公开(公告)号：US20190256910A1

公开(公告)日：2019-08-22

申请号：US16403873

申请日：2019-05-06

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Allen Timothy Chang ,  Yi-Hsien Chang ,  Chun-Ren Cheng

IPC: C12Q1/6869 ,  G01N27/447 ,  B01F13/00 ,  G01N21/05 ,  B01L3/00 ,  G01N21/64

Abstract: An integrated semiconductor device for manipulating and processing bio-entity samples and methods are described. The device includes a lower substrate, at least one optical signal conduit disposed on the lower substrate, at least one cap bonding pad disposed on the lower substrate, a cap configured to form a capped area, and disposed on the at least one cap bonding pad, a fluidic channel, wherein a first side of the fluidic channel is formed on the lower substrate and a second side of the fluidic channel is formed on the cap, a photosensor array coupled to sensor control circuitry, and logic circuitry coupled to the fluidic control circuitry, and the sensor control circuitry.

公开(公告)号：US10145847B2

公开(公告)日：2018-12-04

申请号：US14497151

申请日：2014-09-25

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chia-Hua Chu ,  Allen Timothy Chang ,  Ching-Ray Chen ,  Yi-Hsien Chang ,  Yi-Shao Liu ,  Chun-Ren Cheng ,  Chun-Wen Cheng

IPC: G01N33/53 ,  G01N33/543 ,  H01L21/00

Abstract: The present disclosure provides biochips and methods of fabricating biochips. The method includes combining three portions: a transparent substrate, a first substrate with microfluidic channels therein, and a second substrate. Through-holes for inlet and outlet are formed in the transparent substrate or the second substrate. Various non-organic landings with support medium for bio-materials to attach are formed on the first substrate and the second substrate before they are combined. In other embodiments, the microfluidic channel is formed of an adhesion layer between a transparent substrate and a second substrate with landings on the substrates.

公开(公告)号：US09958443B2

公开(公告)日：2018-05-01

申请号：US15581673

申请日：2017-04-28

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Ching-Hui Lin ,  Chun-Ren Cheng ,  Shih-Fen Huang ,  Yi-Hsien Chang

IPC: H01L51/05 ,  G01N27/414 ,  G01N33/543 ,  H01L29/78 ,  C12Q1/00 ,  H01L51/00 ,  H01L29/66

CPC classification number: G01N33/5438 ,  C12Q1/006 ,  G01N27/414 ,  G01N27/4145 ,  G01N27/4148 ,  H01L29/66484 ,  H01L29/7831 ,  H01L29/7832 ,  H01L51/0093 ,  H01L51/0512

Abstract: Dual-gate ion-sensitive field effect transistors (ISFETs) for disease diagnostics are disclosed herein. An exemplary dual-gate ISFET includes a gate structure and a fluidic gate structure disposed over opposite surfaces of a device substrate. The gate structure is disposed over a channel region defined between a source region and a drain region in the device substrate. The fluidic gate structure includes a sensing well that is disposed over the channel region. The sensing well includes a sensing layer and an electrolyte solution. The electrolyte solution includes a constituent that can react with a product of an enzymatic reaction that occurs when an enzyme-modified detection mechanism detects an analyte. The sensing layer can react with a first ion generated from the enzymatic reaction and a second ion generated from a reaction between the product of the enzymatic reaction and the constituent, such that the dual-gate ISFET generates an enhanced electrical signal.

公开(公告)号：US09950522B2

公开(公告)日：2018-04-24

申请号：US14859835

申请日：2015-09-21

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Jung-Huei Peng ,  Chun-Ren Cheng ,  Jiou-Kang Lee ,  Shang-Ying Tsai ,  Ting-Hau Wu

IPC: B41J2/05 ,  B41J2/14 ,  B41J2/16

CPC classification number: B41J2/14088 ,  B41J2/14016 ,  B41J2/16 ,  B41J2/1626 ,  B41J2/1639 ,  B41J2/1642 ,  B41J2/1646

Abstract: MEMS devices and methods of fabrication thereof are described. In one embodiment, the MEMS device includes a bottom alloy layer disposed over a substrate. An inner material layer is disposed on the bottom alloy layer, and a top alloy layer is disposed on the inner material layer, the top and bottom alloy layers including an alloy of at least two metals, wherein the inner material layer includes the alloy and nitrogen. The top alloy layer, the inner material layer, and the bottom alloy layer form a MEMS feature.

公开(公告)号：US09677884B2

公开(公告)日：2017-06-13

申请号：US14300770

申请日：2014-06-10

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Ting-Hau Wu ,  Chun-Ren Cheng ,  Jiou-Kang Lee ,  Jung-Huei Peng ,  Shang-Ying Tsai

IPC: H04R31/00 ,  G01C19/56

CPC classification number: G01C19/56 ,  Y10T29/49002

Abstract: A method of forming a structure for a gyroscope sensor includes forming a first dielectric over a substrate and a material layer over the first dielectric layer. A first portion of the material layer is removed to form a recess and a second portion of the material layer is removed to define a first channel between a gyro disk and a frame. A second channel is formed in the substrate corresponding to the first channel, and a portion of the first dielectric is removed to form a second dielectric between the gyro disk and the substrate.

公开(公告)号：US09625493B2

公开(公告)日：2017-04-18

申请号：US13774708

申请日：2013-02-22

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Yi-Shao Liu ,  Chun-Ren Cheng ,  Chun-Wen Cheng

IPC: G01R31/00 ,  G01R1/073 ,  G01N27/414 ,  G01N27/416 ,  G01R1/067

CPC classification number: G01R1/07307 ,  B01J2219/00531 ,  B01J2219/00653 ,  B01J2219/00659 ,  B01J2219/00693 ,  G01N27/4145 ,  G01N27/4163 ,  G01R1/06783

Abstract: The present disclosure provides a biosensor device wafer testing and processing methods, system and apparatus. The biosensor device wafer includes device areas separated by scribe lines. A number of test areas that allow fluidic electrical testing are embedded in scribe lines or in device areas. An integrated electro-microfluidic probe card includes a fluidic mount that may be transparent, a microfluidic channels in the fluidic mount in a testing portion, at least one microfluidic probe and a number of electronic probe tips at the bottom of the fluidic mount, fluidic and electronic input and output ports on the sides of the fluidic mount, and at least one handle lug on the fluidic mount. The method includes aligning a wafer, mounting the integrated electro-microfluidic probe card, flowing one or more test fluids in series, and measuring and analyzing electrical properties to determine process qualities and an acceptance level of the wafer.

公开(公告)号：US09239328B2

公开(公告)日：2016-01-19

申请号：US13716709

申请日：2012-12-17

Applicant: Taiwan Semiconductor Manufacturing Company, LTD

Inventor： Yiu-Hsien Chang ,  Chun-Ren Cheng

IPC: G01N27/447 ,  G01N27/453 ,  G01N33/543 ,  B01L3/00

CPC classification number: G01N33/54366 ,  B01L3/502792 ,  B01L2300/0654 ,  B01L2300/0816 ,  B01L2300/0887 ,  B01L2300/161 ,  B01L2400/0427

Abstract: An integrated semiconductor device for manipulating and processing bio-entity samples is disclosed. The device includes a microfluidic channel that is coupled to fluidic control circuitry, a photosensor array coupled to sensor control circuitry, an optical component aligned with the photosensor array to manipulate a light signal before the light signal reaches the photosensor array, and a microfluidic grid coupled to the microfluidic channel and providing for transport of bio-entity sample droplets by electrowetting. The device further includes logic circuitry coupled to the fluidic control circuitry and the sensor control circuitry, with the fluidic control circuitry, the sensor control circuitry, and the logic circuitry being formed on a first substrate.

公开(公告)号：US20160011144A1

公开(公告)日：2016-01-14

申请号：US14799453

申请日：2015-07-14

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Yi-Shao Liu ,  Chun-Ren Cheng ,  Ching-Ray Chen ,  Yi-Hsien Chang ,  Fei-Lung Lai ,  Chun-Wen Cheng

IPC: G01N27/414 ,  H01L21/311 ,  H01L29/66

CPC classification number: G01N27/4145 ,  G01N27/4148 ,  H01L21/31105 ,  H01L27/088 ,  H01L29/66477

Abstract: The present disclosure provides a bio-field effect transistor (BioFET) device and methods of fabricating a BioFET and a BioFET device. The method includes forming a BioFET using one or more process steps compatible with or typical to a complementary metal-oxide-semiconductor (CMOS) process. The BioFET device includes a gate structure disposed on a first surface of a substrate and an interface layer formed on a second surface of the substrate. The substrate is thinned from the second surface to expose a channel region before forming the interface layer.

Abstract translation: 本公开提供了生物场效应晶体管（BioFET）器件和制造BioFET和BioFET器件的方法。 该方法包括使用与互补金属氧化物半导体（CMOS）工艺兼容或典型的一个或多个工艺步骤形成BioFET。 BioFET器件包括设置在衬底的第一表面上的栅极结构和形成在衬底的第二表面上的界面层。 在形成界面层之前，从第二表面减薄衬底以暴露沟道区。

公开(公告)号：US20160009089A1

公开(公告)日：2016-01-14

申请号：US14859835

申请日：2015-09-21

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Jung-Huei Peng ,  Chun-Ren Cheng ,  Jiou-Kang Lee ,  Shang-Ying Tsai ,  Ting-Hau Wu

IPC: B41J2/14

CPC classification number: B41J2/14088 ,  B41J2/14016 ,  B41J2/16 ,  B41J2/1626 ,  B41J2/1639 ,  B41J2/1642 ,  B41J2/1646

Abstract: MEMS devices and methods of fabrication thereof are described. In one embodiment, the MEMS device includes a bottom alloy layer disposed over a substrate. An inner material layer is disposed on the bottom alloy layer, and a top alloy layer is disposed on the inner material layer, the top and bottom alloy layers including an alloy of at least two metals, wherein the inner material layer includes the alloy and nitrogen. The top alloy layer, the inner material layer, and the bottom alloy layer form a MEMS feature.

Abstract translation: 描述了MEMS器件及其制造方法。 在一个实施例中，MEMS器件包括设置在衬底上的底部合金层。 内层材料层设置在底层合金层上，顶层合金层设置在内层材料层上，顶层合金层和底层合金层均含有至少两种金属的合金，其中内层含有合金和氮 。 顶部合金层，内部材料层和底部合金层形成MEMS特征。

公开(公告)号：US08846416B1

公开(公告)日：2014-09-30

申请号：US13801182

申请日：2013-03-13

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chia-Hua Chu ,  Allen Timothy Chang ,  Ching-Ray Chen ,  Yi-Hsien Chang ,  Yi-Shao Liu ,  Chun-Ren Cheng ,  Chun-Wen Cheng

IPC: H01L21/00 ,  G01N33/543

CPC classification number: G01N33/54386 ,  H01L21/00 ,  H01L2224/18

Abstract: The present disclosure provides biochips and methods of fabricating biochips. The method includes combining three portions: a transparent substrate, a first substrate with microfluidic channels therein, and a second substrate. Through-holes for inlet and outlet are formed in the transparent substrate or the second substrate. Various non-organic landings with support medium for bio-materials to attach are formed on the first substrate and the second substrate before they are combined. In other embodiments, the microfluidic channel is formed of an adhesion layer between a transparent substrate and a second substrate with landings on the substrates.

Abstract translation: 本公开提供了生物芯片和制造生物芯片的方法。 该方法包括组合三个部分：透明衬底，其中具有微流体通道的第一衬底和第二衬底。 用于入口和出口的通孔形成在透明基板或第二基板中。 在组合之前，在第一基板和第二基板上形成具有用于附着生物材料的支撑介质的各种非有机着陆。 在其他实施例中，微流体通道由透明基板和第二基板之间的粘合层形成，在基板上具有着陆。