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214 条记录 (耗时 0.039 秒)

    Imaging Module
    51.
    发明申请
    Imaging Module 有权
    成像模块

    公开(公告)号：US20110013077A1

    公开(公告)日：2011-01-20

    申请号：US12934260

    申请日：2009-03-03

    申请人： Hiroshi Okada

    发明人： Hiroshi Okada

    IPC分类号： H04N5/225

    CPC分类号： H04N5/2254 ,  G03B17/02 ,  H04N5/2253 ,  H04N5/2257

    摘要： An imaging module includes an imaging substrate mounting an imaging device thereon, a substrate holding plate, a holder. The substrate holding plate includes four substrate securing portions for securing the imaging substrate that are located opposing to four corners of the imaging substrate, respectively, an opening portion surrounded by the four substrate securing portions, and four holder securing portions that are located outwardly from the four substrate securing portions in a longitudinal direction thereof, respectively. The holder is formed integrally with a lens support barrel configured to support a lens unit at an inside thereof, and has plate securing portions configured to secure the holder securing portions at positions opposed to the holder securing portions of the substrate holding plate, respectively. The imaging module causes little residual compressive stress left in the imaging substrate, so that it can acquire high-resolution images.

    摘要翻译： 成像模块包括在其上安装成像装置的成像基板，基板保持板，保持器。 基板保持板包括用于固定成像基板的四个基板固定部分，分别与成像基板的四个角相对设置有由四个基板固定部分围绕的开口部分，以及四个保持器固定部分， 四个基板固定部分分别在纵向方向上。 支架与透镜支撑筒一体地形成，该透镜支撑筒构造成在其内侧支撑透镜单元，并且具有板固定部，其分别构造成将保持器固定部分固定在与基板保持板的保持器固定部相对的位置。 成像模块在成像基板中留下残留的压缩应力很小，从而可以获得高分辨率图像。

    Gas compressor having a pair of housing heads
    54.
    发明授权
    Gas compressor having a pair of housing heads 失效
    气体压缩机具有一对壳体头部

    公开(公告)号：US07553144B2

    公开(公告)日：2009-06-30

    申请号：US11785616

    申请日：2007-04-19

    申请人： Hiroshi Okada ,  Eitarou Tanaka

    发明人： Hiroshi Okada ,  Eitarou Tanaka

    IPC分类号： F01C1/16 ,  F01C1/24 ,  F03C2/00

    CPC分类号： F04C18/16 ,  F04C18/086

    摘要： In a gas compressor, housing heads are disposed to define an internal space with a housing, and two rotors housed in the internal space are rotatable to form in the internal space a compression chamber. The housing has an inner wall surface opposed to at least outer peripheral surfaces of the two rotors, and the housing heads are provided in correspondence to the respective rotors. One end portion of a rotary shaft of each rotor is supported by the housing, and other end portion of the rotary shaft of each rotor is supported by the housing heads. The housing heads have a first outer peripheral portion corresponding to the inner wall surface of the housing, and a second outer peripheral portion larger than the first outer peripheral portion. Furthermore, the first outer peripheral portion of the housing heads is fitted onto the inner wall surface of the housing.

    摘要翻译： 在气体压缩机中，壳体头部设置成限定具有壳体的内部空间，并且容纳在内部空间中的两个转子可旋转，以在内部空间中形成压缩室。 壳体具有与两个转子的至少外周表面相对的内壁表面，并且壳体头部相应于各个转子设置。 每个转子的旋转轴的一端部由壳体支撑，并且每个转子的旋转轴的另一端部被壳体头支撑。 壳体头部具有对应于壳体的内壁表面的第一外周部分和大于第一外周部分的第二外周部分。 此外，壳体头部的第一外周部分装配到壳体的内壁表面上。

    Lead-free solder balls and method for the production thereof
    55.
    发明授权
    Lead-free solder balls and method for the production thereof 有权
    无铅焊球及其制造方法

    公开(公告)号：US07425299B2

    公开(公告)日：2008-09-16

    申请号：US10962747

    申请日：2004-10-13

    申请人： Rikiya Kato ,  Shinichi Nomoto ,  Hiroshi Okada

    发明人： Rikiya Kato ,  Shinichi Nomoto ,  Hiroshi Okada

    IPC分类号： C22C13/00

    CPC分类号： B22F9/08 ,  B22F2009/0804 ,  B22F2009/0864 ,  B23K35/0244 ,  B23K35/262 ,  C22C1/04 ,  C22C13/00 ,  H05K3/3436 ,  H05K3/3463

    摘要： Lead-free solder balls having a good surface appearance with no appreciable surface defects such as seams and shrinkage cavities comprises an alloy having a composition consisting essentially of about 4.0% to about 6.0% by weight of Ag, about 1.0% to about 2.0% by weight of Cu, and a balance of Sn, and they have a diameter of from 0.05 mm to 1.0 mm. The solder balls can be produced by forming a molten alloy having the above-described composition into solidified balls having a diameter of from 0.05 mm to 1.0 mm using the surface tension of the molten alloy.

    摘要翻译： 具有良好表面外观且没有明显的表面缺陷（例如接缝和收缩空腔）的无铅焊球包括合金，其组成基本上包含约4.0％至约6.0％重量的Ag，约1.0％至约2.0％ Cu的重量和Sn的余量，它们的直径为0.05mm至1.0mm。 可以使用熔融合金的表面张力，通过将具有上述组成的熔融合金形成为具有0.05mm至1.0mm直径的固化球来制造焊球。

    Temperature compensation circuit
    56.
    发明授权
    Temperature compensation circuit 失效
    温度补偿电路

    公开(公告)号：US07405610B2

    公开(公告)日：2008-07-29

    申请号：US11455868

    申请日：2006-06-20

    申请人： Hiroshi Okada

    发明人： Hiroshi Okada

    IPC分类号： H03K17/14 ,  H01L35/00

    CPC分类号： H03F3/45968 ,  G11C7/04 ,  H03F1/302 ,  H03F3/3435 ,  H03F2200/375 ,  H03F2200/447 ,  H03F2203/45212

    摘要： A temperature compensation circuit consists of a thermo sensitive resistance, a fixed resistance, a logic buffer, and a logic inverter, without incorporating any operational amplifier. A resistance value of the thermo sensitive resistance is changed by temperature change. The fixed resistance has a small temperature changes that is smaller than that of the thermo sensitive resistance. Both the fixed resistance and the thermo sensitive resistance are connected electrically to an output terminal of the temperature compensation circuit. The logic buffer sets the other terminal of the fixed resistance to a first voltage that is one of a voltage level of a power source and a ground level. The logic inverter sets the other terminal of the thermo sensitive resistance to a second voltage that is reversed to the first voltage.

    摘要翻译： 温度补偿电路由热敏电阻，固定电阻，逻辑缓冲器和逻辑反相器组成，不需要任何运算放大器。 热敏电阻的电阻值由温度变化而变化。 固定电阻的温度变化小于热敏电阻的温度变化。 固定电阻和热敏电阻都与温度补偿电路的输出端子电连接。 逻辑缓冲器将固定电阻的另一个端子设置为作为电源的电压电平和地电平之一的第一电压。 逻辑逆变器将热敏电阻的另一端设置为与第一电压相反的第二电压。

    Lead-free solder ball
    59.
    发明申请
    Lead-free solder ball 有权
    无铅焊球

    公开(公告)号：US20070069379A1

    公开(公告)日：2007-03-29

    申请号：US10570626

    申请日：2004-10-06

    申请人： Daisuke Souma ,  Takahiro Roppongi ,  Hiroshi Okada ,  Hiromi Kawamata

    发明人： Daisuke Souma ,  Takahiro Roppongi ,  Hiroshi Okada ,  Hiromi Kawamata

    IPC分类号： H01L23/48

    CPC分类号： C22C13/00 ,  B23K35/262 ,  H01L2924/0002 ,  H05K3/3436 ,  H05K3/3463 ,  H01L2924/00

    摘要： A Sn—Ag—Cu based lead-free solder ball which does not undergo yellowing of its surface when formed into a solder bump on an electrode of an electronic part such as a BGA package. The solder ball has excellent wettability and does not form voids at the time of soldering, even when it has a minute diameter such as 0.04-0.5 mm. It has a composition comprising 1.0-4.0 mass % of Ag, 0.05-2.0 mass % of Cu, 0.0005-0.005 mass % of P, and a remainder of Sn.

    摘要翻译： 一种Sn-Ag-Cu系无铅焊球，当形成BGA封装等电子部件的电极上的焊锡凸块时，其表面不会发黄。 焊锡球具有优异的润湿性，即使在具有0.04-0.5mm的微小直径的情况下也不会在焊接时形成空隙。 其具有1.0-4.0质量％的Ag，0.05-2.0质量％的Cu，0.0005-0.005质量％的P和余量的Sn的组成。

    Opening and closing apparatus for opening and closing body of vehicle
    60.
    发明申请
    Opening and closing apparatus for opening and closing body of vehicle 失效

    公开(公告)号：US20070063536A1

    公开(公告)日：2007-03-22

    申请号：US11480925

    申请日：2006-07-06

    申请人： Hiroshi Okada ,  Nao Mizumoto

    发明人： Hiroshi Okada ,  Nao Mizumoto

    IPC分类号： B60J5/00

    CPC分类号： E05F15/619 ,  E05Y2201/216 ,  E05Y2201/246 ,  E05Y2201/462 ,  E05Y2900/546

    摘要： An opening and closing apparatus for an opening and closing body of a vehicle. The opening and closing apparatus includes a reciprocating member connected at its connecting portion to a motor so as to be moved to reciprocate along a plane perpendicular to a hinge shaft, the reciprocating member having a side surface parallel with the plane perpendicular to the hinge shaft. A connecting member is provided having a first end section pivotally attached to an end portion of the reciprocating member, and a second end section fixed to the opening and closing body. A deflection-suppressing device is provided to a stationary body connected to the vehicle body. A part of the side surface of the reciprocating member is slidably contacted with the deflection-suppressing device and is located between the connecting portion of the reciprocating member and the connecting member.