CURABLE ADHESIVE COMPOSITIONS AND USE THEREOF

    公开(公告)号:US20210002418A1

    公开(公告)日:2021-01-07

    申请号:US17023921

    申请日:2020-09-17

    摘要: A solvent-less hybrid curable composition is prepared from grafting polyesters or polyamides onto a (meth)acrylic copolymer backbone. Besides the many benefits of a solvent-less system, the hybrid curable composition forms strong adhesion to polar substrates, widens the use temperatures, and enables faster processing speeds than conventional hybrid curable compositions. The solvent-less hybrid curable composition forms an optically clear single phase that is suitable as tapes and labels, or in electronic, optoelectronic, OLED and photovoltaic devices, and the like.