-
公开(公告)号：US20230303852A1
公开(公告)日：2023-09-28
申请号：US18183641
申请日：2023-03-14
申请人： Hiroyuki Naito , Yuki Shingai , Noriaki Okada
发明人： Hiroyuki Naito , Yuki Shingai , Noriaki Okada
IPC分类号： C09D4/06 , C09D135/02 , C09D175/14 , C09D7/62 , C09D7/40 , A61C13/00 , A61C13/08 , B33Y70/00
CPC分类号： C09D4/06 , C09D135/02 , C09D175/14 , C09D7/62 , C09D7/67 , C09D7/68 , A61C13/0013 , A61C13/08 , B33Y70/00 , B33Y10/00
摘要： A curable composition containing a radical-polymerizable monomer and a hard solid component having a volume average particle diameter of 10 nm or greater and 1,000 nm or less is provided. The content of the hard solid component is 3% by volume or greater and 40% by volume or less. The difference (n1−n2) between the refractive index (n1) of a cured product of any other component than the hard solid component and the refractive index (n2) of the hard solid component is 0.04 or greater.
-
公开(公告)号：US10589125B2
公开(公告)日：2020-03-17
申请号：US16058527
申请日：2018-08-08
摘要： Provided is a bolus formed of a hydrogel, wherein the hydrogel includes water, a polymer, and a mineral, and wherein the bolus is applied to a patient who receives a radiation therapy.
-
53.发明申请公开(公告)号：US20180272615A1
公开(公告)日：2018-09-27
申请号：US15920676
申请日：2018-03-14
IPC分类号： B29C64/40 , B29C64/112 , B33Y10/00
CPC分类号： B29C64/40 , B29C64/112 , B33Y10/00 , B33Y40/00
摘要： A method of manufacturing a solid freeform fabrication includes forming a liquid film constituting a model part and a detail part with a model part forming material and a detail part forming material, respectively, curing the liquid film, repeating the forming and the curing, wherein the model part includes one or more surfaces without a support and the detail part is disposed adjacent to at least one of the one or more surfaces.
-
54.发明申请公开(公告)号：US20180264717A1
公开(公告)日：2018-09-20
申请号：US15901924
申请日：2018-02-22
IPC分类号： B29C64/112 , B29C64/40 , B29C64/20 , B33Y10/00 , B33Y30/00 , B33Y70/00 , C09D133/24 , C09D133/26
CPC分类号： B29C64/112 , B29C64/20 , B29C64/209 , B29C64/227 , B29C64/232 , B29C64/236 , B29C64/245 , B29C64/264 , B29C64/40 , B29K2105/0002 , B29K2995/0062 , B33Y10/00 , B33Y30/00 , B33Y70/00 , C09D133/24 , C09D133/26
摘要： A method of fabricating a solid freeform fabrication object, includes discharging multiple liquid droplets of modeling material and multiple liquid droplets of supporting material to a stage by a discharging device, merging the multiple liquid droplets of the modeling material into a liquid droplet of the modeling material in the air and the multiple liquid droplets of the supporting material into a liquid droplet of the supporting material in the air, curing the liquid droplet of the modeling material and the liquid droplet of the supporting material on the stage to form a layered fabrication object, and repeating the discharging and the curing to laminate the layered fabrication object to manufacture the solid freeform fabrication object, wherein the discharging device stands still during at least the discharging to a boundary area of the modeling material and the supporting material on the stage.
-
55.发明申请公开(公告)号：US20170270831A1
公开(公告)日：2017-09-21
申请号：US15450720
申请日：2017-03-06
CPC分类号： G09B23/30 , B29C64/112 , B29C64/20 , B29K2105/0032 , B29K2105/0061 , B29K2995/002 , B29L2031/40 , B29L2031/7532 , B33Y10/00 , B33Y30/00 , B33Y70/00 , B33Y80/00
摘要： A solid freeform fabrication object includes a hydrogel including a polymer, water, and a coloring material inclusion substance.
-
56.发明申请DRUG COMPOSITIONS AND METHODS FOR PREVENTING AND TREATING THROMBOSIS OR EMBOLISM 审中-公开药物组合物和预防和治疗血栓形成或栓塞的方法公开(公告)号：US20090281074A1
公开(公告)日：2009-11-12
申请号：US12250586
申请日：2008-10-14
申请人： Toshiharu OHTA , Satoshi Komoriya , Toshiharu Yoshino , Kouichi Outo , Yumi Nakamoto , Hiroyuki Naito , Akiyoshi Mochizuki , Tsutomu Nagata , Hideyuki Kanno , Noriyasu Haginoya , Kenji Yoshikawa , Masatoshi Nagamochi , Syozo Kobayashi , Makoto Ono
发明人： Toshiharu OHTA , Satoshi Komoriya , Toshiharu Yoshino , Kouichi Outo , Yumi Nakamoto , Hiroyuki Naito , Akiyoshi Mochizuki , Tsutomu Nagata , Hideyuki Kanno , Noriyasu Haginoya , Kenji Yoshikawa , Masatoshi Nagamochi , Syozo Kobayashi , Makoto Ono
IPC分类号： A61K31/397 , A61K31/437 , A61K31/502 , A61K31/5377 , A61K31/55
CPC分类号： C07D498/04 , C07D213/75 , C07D401/12 , C07D401/14 , C07D409/04 , C07D409/12 , C07D413/12 , C07D413/14 , C07D417/14 , C07D471/04 , C07D487/04 , C07D513/14 , C07D519/00
摘要： Drug compositions containing a substituted diamine compound represented by formula (1): Q1-Q2-r-N(R1)-Q3-N(R2) (1) wherein Q3 represents the following group wherein Q5 represents an alkylene group having 4 carbon atoms, R3 represents a hydrogen atom, and R4 represents a 3-6 membered heterocyclic group which may be substituted; are useful for preventing and/or treating cerebral infarction, cerebral embolism, myocardial infarction, angina pectoris, pulmonary infarction, pulmonary embolism, Buerger's disease, deep venous thrombosis, disseminated intravascular coagulation syndrome, thrombus formation after artificial valve or joint replacement, thrombus formation and reocclusion after angioplasty, systemic inflammatory response syndrome (SIRS), multiple organ dysfunction syndrome (MODS), thrombus formation during extracorporeal circulation, or blood clotting upon blood drawing.
摘要翻译： 含有式（1）表示的取代二胺化合物的药物组合物：Q1-Q2-rN（R1）-Q3-N（R2）（1）其中Q3表示以下基团，其中Q5表示具有4个碳原子的亚烷基，R3 表示氢原子，R4表示可以被取代的3-6元杂环基; 可用于预防和/或治疗脑梗死，脑栓塞，心肌梗死，心绞痛，肺梗塞，肺栓塞，Buerger病，深静脉血栓形成，弥散性血管内凝血综合征，人工瓣膜或关节置换后血栓形成，血栓形成和 血管成形术后再闭塞，全身炎症反应综合征（SIRS），多器官功能障碍综合征（MODS），体外循环期间的血栓形成或血液抽血时的凝血。
-
57.发明申请SEMICONDUCTOR DEVICE BONDING APPARATUS AND METHOD FOR BONDING SEMICONDUCTOR DEVICE USING THE SAME 失效半导体器件接合装置和使用其结合半导体器件的方法公开(公告)号：US20090020586A1
公开(公告)日：2009-01-22
申请号：US11815623
申请日：2006-06-07
申请人： Hiroyuki Naito , Satoshi Shida , Yasuharu Ueno , Makoto Morikawa
发明人： Hiroyuki Naito , Satoshi Shida , Yasuharu Ueno , Makoto Morikawa
CPC分类号： B23K20/10 , H01L21/67138 , H01L21/67144 , H01L24/75 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/75 , H01L2224/75301 , H01L2224/81205 , H01L2224/81801 , H01L2924/00014 , H01L2924/01025 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/09701 , H01L2924/15787 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： The semiconductor device bonding apparatus 1 of the present invention includes: a pressing member 15 that presses the semiconductor device 10 toward the substrate 11 side in a state where a bump 14 is provided between the semiconductor device 10 and the substrate 11; an ultrasonic vibration applying member 16 that vibrates the semiconductor device 10 and the substrate 11 relatively by applying an ultrasonic vibration to at least one of the semiconductor device 10 and the substrate 11; a time measuring member 17 that measures a required time period from a time when starting to apply the ultrasonic vibration to a time when the semiconductor device 10 is pressed a predetermined distance; and a controlling member 18 that controls an output of an ultrasonic vibration during subsequent bonding, based on the time period measured by the time measuring member 17.
摘要翻译： 本发明的半导体器件接合装置1包括：在半导体器件10和基板11之间设置凸点14的状态下将半导体器件10向基板11侧按压的按压部件15; 通过对半导体装置10和基板11中的至少一个施加超声波振动来使半导体装置10和基板11相对振动的超声波振动施加部件16; 时间测量部件17，其测量从开始施加超声波振动的时刻到半导体器件10被按压预定距离的时间所需的时间段; 以及控制构件18，其基于由时间测量构件17测量的时间段来控制后续接合期间的超声波振动的输出。
-
公开(公告)号：USD580889S1
公开(公告)日：2008-11-18
申请号：US29283240
申请日：2007-08-08
申请人： Takaari Uemoto , Keiji Nishimoto , Satoshi Shida , Hiroyuki Naito
设计人： Takaari Uemoto , Keiji Nishimoto , Satoshi Shida , Hiroyuki Naito
-
公开(公告)号：USD576970S1
公开(公告)日：2008-09-16
申请号：US29317275
申请日：2008-04-25
申请人： Takaari Uemoto , Keiji Nishimoto , Satoshi Shida , Hiroyuki Naito
设计人： Takaari Uemoto , Keiji Nishimoto , Satoshi Shida , Hiroyuki Naito
-
公开(公告)号：USD573553S1
公开(公告)日：2008-07-22
申请号：US29283235
申请日：2007-08-08
申请人： Takaari Uemoto , Keiji Nishimoto , Satoshi Shida , Hiroyuki Naito
设计人： Takaari Uemoto , Keiji Nishimoto , Satoshi Shida , Hiroyuki Naito
-
-
-
-
-
-
-
-
-
搜索结果
94 条记录 (耗时 0.052 秒)
