes a chip package (110) and a lens module (130), mounted on the chip package, for forming a focused image on the chip package. The chip package includes a supporter (112), a chip (114), a plurality of wires (116), a main adhesive (118), and a cover plate (119). The supporter includes a through hole defined therethrough and has a plurality of top contacts (1130) formed thereon around the through hole. The chip is disposed in the through hole and includes a plurality of pads (1144) arranged thereon. The wires electrically connect the pads to the top contacts. The main adhesive is applied to a gap between the chip and the supporter and fixes the chip to the supporter. The cover plate is adhered and supported on the main adhesive. A method for making the chip package is also provided.

摘要翻译： 数字照相机模块（100）包括安装在芯片封装上的芯片封装（110）和透镜模块（130），用于在芯片封装上形成聚焦图像。 芯片封装包括支撑件（112），芯片（114），多个电线（116），主粘合剂（118）和盖板（119）。 支撑件包括通过其定义的通孔，并且在通孔周围形成有多个顶部触头（1130）。 芯片设置在通孔中并且包括布置在其上的多个焊盘（1144）。 电线将焊盘电连接到顶部触点。 将主要粘合剂施加到芯片和支撑件之间的间隙，并将芯片固定到支撑件上。 盖板粘接并支撑在主粘合剂上。 还提供了制造芯片封装的方法。

公开(公告)号：US07626160B2

公开(公告)日：2009-12-01

申请号：US11617627

申请日：2006-12-28

申请人： Ying-Cheng Wu ,  Chun-Hung Lin

发明人： Ying-Cheng Wu ,  Chun-Hung Lin

IPC分类号： H01J40/14

CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L2224/8592

摘要： An image sensor package (110) includes a base board (111), a supporter (113), an image sensor (112), a plurality of wires (114), a main adhesive (115) and a cover board (116). The supporter includes a through hole and a plurality of top pads (113c) formed around the through hole, and the supporter is mounted on the base board and electrically connected to the base board. The image sensor is mounted on the base board and received in the through hole, and the image sensor includes a sensing portion (112b) and a plurality of contacts (112a). The wires electrically connect the top pads to the contacts. The main adhesive is applied on the image sensor and surrounds the sensing portion. The cover board supported on the main adhesive, and the cover board and the main adhesive cooperatively enclose the sensing portion of the image sensor.

摘要翻译： 图像传感器封装（110）包括基板（111），支撑件（113），图像传感器（112），多根电线（114），主粘合剂（115）和盖板（116）。 支撑体包括通孔和形成在通孔周围的多个顶部焊盘（113c），并且支撑件安装在基板上并电连接到基板。 图像传感器安装在基板上并被接收在通孔中，图像传感器包括感测部分（112b）和多个触点（112a）。 电线将顶部焊盘电连接到触点。 主要粘合剂被施加在图像传感器上并且围绕感测部分。 支撑在主粘合剂上的盖板，盖板和主粘合剂协同地包围图像传感器的感测部分。

公开(公告)号：US07560114B2

公开(公告)日：2009-07-14

申请号：US11952032

申请日：2007-12-06

申请人： Yuan-Yuan Wang ,  Kay-Hooi Khoo ,  Shui-Tein Chen ,  Chun-Cheng Lin ,  Chi-Huey Wong ,  Chun-Hung Lin ,  Hong-Sen Chen ,  Yow-Fu Tsai

发明人： Yuan-Yuan Wang ,  Kay-Hooi Khoo ,  Shui-Tein Chen ,  Chun-Cheng Lin ,  Chi-Huey Wong ,  Chun-Hung Lin ,  Hong-Sen Chen ,  Yow-Fu Tsai

IPC分类号： A61K36/06 ,  A61K9/00

CPC分类号： A61K36/074 ,  A23L33/105

摘要： The present invention provides methods of modulating an immune response in an organism by administering medicinally active extracts and fractions, and a method for preparing the same by extracting and fractioning constituents from the tissue of components of Ganoderma lucidum.

摘要翻译： 本发明提供了通过施用药物活性提取物和级分来调节生物体中的免疫应答的方法，以及通过从灵芝组分的组织提取和分馏成分的方法。

公开(公告)号：US20090140022A1

公开(公告)日：2009-06-04

申请号：US11987590

申请日：2007-12-03

申请人： Chun-Hung Lin

发明人： Chun-Hung Lin

IPC分类号： B62J11/00

CPC分类号： B62K19/34 ,  B62K19/40

摘要： A bicycle power unit case includes a controller received therein and a power unit is inserted into the case from a top of the case and electrically connected to the controller. The case includes a bottom-bracket hole through which the bottom bracket and crank extend. The case is connected to a low and central portion of the bicycle. The down tube, the seat tube and the chain stays are respectively inserted and fixed to the case. The power unit case does not affect the center of weight of the bicycle and the power unit can be easily replaced from a top of the case.

摘要翻译： 自行车动力单元壳体包括接收在其中的控制器，并且动力单元从壳体的顶部插入到壳体中并电连接到控制器。 壳体包括一个底部支架孔，底部托架和曲柄通过该孔延伸。 该壳体连接到自行车的低和中央部分。 下管，座管和链条撑条分别插入并固定到外壳上。 动力单元壳体不影响自行车的重量，动力单元可以从外壳的顶部轻松更换。

公开(公告)号：US20080310235A1

公开(公告)日：2008-12-18

申请号：US11763900

申请日：2007-06-15

申请人： Chun-Hung Lin ,  Yin-Chang Chen

发明人： Chun-Hung Lin ,  Yin-Chang Chen

IPC分类号： G11C11/4091

CPC分类号： G11C7/12 ,  G11C7/08 ,  G11C2207/005

摘要： A memory apparatus includes a plurality of memory units, a sensing circuit and a bias-generating circuit. The plurality of memory units respectively outputs a data current to the sensing circuit, while the sensing circuit further includes a plurality of first transistors, a plurality of second transistors and a plurality of sensing amplifiers. In order to speed up the access time of the memory units, the bias-generating circuit rapidly provides a bias signal to the sensing circuit to turn on the first transistors of the sensing circuit. In the present invention, the sensing circuit uses a common reference voltage to reduce the circuit utilization area of the memory apparatus.

摘要翻译： 存储装置包括多个存储单元，感测电路和偏置发生电路。 多个存储单元分别将数据电流输出到感测电路，而感测电路还包括多个第一晶体管，多个第二晶体管和多个感测放大器。 为了加快存储单元的访问时间，偏置产生电路快速地向感测电路提供偏置信号以接通感测电路的第一晶体管。 在本发明中，感测电路使用公共参考电压来减小存储装置的电路利用面积。

公开(公告)号：US20080283981A1

公开(公告)日：2008-11-20

申请号：US12108470

申请日：2008-04-23

申请人： Shih-Wen CHOU ,  Yu-Tang Pan ,  Chun-Hung Lin

发明人： Shih-Wen CHOU ,  Yu-Tang Pan ,  Chun-Hung Lin

IPC分类号： H01L23/495 ,  H01L21/98

CPC分类号： H01L23/49575 ,  H01L23/4951 ,  H01L23/49513 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A chip-stacked package structure comprises a lead frame, a first chip, and a second chip. The led frame is composed of a plurality of inner leads and a plurality of outer leads. The plurality of inner leads comprises a plurality of first inner leads in parallel and a plurality of second inner leads in parallel, wherein the ends of first inner leads and the ends of second inner leads are arranged in rows facing each other at a distance. The active surface of first chip is fixedly connected to the lower surface of first inner leads and second inner leads via a first adhesive layer. A plurality of metal pads is provided near the central area of the active surface of first chip and is exposed. A second adhesive layer is formed on the back surface of second chip for fixedly connecting the back surface of second chip and the upper surface of first inner leads and second inner leads. The gap formed by the thickness of second adhesive layer prevents the bonding wires connecting the first chip from contacting the back surface of second chip.

摘要翻译： 芯片堆叠封装结构包括引线框，第一芯片和第二芯片。 引线框架由多个内引线和多个外引线构成。 所述多个内部引线包括平行的多个第一内部引线和平行的多个第二内部引线，其中所述第一内部引线的端部和所述第二内部引线的端部被布置成彼此相隔一定距离的列。 第一芯片的有源表面通过第一粘合剂层固定地连接到第一内引线和第二内引线的下表面。 在第一芯片的有源表面的中心区域附近设置多个金属焊盘，并露出。 在第二芯片的后表面上形成第二粘合剂层，用于固定连接第二芯片的后表面和第一内引线的上表面和第二内引线。 由第二粘合剂层的厚度形成的间隙防止了连接第一芯片的接合线与第二芯片的背面接触。

公开(公告)号：US20080185017A1

公开(公告)日：2008-08-07

申请号：US12078505

申请日：2008-04-01

申请人： Chia-Chiang Chang ,  Chin-Jyi Wu ,  Chen-Der Tsai ,  Chun-Hung Lin

发明人： Chia-Chiang Chang ,  Chin-Jyi Wu ,  Chen-Der Tsai ,  Chun-Hung Lin

IPC分类号： B08B6/00

CPC分类号： H01J37/32825 ,  G02F1/1303 ,  G02F2001/1316 ,  G03F7/427 ,  H01J37/32366 ,  H01J37/32623 ,  H05H2001/3463

摘要： A film removal method and apparatus for removing a film from a substrate are disclosed. The method comprises the steps of disposing a plasma generator and a sucking apparatus over the substrate, projecting a plasma beam from the plasma generator onto the film obliquely, disposing the sucking apparatus on a reflection path of plasma projected by the plasma generator, and sucking a by-product of an incomplete plasma reaction occurring to the film so as to keep a surface of the substrate clean, with a view to overcoming the drawbacks of deposition of the by-product which results from using the plasma as a surface cleansing means under atmospheric conditions.

摘要翻译： 公开了一种从基板上去除膜的膜去除方法和装置。 该方法包括以下步骤：将等离子体发生器和吸附装置设置在衬底上，将等离子体发生器的等离子体束倾斜地投射到膜上，将吸引装置设置在由等离子体发生器投射的等离子体的反射路径上， 为了克服在大气压下使用等离子体作为表面清洁装置产生的副产物沉积的缺点，膜的发生不完全等离子体反应的副产物是保持基板的表面清洁的副产物 条件。

公开(公告)号：US07323176B2

公开(公告)日：2008-01-29

申请号：US11553402

申请日：2006-10-26

申请人： Yuan-Yuan Wang ,  Kay-Hooi Khoo ,  Shui-Tein Chen ,  Chun-Cheng Lin ,  Chi-Huey Wong ,  Chun-Hung Lin ,  Hong-Sen Chen ,  Yow-Fu Tsai

发明人： Yuan-Yuan Wang ,  Kay-Hooi Khoo ,  Shui-Tein Chen ,  Chun-Cheng Lin ,  Chi-Huey Wong ,  Chun-Hung Lin ,  Hong-Sen Chen ,  Yow-Fu Tsai

IPC分类号： A01N65/00 ,  A61K9/00 ,  A61K47/00 ,  A23K1/17

CPC分类号： A61K36/074 ,  A23L33/105

摘要： The present invention provides medicinally active extracts and fractions, and a method for preparing the same by extracting and fractioning constituents from the tissue of components of Ganoderma lucidum. These active extracts and fractions are useful for inhibiting tumor growth, modulating immune response, and increasing hematopoietic activity.

摘要翻译： 本发明提供药物活性提取物和级分，以及通过从灵芝组分的组织提取和分馏成分的方法制备该提取物和级分。 这些活性提取物和级分可用于抑制肿瘤生长，调节免疫应答和增加造血活性。

公开(公告)号：US20070274049A1

公开(公告)日：2007-11-29

申请号：US11724085

申请日：2007-03-14

申请人： Chun-Hung Lin ,  Tsung-Hui Wu ,  Wei-Chung Hsiao ,  Hsuan-Cheng Wang

发明人： Chun-Hung Lin ,  Tsung-Hui Wu ,  Wei-Chung Hsiao ,  Hsuan-Cheng Wang

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  H01L23/4006 ,  H01L2224/16 ,  H01L2224/73253

摘要： A cooler module mounted on a CPU on a circuit board inside a computer is disclosed to include a mounting base frame, which is made of a thermal conductive material and has a heat-transfer zone disposed in contact with the CPU and two arms respectively extended from two sides of the heat-transfer zone and affixed to the circuit board and two eyelet lugs vertically extended from two sides of the distal end of one of the two arms, a heat pipe, which has one end supported on the heat-transfer zone of the mounting base frame, an elongated retaining member, which has two lugs disposed at one end thereof and respectively fastened to the eyelet lugs of the mounting base frame, and a buffer member fastened to the heat-transfer zone to hold down heat pipe on the heat-transfer zone.

摘要翻译： 公开了一种安装在计算机内部的电路板上的CPU上的冷却器模块，其包括：安装基座框架，其由导热材料制成，并具有与CPU接触设置的传热区域和分别从 传热区的两侧，并固定到电路板和两个从两个臂之一的远端的两侧垂直延伸的孔眼突起，一个热管，其一端支撑在传热区的传热区 安装基座框架，细长的保持构件，其具有设置在其一端并分别固定到安装基座框架的孔眼凸耳上的两个凸耳，以及缓冲构件，其紧固到传热区以将热管保持在 传热区。