摘要:
To decode coded pictures each of which has dependencies within the picture, using conventional decoding circuits and without deteriorating the efficiency in parallel processing.An image decoding device (100) includes: a stream segmentation unit (110) which segments a bit stream such that each of the coded pictures are segmented into two areas; and decoding processing units (120, 130) each of which decodes a corresponding one of the two segmented bit streams. The respective decoding processing units (120, 130) include: decoding units (123, 133) each of which generates decoded data including pixel data and control data; transfer determination units (124, 134) each of which determines whether or not the decoded data is referred to in another one of the processing units; data transfer units (125, 135) each of which transfers decoded data to the other processing unit; and decoding determination units (122, 132) each of which determines whether or not the decoded data to be referred to has been obtained. Each of the decoding units (123, 133) decodes a corresponding one of the segmented bit streams when reference decoded data has been obtained.
摘要:
A wire-discharge machining apparatus controls a short circuit between a wire electrode and a workpiece and wire-breakage, and makes it easy to improve productivity, by performing power supply control to mix an upper-side power supply state in which a high-frequency pulse voltage is applied from an upper-side power supplying unit, a lower-side power supply state in which the high-frequency pulse voltage is applied from a lower-side power supplying unit, and a both-sides power supply state in which the high-frequency pulse voltage is applied to the wire electrode from both power supplying units in synchronization with each other during a period of electric discharge machining.
摘要:
A machining-energy calculating unit accumulates a discharge current value for each discharge position to calculate a machining energy in a certain time period from the present time to the past time. An energy-distribution changing unit determines the presence or absence of imbalance in the energy by obtaining a machining energy distribution in an up-down direction of the machining gap based on the machining energy, and when there is imbalance, the energy-distribution changing unit produces a new open/close pattern in which a machining energy distribution that eliminates the imbalance. Power feeding is then performed based on the new open/close pattern.
摘要:
In a semiconductor device which includes a split-gate type memory cell having a control gate and a memory gate, a low withstand voltage MISFET and a high withstand voltage MISFET, variations of the threshold voltage of the memory cell are suppressed. A gate insulating film of a control gate is thinner than a gate insulating film of a high withstand voltage MISFET, the control gate is thicker than a gate electrode 14 of the low withstand voltage MISFET and the ratio of thickness of a memory gate with respect to the gate length of the memory gate is larger than 1. The control gate and a gate electrode 15 are formed in a multilayer structure including an electrode material film 8A and an electrode material layer 8B, and the gate electrode 14 is a single layer structure formed at the same time as the electrode material film 8A of the control gate.
摘要:
In a semiconductor device which includes a split-gate type memory cell having a control gate and a memory gate, a low withstand voltage MISFET and a high withstand voltage MISFET, variations of the threshold voltage of the memory cell are suppressed. A gate insulating film of a control gate is thinner than a gate insulating film of a high withstand voltage MISFET, the control gate is thicker than a gate electrode 14 of the low withstand voltage MISFET and the ratio of thickness of a memory gate with respect to the gate length of the memory gate is larger than 1. The control gate and a gate electrode 15 are formed in a multilayer structure including an electrode material film 8A and an electrode material layer 8B, and the gate electrode 14 is a single layer structure formed at the same time as the electrode material film 8A of the control gate.
摘要:
The integrated circuit package according to the present invention comprises: a plurality of functioning units operable to perform processing on input data and output a result of the processing; a plurality of antenna units each of which is positioned to (i) receive radio-transmitted data from at least another one of the plurality of antenna units by radio and (ii) transmit data to at least another one of the plurality of antenna units by radio; a first switching unit operable to selectively connect output of a first functioning unit, which is one of the plurality of functioning units, and a first antenna unit, which is one of the plurality of antenna units; and a second switching unit operable to selectively connect a second antenna unit, which is positioned to receive the radio-transmitted data from the first antenna unit by radio, and input of a second functioning unit different from the first functioning unit.
摘要:
An object of the present invention is to provide a light-emitting device with a high output and a high efficiency by improving the efficiency for utilizing light emitted from a semiconductor light-emitting element.The inventive semiconductor light-emitting device comprises a package substrate, a sub-mount provided on the package substrate, a semiconductor light-emitting element provided on the sub-mount, and a reflector surrounding the sub-mount and the semiconductor light-emitting element, wherein the positions and sizes of the sub-mount, light-emitting element and reflector satisfy the following relationship (A) on a cross section perpendicular to the package substrate that passes through the center of the semiconductor light-emitting element, r−1s≦(hs−d)×(1s−1c)/hc (A) wherein r, 1s and 1c are distances from the drooping portion of the reflector, from the outer circumference of the sub-mount and from the outer circumference of the semiconductor light-emitting element to the center of the semiconductor light-emitting element, respectively, hs and d are heights of the sub-mount and of the drooping portion of the reflector, respectively, and hc is a height of the upper surface of the semiconductor light-emitting element from the upper surface of the sub-mount.
摘要:
A weather strip includes a bottom wall that faces or is in contact with an end face of a fixed window glass that closes a window opening of a side door. An outer wall extends from the bottom wall on an outer side of the vehicle body with respect to the fixed window glass, and an inner wall extends from the bottom wall on an inner side of the vehicle body with respect to the fixed window glass so that the inner wall and the outer wall sandwich a peripheral portion of the fixed window glass in a thickness direction. The inner wall is provided with a spacing groove for creating a space between the fixed window glass and the inner wall.
摘要:
A discharge-generation control unit applies at least a preliminary-discharge voltage pulse and a main-discharge voltage pulse between a wire electrode and a work. A discharge-position determining unit determines a discharge position from results of measurement by a plurality of current measuring units. A machining-energy adjusting unit adjusts machining energy generated by the main-discharge voltage pulse based on a discharge position determined before applying the main-discharge voltage pulse, and reflects a result of the adjustment on the generation of an electric discharge by feeding the result to the discharge-generation control unit.
摘要:
A pin layout which prevents degradation of a frequency characteristic of a low noise amplifier and a receiving mixer included in a semiconductor integrated circuit for dual-band transmission/reception wherein the circuit of the low noise amplifier is provided at a position where the distance from the end of a pin outside the package of the low noise amplifier to the pad is the shortest; ground pins of two low noise amplifiers and the high frequency signal pins are arranged respectively so as not to be adjacent to each other; the power source and ground pin of the low noise amplifier, and the power source and ground pin of the bias circuit are respectively separated; and high frequency signal wires do not intersect each other.