公开(公告)号：US20130087900A1

公开(公告)日：2013-04-11

申请号：US13690386

申请日：2012-11-30

Applicant: Texas Instruments Incorporated

Inventor： Osvaldo Jorge Lopez ,  Jonathan Almeria Noquil ,  Juan Alejandro Herbsommer

IPC: H01L23/495

CPC classification number: H01L23/49568 ,  H01L23/3107 ,  H01L23/49537 ,  H01L23/49562 ,  H01L24/34 ,  H01L2224/32245 ,  H01L2224/8385 ,  H01L2224/8485 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A semiconductor device includes a source region, a gate region and a drain region. A first leadframe subassembly is coupled to the drain region. on a second side of the die are attached to a second leadframe subassembly. A second leadframe subassembly has a first portion electrically coupled with the source region and a second portion electrically coupled with the gate region. The first leadframe subassembly is attached to a third leadframe subassembly. A die is interposed between the first leadframe subassembly and the second leadframe subassembly. The height of the third leadframe subassembly provides a standoff for a distance between the first leadframe subassembly and the second leadframe subassembly.

Abstract translation: 半导体器件包括源极区，栅极区和漏极区。 第一引线框子组件耦合到漏区。 在模具的第二侧上附接到第二引线框子组件。 第二引线框子组件具有与源极区域电耦合的第一部分和与栅极区域电耦合的第二部分。 第一引线框子组件连接到第三引线框子组件。 模具插在第一引线框子组件和第二引线框子组件之间。 第三引线框子组件的高度提供了在第一引线框子组件和第二引线框子组件之间的距离的间隔。

公开(公告)号：US20240258683A1

公开(公告)日：2024-08-01

申请号：US18630918

申请日：2024-04-09

Applicant: Texas Instruments Incorporated

Inventor： Juan Alejandro Herbsommer

IPC: H01Q1/22 ,  H01Q1/36 ,  H01Q1/46 ,  H01Q9/06

CPC classification number: H01Q1/2283 ,  H01Q1/364 ,  H01Q1/46 ,  H01Q9/065

Abstract: A described example includes: a semiconductor die mounted to a die pad of a package substrate, the semiconductor die having bond pads on a device side surface facing away from the die pad; bond wires coupling the bond pads of the semiconductor die to leads of the package substrate, the leads spaced from the die pad; an antenna positioned over the device side surface of the semiconductor die and having a feed line coupled between the antenna and a device side surface of the semiconductor die; and mold compound covering the semiconductor die, the bond wires, a portion of the leads, and the die side surface of the die pad, a portion of the antenna exposed from the mold compound.

公开(公告)号：US20240160156A1

公开(公告)日：2024-05-16

申请号：US18482920

申请日：2023-10-09

Applicant: Texas Instruments Incorporated

Inventor： Juan Alejandro Herbsommer ,  Baher S Haroun

IPC: G04F5/14 ,  H01S1/06 ,  H03L7/26

CPC classification number: G04F5/145 ,  H01S1/06 ,  H03L7/26

Abstract: In one example, a method comprises filling a tube made of a same material with a dipolar gas; sealing a portion of the tube to form a container enclosing the dipolar gas. The method further comprises forming an electromagnetic reflective coating inside or outside the container, the electromagnetic reflective coating having an opening; and positioning an antenna at the opening.

公开(公告)号：US11796967B2

公开(公告)日：2023-10-24

申请号：US17001356

申请日：2020-08-24

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Juan Alejandro Herbsommer ,  Argyrios Dellis ,  Adam Joseph Fruehling

IPC: H03L7/26 ,  H03B17/00 ,  G04F5/14 ,  H01P5/16 ,  H01P5/18

CPC classification number: G04F5/14 ,  H03B17/00 ,  H03L7/26 ,  H01P5/16 ,  H01P5/185

Abstract: In a clock apparatus, a signal waveguide includes: a gas cell having a sealed interior; and a dipolar gas inside the sealed interior. A first apparatus is configured to provide a first electromagnetic wave through the sealed interior along a first direction. A second apparatus is configured to provide a second electromagnetic wave through the sealed interior along a second direction, in which the second direction is opposite the first direction. Also, the clock apparatus includes receiving apparatus coupled to the signal waveguide and configured to detect an amount of energy in the second electromagnetic wave passing through the dipolar gas.

公开(公告)号：US11675316B2

公开(公告)日：2023-06-13

申请号：US17527246

申请日：2021-11-16

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Adam Joseph Fruehling ,  Juan Alejandro Herbsommer ,  Argyrios Dellis

IPC: G04F5/14 ,  H03L7/26 ,  H04B1/40

CPC classification number: G04F5/14 ,  H03L7/26 ,  H04B1/40

Abstract: A millimeter wave apparatus, with a substrate, a transceiver in a first fixed position relative to the substrate, and a gas cell in a second fixed position relative to the substrate. The clock apparatus also comprises at least four waveguides.

公开(公告)号：US20220075325A1

公开(公告)日：2022-03-10

申请号：US17527246

申请日：2021-11-16

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Adam Joseph Fruehling ,  Juan Alejandro Herbsommer ,  Argyrios Dellis

IPC: G04F5/14 ,  H03L7/26 ,  H04B1/40

Abstract: A millimeter wave apparatus, with a substrate, a transceiver in a first fixed position relative to the substrate, and a gas cell in a second fixed position relative to the substrate. The clock apparatus also comprises at least four waveguides.

公开(公告)号：US10913654B2

公开(公告)日：2021-02-09

申请号：US16813967

申请日：2020-03-10

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Adam Joseph Fruehling ,  Juan Alejandro Herbsommer ,  Simon Joshua Jacobs ,  Benjamin Stassen Cook ,  James F. Hallas ,  Randy Long

IPC: B81B7/00 ,  H03L7/26 ,  G01L7/08 ,  G04F5/14 ,  G01M3/32 ,  G01L9/00

Abstract: An electronic device includes a package substrate, a circuit assembly, and a housing. The circuit assembly is mounted on the package substrate. The circuit assembly includes a first sealed cavity formed in a device substrate. The housing is mounted on the package substrate to form a second sealed cavity about the circuit assembly.

公开(公告)号：US10910705B2

公开(公告)日：2021-02-02

申请号：US16447419

申请日：2019-06-20

Applicant: Texas Instruments Incorporated

Inventor： Vikas Gupta ,  Athena Lin ,  Juan Alejandro Herbsommer

IPC: H01Q1/38 ,  H01L23/66 ,  H01L23/31 ,  H01L23/00 ,  H01L23/538 ,  H01L25/16 ,  H01L23/498 ,  H01L21/48 ,  H01L23/14 ,  H01L23/15 ,  H01L21/56 ,  H01Q1/22 ,  H04B1/40 ,  H01Q1/24

Abstract: An antenna-in-package (AiP) device includes a substrate stack having a ceramic substrate attached to an organic substrate, where a dielectric constant of the ceramic substrate is higher than a dielectric constant of the organic substrate. An antenna is on a top side of the ceramic substrate. An integrated circuit (IC) die is flip chip attached to a bottom side of the ceramic substrate or to a top surface of the organic substrate. The IC die includes a radio circuit including at least a transmitter, and there is at least one interconnect for coupling the radio circuit to the antenna.

公开(公告)号：US20200209062A1

公开(公告)日：2020-07-02

申请号：US16234195

申请日：2018-12-27

Applicant: Texas Instruments Incorporated

Inventor： Adam Joseph Fruehling ,  Juan Alejandro Herbsommer ,  Argyrios Dellis

IPC: G01J3/42 ,  G01N21/3581

Abstract: A compact mmW spectroscopy cell system for detecting volatile organic compounds (compounds) in a gas. The system includes a gas collection chamber, an input buffer cavity for receiving the gas from the gas collection chamber, pumping devices to pass the gas from the buffer cavity to an absorption cell and maintain pressure, and a transceiver connected to the cell. The transceiver interrogates the absorption cell filled with the gas by passing a high frequency electromagnetic signal and sweeping the signal to generate an absorption spectra which is compared to a spectroscopy database for detecting the compounds in the gas. The absorption cell, collection chambers, and pumping devices are fabricated with standard CMOS processing techniques at chip and wafer scale. The transceiver bonded to the absorption cell with chip scale integration.

公开(公告)号：US10549986B2

公开(公告)日：2020-02-04

申请号：US15697525

申请日：2017-09-07

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Juan Alejandro Herbsommer ,  Simon Joshua Jacobs ,  Benjamin Stassen Cook ,  Adam Joseph Fruehling

IPC: B81C1/00 ,  H01L23/08 ,  H01L21/768

Abstract: An illustrate method (and device) includes etching a cavity in a first substrate (e.g., a semiconductor wafer), forming a first metal layer on a first surface of the first substrate and in the cavity, and forming a second metal layer on a non-conductive structure (e.g., glass). The method also may include removing a portion of the second metal layer to form an iris to expose a portion of the non-conductive structure, forming a bond between the first metal layer and the second metal layer to thereby attach the non-conductive structure to the first substrate, sealing an interface between the non-conductive structure and the first substrate, and patterning an antenna on a surface of the non-conductive structure.