Substrate, manufacturing method of substrate and saw device
    51.
    发明授权
    Substrate, manufacturing method of substrate and saw device 有权
    基板,基板和锯片的制造方法

    公开(公告)号:US08614535B2

    公开(公告)日:2013-12-24

    申请号:US13275710

    申请日:2011-10-18

    Abstract: A substrate having appropriate strength and allowing firm bonding to a piezoelectric substrate and the like can be obtained at a lower cost. The substrate for an SAW device is formed of spinel, and PV value representing difference in level of one main surface of the substrate is at least 2 nm and at most 8 nm. Preferably, average roughness Ra of one main surface of the substrate is at least 0.01 nm and at most 0.5 nm. With such characteristics, the main surface of the substrate to be bonded to a piezoelectric substrate of the SAW device can be bonded satisfactorily to the piezoelectric material forming the piezoelectric substrate utilizing van der Waals interaction.

    Abstract translation: 可以以更低的成本获得具有适当强度并且能够牢固地粘合到压电基板等的基板。 用于SAW器件的衬底由尖晶石形成,并且表示衬底的一个主表面的电平差的PV值为至少2nm且至多8nm。 优选地,基板的一个主表面的平均粗糙度Ra为0.01nm以上且0.5nm以下。 通过这样的特性,可以使用范德华相互作用,使与SAW器件的压电基板接合的基板的主表面令人满意地粘结到形成压电基板的压电材料上。

    OXIDE SINTERED BODY AND SPUTTERING TARGET
    52.
    发明申请
    OXIDE SINTERED BODY AND SPUTTERING TARGET 审中-公开
    氧化物烧结体和溅射目标

    公开(公告)号:US20130334039A1

    公开(公告)日:2013-12-19

    申请号:US14002491

    申请日:2012-03-01

    Abstract: Provided are an oxide sintered body and a sputtering target which are suitable for use in producing an oxide semiconductor film for display devices and combine high electroconductivity with a high relative density and with which it is possible to form an oxide semiconductor film having a high carrier mobility. In particular, even when used in production by a direct-current sputtering method, the oxide sintered body and the sputtering target are less apt to generate nodules and have excellent direct-current discharge stability which renders long-term stable discharge possible. This oxide sintered body is an oxide sintered body obtained by mixing zinc oxide, tin oxide, and an oxide of at least one metal (M metal) selected from the group consisting of Al, Hf, Ni, Si, Ga, In, and Ta, and sintering the mixture, the oxide sintered body having a Vickers hardness of 400 Hv or higher.

    Abstract translation: 本发明提供一种氧化物烧结体和溅射靶,其适用于制造显示装置用氧化物半导体膜,并且具有高相对密度的高导电性,并且可以形成具有高载流子迁移率的氧化物半导体膜 。 特别是,即使在通过直流溅射法生产中使用时,氧化物烧结体和溅射靶也不易产生结节,并且具有优异的直流放电稳定性,这使得长期稳定的放电成为可能。 该氧化物烧结体是通过将氧化锌,氧化锡和选自Al,Hf,Ni,Si,Ga,In和Ta中的至少一种金属(M金属)的氧化物混合而获得的氧化物烧结体 ,并烧结混合物,维氏硬度为400Hv以上的氧化物烧结体。

    Electrostatic chuck and method for producing the same
    58.
    发明授权
    Electrostatic chuck and method for producing the same 有权
    静电吸盘及其制造方法

    公开(公告)号:US08498093B2

    公开(公告)日:2013-07-30

    申请号:US12877349

    申请日:2010-09-08

    Applicant: Masao Nishioka

    Inventor: Masao Nishioka

    Abstract: An electrostatic chuck includes an electrostatic electrode embedded in a ceramic base having a wafer-supporting surface capable of holding a wafer, the electrostatic electrode being parallel to the wafer-supporting surface. The ceramic base is composed of a dense ceramic having a MgO content of 99% by weight or more. The electrostatic electrode is a disc-like electrode composed of, for example, at least one metal selected from the group consisting of Ni, Co, and Fe. The electrostatic electrode includes a conductive tablet connected to the center thereof. The tablet is exposed at the bottom of a counter-bored hole formed so as to reach the tablet from a back surface of the ceramic base, and is connected to a feeding terminal, composed of Ni, inserted into the counter-bored hole.

    Abstract translation: 静电卡盘包括嵌入在具有能够保持晶片的晶片支撑表面的陶瓷基体中的静电电极,静电电极平行于晶片支撑表面。 陶瓷基体由MgO含量为99重量%以上的致密陶瓷构成。 静电电极是由例如由Ni,Co,Fe组成的组中的至少一种金属构成的盘状电极。 静电电极包括连接到其中心的导电片。 片剂暴露在形成为从陶瓷基底的后表面到达片剂的反钻孔的底部,并且连接到插入到钻孔中的由Ni构成的馈电端子。

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