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公开(公告)号:US07451466B2
公开(公告)日:2008-11-11
申请号:US11309868
申请日:2006-10-16
申请人: Chih-Hang Chao , Yu-Hsu Lin , Jeng-Da Wu
发明人: Chih-Hang Chao , Yu-Hsu Lin , Jeng-Da Wu
IPC分类号: G11B7/085
CPC分类号: G11B7/08582
摘要: An exemplary optical disc drive apparatus includes a guide shaft configured to movably support a pickup head, and an elastically deformable member. The elastically deformable member includes a main body, and a cantilever slanting up from a middle part of a front edge of the main body. The cantilever is broad at a lower portion thereof and narrow at an upper portion thereof, and the cantilever is for resiliently pressing a corresponding end of the guide shaft. The elastically deformable member reduces a stress surface between the cantilever and the guide shaft, and lengthens the life span thereof.
摘要翻译: 一种示例性的光盘驱动装置,包括构造成可移动地支撑拾取头的引导轴和可弹性变形的构件。 弹性变形构件包括主体,并且悬臂从主体的前边缘的中间部分倾斜。 悬臂在其下部较宽,在其上部较窄,并且悬臂用于弹性地按压导向轴的相应端。 可弹性变形的构件减小了悬臂与引导轴之间的应力表面,延长了其使用寿命。
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公开(公告)号:US20080089032A1
公开(公告)日:2008-04-17
申请号:US11309887
申请日:2006-10-17
申请人: Chih-Hang Chao , Yu-Hsu Lin , Jeng-Da Wu
发明人: Chih-Hang Chao , Yu-Hsu Lin , Jeng-Da Wu
IPC分类号: H05K7/20
CPC分类号: H05K1/181 , H05K1/0203 , H05K2201/09418 , H05K2201/10522 , H05K2201/10598 , H05K2201/10734 , Y02P70/611
摘要: A motherboard includes a circuit board, a first chip and a second chip disposed on the circuit board. Four securing holes are defined in the circuit board around the first chip, for mounting a heat dissipating module on the first chip. Two of the securing holes determine a first line, and the other two securing holes determine a second line parallel to the first line. A center of the second chip is located along a centerline between the first and second lines. Should the circuit board suffer from an impact, damage to the chips may be effectively minimized or prevented.
摘要翻译: 主板包括电路板,第一芯片和设置在电路板上的第二芯片。 在第一芯片周围的电路板中定义了四个固定孔,用于将散热模块安装在第一芯片上。 两个固定孔确定第一条线,另外两个固定孔确定与第一条线平行的第二条线。 第二芯片的中心位于第一和第二线之间的中心线处。 如果电路板受到冲击,可以有效地最小化或防止对芯片的损坏。
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公开(公告)号:US20070017696A1
公开(公告)日:2007-01-25
申请号:US11488490
申请日:2006-07-18
申请人: Yu-Hsu Lin , Shang-Tsang Yeh , Chao-Chen Huang , Chuan-Bing Li
发明人: Yu-Hsu Lin , Shang-Tsang Yeh , Chao-Chen Huang , Chuan-Bing Li
IPC分类号: H05K1/11
CPC分类号: H05K1/115 , H05K1/0265 , H05K2201/093 , H05K2201/0979
摘要: A multi-layer printed circuit board (PCB) is provided allowing balanced power supply to components requiring large working current. The PCB includes a plurality of layers disposed thereon. A first power area, and a second power area are separately arranged on different layers. The first power area and the second power area vertically aligned within the PCB with generally identical shapes cooperatively provide power to components requiring large working current.
摘要翻译: 提供了一个多层印刷电路板(PCB),可以对需要较大工作电流的组件进行平衡供电。 PCB包括设置在其上的多个层。 第一功率区域和第二功率区域分别布置在不同的层上。 在PCB内垂直对准的第一功率区和第二功率区具有大致相同的形状,协同地为需要大的工作电流的组件提供功率。
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公开(公告)号:US20060266549A1
公开(公告)日:2006-11-30
申请号:US11389960
申请日:2006-03-27
申请人: Yu-Hsu Lin , Shang-Tsang Yeh , Chuan-Bing Li
发明人: Yu-Hsu Lin , Shang-Tsang Yeh , Chuan-Bing Li
IPC分类号: H05K7/06
CPC分类号: H05K1/115 , H05K1/0216 , H05K1/0245 , H05K1/0251 , H05K2201/09236 , Y10T29/49155
摘要: A printed circuit board (PCB) with crosstalk reduction arrangement of differential vias includes a plurality of groups of differential vias, a plurality of signal lines corresponding to the differential vias, and a plurality of layers electrically connected with each other by the differential vias and signal lines. Each group of differential vias comprises a first pair of differential vias and a second pair of differential vias. Straight lines from a center of one of the first pair of vias to a center of another of the first pair of vias and from a center of one of the second pair of differential vias to a center of another of the second pair of differential vias are mutually perpendicularly bisecting.
摘要翻译: 具有差分通路的串扰减小布置的印刷电路板(PCB)包括多组差分通孔,对应于差分通孔的多条信号线,以及通过差分通路和信号彼此电连接的多个层 线条。 每组差分通孔包括第一对差动通孔和第二对差动通孔。 从第一对通孔之一的中心到第一对通孔中的另一个的中心的直线和从第二对差动通路中的一个到第二对差动通路中另一个的中心的直线是 相互垂直平分。
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公开(公告)号:US20060200689A1
公开(公告)日:2006-09-07
申请号:US11367885
申请日:2006-03-03
申请人: Yu-Hsu Lin , Shou-Kuo Hsu , Ting-Kai Wang , Chun-Hao Chang
发明人: Yu-Hsu Lin , Shou-Kuo Hsu , Ting-Kai Wang , Chun-Hao Chang
IPC分类号: G06F1/26
CPC分类号: H04L25/0264 , H05K1/0231 , H05K1/0262 , H05K2201/044
摘要: A signal transmitting circuit includes a driving circuit, and a plurality of receiving circuits receiving signals transmitted from the driving circuit. Each of the receiving circuits is coupled to the driving circuit consecutively via a transmission line. A voltage regulator is coupled to the driving circuit and the receiving circuits and provides power to the driving circuit and the receiving circuits. A number of capacitors are coupled between the voltage regulator and the ground for filtering the noise of the power output from the voltage regulator. The capacitors between the voltage regulator and the north bridge chipset filtering the noise of the power output from the voltage regulator maintain signal integrity as the terminal resistor does. It is of advantage that the signal transmitting circuit is simple to manufacture and very suitable for mass production.
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