摘要:
Non-volatile memory devices include memory cells therein with reduced cell-to-cell coupling capacitance. These memory cells include floating gate electrodes with open-ended wraparound shapes that operate to reduce the cell-to-cell coupling capacitance in a bit line direction, while still maintaining a high coupling ratio between control and floating gate electrodes within each memory cell.
摘要:
A method for fabricating a nonvolatile memory device comprises providing a substrate, forming an insulating layer and a conductive layer on the substrate, forming an electrical connection path out of a portion of the conductive layer, through which the conductive layer is electrically connected to the substrate, and gate patterning the insulating layer and the conductive layer.
摘要:
A nonvolatile semiconductor memory device including a vertical array structure comprised of bit lines and source lines arranged in the same direction as the bit lines, each source lines corresponding to the bit lines and memory cell strings vertically formed between each pair of the bit lines and source lines. Multiple strings of memory cells can be stacked in the vertical direction, and adjacent memory cell strings may share bit line or source line.
摘要:
An integrated circuit includes a NAND string including a string selection transistor SST and a ground selection transistor GST disposed at either end of series-connected memory storage cells MC. Each of the memory storage cells is a memory transistor having a floating gate, and at least one of the string selection transistor SST and the ground selection transistor GST is a memory transistor having a floating gate. The threshold voltage Vth of programmable string selection transistors SST and the ground selection transistor GST is variable and user controllable and need not be established by implantation during manufacture. Each of the programmable string selection transistors SST and the ground selection transistors GST in a memory block may be used to store random data, thus increasing the memory storage capacity of the flash memory device.
摘要:
A semiconductor device includes a plurality of transistors disposed on a semiconductor substrate, a device isolation layer disposed around the transistors, a guard ring disposed to surround the device isolation layer and the transistors, and a guard region disposed between adjacent transistors.
摘要:
The present invention provides a semiconductor device in which the gate is self-aligned to the device isolation film and a fabricating method thereof. A device isolation film restricting an active region is disposed on a portion of a semiconductor substrate, and a word line is across over the device isolation film. A gate pattern is disposed between the word line and the active region, and a tunnel oxide film is disposed between the gate pattern and the active region. The gate pattern comprises a floating gate pattern, a gate interlayer dielectric film pattern and a control gate electrode pattern deposited in the respective order, and has a sidewall self-aligned to the device isolation film. To form the gate pattern having the sidewall self-aligned to the device isolation film, a gate insulation film and a gate material film are formed in the respective order on the semiconductor substrate.
摘要:
A semiconductor memory device can include select transistors and cell transistors on a semiconductor substrate. An insulation layer covers the select transistors and the cell transistors. The bit lines are in the insulation layer and are electrically connected to respective ones of the select transistors. The bit lines are arranged along at least two different parallel planes having different heights relative to the semiconductor substrate.
摘要:
Embodiments of the invention provide a semiconductor device and a related method of fabricating a semiconductor device. In one embodiment, the invention provides a semiconductor device comprising a first gate electrode comprising a lower silicon pattern and an upper silicon pattern and disposed on an active region of a semiconductor substrate, wherein the upper silicon pattern has the same crystal structure as the lower silicon pattern and the active region is defined by a device isolation layer. The semiconductor device further comprises a gate insulating layer disposed between the active region and the first gate electrode.
摘要:
The present invention provides a semiconductor device in which the gate is self-aligned to the device isolation film and a fabricating method thereof. A device isolation film restricting an active region is disposed on a portion of a semiconductor substrate, and a word line is across over the device isolation film. A gate pattern is disposed between the word line and the active region, and a tunnel oxide film is disposed between the gate pattern and the active region. The gate pattern comprises a floating gate pattern, a gate interlayer dielectric film pattern and a control gate electrode pattern deposited in the respective order, and has a sidewall self-aligned to the device isolation film. To form the gate pattern having the sidewall self-aligned to the device isolation film, a gate insulation film and a gate material film are formed in the respective order on the semiconductor substrate.
摘要:
A gate-contact structure and a method for forming the same are provided. The structure includes a device isolation layer pattern formed at a semiconductor substrate to define an active region; and a gate electrode and a capping pattern, which are sequentially stacked on the semiconductor substrate across the device isolation layer pattern. The capping pattern includes a first gate contact hole that exposes a top surface of the gate electrode. An interlayer insulation layer pattern including a second gate contact hole is disposed to cover an entire surface of the semiconductor substrate including the gate electrode and the capping pattern. The second gate contact hole penetrates the first gate contact hole to expose the top surface of the gate electrode. A gate contact plug is disposed to be connected to the top surface of the gate electrode through the second gate contact hole. Accordingly, the interlayer insulation layer pattern is intervened between the gate contact plug and a sidewall of the capping pattern.