摘要:
A semiconductor device comprises a MOS transistor and a resistor. The resistor has a P-type resistor formed from a P-type semiconductor, an N-type resistor formed from an N-type semiconductor and disposed adjacent the P-type resistor, and an insulating film disposed between the P-type and N-type resistors. The P-type resistor is arranged at the low potential side of the semiconductor device and the N-type resistor is arranged at the high potential side thereof. A portion of the insulating film between the P-type and N-type resistors is made electrically conductive by irradiating the portion with a laser beam to destroy the insulating property thereof to thereby achieve conductivity between the P-type and N-type resistors. A gate electrode of the MOS transistor is formed of a P-type polysilicon thin film having the same high concentration impurity as that of the region where the P-type resistor is in contact with a metal wiring, thereby enhancing the current driving capacity of a driver MOS.
摘要:
There are provided a vertical MOS transistor in which a high frequency characteristic is improved by reducing a feedback capacitance, and a method of manufacturing the same. When a gate voltage is applied to a gate electrode, a channel is formed in a p− epitaxial growth layer along a trench, and an electron current flows from an n+ drain layer to the p− epitaxial growth layer. In this case, an overlapping area between a gate and the drain layer through a gate oxide film is smaller than prior art, and the capacitance between the gate and the drain layer is smaller than the prior art. Thus, the feedback capacitance becomes small and the high frequency characteristic is improved. Further, since a portion of the gate oxide film at the bottom of the trench is thicker than the portion at the side wall, the distance between the gate and the n+ semiconductor substrate becomes larger than the prior art, and the capacitance formed between the gate and the n+ semiconductor substrate is smaller than the prior art. Thus, the high frequency characteristic is improved as compared with the prior art.
摘要:
There is provided a manufacturing method for obtaining an MOS transistor which has a homopolar gate structure and a high-melting metallic silicide structure and is suitable even for high speed operation, while at the same time having a structure in which a sufficient withstand voltage can be attained by forming, by a simple method, low concentration drain regions with a long distance. A source and a drain, which have a low concentration, are formed and a thick insulating film and positive resist is formed (applied) on a gate electrode. Then, the positive resist is exposed at an amount of exposure suitable to expose a portion corresponding to a film thickness of the positive resist formed on a flat portion of the thick insulating film as a base and developed. The thick insulating film is etched by an amount substantially corresponding to a film thickness thereof by anisotropic etching using as a mask those portions of the positive resist partially remaining in a step portion. An impurity having a high concentration is simultaneously introduced into the source, the drain, and the gate electrode using a remaining portion of the thick insulating film as a mask. After that, high-melting metallic silicide is formed on exposed portions of the gate electrode and the source and drain regions of the MOS transistor, respectively.
摘要:
It is an object to provide a highly precise bleeder resistance circuit having an accurate voltage division ratio and a small temperature coefficient of the resistance value and a highly precise semiconductor device having a small temperature coefficient using such a bleeder resistance circuit, e.g., a semiconductor device such as a voltage detector and a voltage regulator. Such characteristic features that the potential of electric conductors on the thin film resistors and electric conductors under the thin film resistors of a bleeder resistance circuit using thin film resistors is made almost equal to the potential of respective thin film resistors and that, when polysilicon is used in the thin film resistor, the dispersion of the resistance value is controlled and the temperature dependency of the resistance value is made lower by thinning the film thickness of the polysilicon thin film resistor are constituted.
摘要:
A semiconductor device comprises a depletion-type NMOS transistor having a source region, a drain region connected to a power supply line, and a gate electrode connected to a ground line. An enhancement-type NMOS transistor has a source connected to the ground line, a drain connected in series with the source of the depletion-type MOS transistor between the power supply line and the ground line to define an output terminal, and a gate electrode connected directly to the output terminal.
摘要:
A method of fabricating a semiconductor device an object of which is to form a semiconductor device having a DMOS with high withstanding pressure and high driving capacity and a highly precise polycrystalline silicon resistor. In the method of fabricating a semiconductor device, by patterning a second polycrystalline silicon resistor using anisotropic etching, the size precision is improved. Further, during the patterning, side spacers are formed on gate electrode side walls formed of first polycrystalline silicon at the same time. The body of the DMOS is doped with the gate electrode and the spacers being the mask. A source region is doped with the gate electrode being the mask after the spacers are removed.
摘要:
A semiconductor integrated circuit device comprises an input terminal for inputting a voltage, an output terminal for outputting a voltage, a MOS driver disposed between the input terminal and the output terminal for adjusting the voltage of the input terminal and transmitting it to the output terminal, and a MOS control circuit for controlling the MOS driver and feeding back voltage information of the output terminal. Each of the MOS driver and the MOS control circuit has a MOS transistor formed on a semiconductor substrate, and each MOS transistor has a source region, a drain region, a channel region disposed between the source region and the drain region, a gate insulating film disposed over the channel region, and a gate electrode disposed over the gate insulating film. The gate insulating films of the MOS transistors have different film thicknesses.
摘要:
A semiconductor integrated device having a current regulating diode may be substantially reduced in size and improved in performance by forming the current regulating diode of a plurality of MOS transistors each having a gate, a drain region, and a source region formed in a semiconductor substrate, the source regions and the substrate regions being electrically coupled to each other, the drain regions of at least two of the MOS transistors being electrically coupled, and the source regions of each of the MOS transistors being electrically coupled, the coupled drain regions, the coupled source regions, and the coupled gates forming a drain terminal, a source terminal and a gate terminal, respectively. In order to set a desired regulated current, selected coupling lines in the current regulating diode may be cut. This may be accomplished, for example, by measuring a first current which flows in the drain terminal while applying a first voltage to the gate terminal and a second voltage to the drain terminal relative to an electric potential of the source terminal, then measuring a second current which flows in the drain terminal while applying a third voltage to the gate terminal and the second voltage to the drain terminal relative to an electric potential of the source terminal. In order to achieve the desired current characteristic, selected conductive lines between coupled drains or between coupled sources are then cut.
摘要:
Deviation occurring in a particular region in a plane of a resistor group which constitutes a semiconductor integrated circuit is improved and a quick increase in yield is accomplished. Provided is a fuse trimming method for a semiconductor device in which circuit elements such as transistors and resistors are formed on a semiconductor wafer and which has fuse elements capable of adjusting a resistance value of the resistors by laser trimming, including a resistor correction step of correcting in the particular region of the semiconductor wafer the resistance value of the resistors based on an amount of deviation from a target value of the resistance value of the resistors.
摘要:
Provided is a semiconductor device including a depletion type MOS transistor and an enhancement type MOS transistor. In the semiconductor device, in order to provide a reference voltage generating circuit having an enhanced temperature characteristic or analog characteristic without increasing an area of the semiconductor device through addition of a circuit, well regions of the depletion type MOS transistor and the enhancement type MOS transistor, which have different concentrations from each other, are formed.