Abstract:
An electronic component includes a spiral or substantially spiral first inductor extending along a stacking direction while turning around a ring-shaped or substantially ring-shaped path. The first inductor includes first inductor conductors and a first interlayer connecting conductor connected to each other. The first interlayer connecting conductor passes through some insulating layers. A second interlayer connecting conductor passes through some insulating layers, and is connected in series and is located within the ring-shaped path. A first capacitor conductor is disposed closer to one side of the stacking direction than the first inductor is. The first capacitor conductor is at least partially superposed on the ring-shaped path to define a first capacitor between the first capacitor conductor and the first inductor, and is superposed on a portion of a region surrounded by the ring-shaped path to be connected to the second interlayer connecting conductor.
Abstract:
A composite electronic component includes a composite body including a common mode filter and a resistor that are coupled to each other, the common mode filter including a common mode choke coil; and a plurality of input terminals disposed on a first side surface of the composite body, a plurality of output terminals, and a ground terminal.
Abstract:
A high frequency module includes a multilayer substrate, a power amplifier, thermal vias, and a bandpass filter. The power amplifier is mounted on the multilayer substrate. The thermal vias are provided in the multilayer substrate directly below the power amplifier and configured to dissipate heat of the power amplifier. The bandpass filter is provided in the multilayer substrate and connected to the power amplifier. The thermal via defines an inductor included in the bandpass filter. The bandpass filter overlaps the power amplifier when viewed in a lamination direction of the multilayer substrate.
Abstract:
Circuit arrangement embodiments that use relative groupings of energy pathways that include shielding circuit arrangements that can sustain and condition electrically complementary energy confluences.
Abstract:
A duplexer is proposed with a substrate which has at least one patterned metallization plane and on which, at least to some extent, a transmission path (TX) and a reception path (RX) are arranged, both of which are connected to an antenna connection (ANT). The duplexer comprises a transmission filter (TXF) which is arranged in the transmission path (TX) and which has a first acoustic wave filter (BAW1) with one or more resonators. Furthermore, the duplexer (DPL) comprises a reception filter (RXF) which is arranged in the reception path (RX) on the antenna side and which has a second acoustic wave filter (BAW2) with one or more resonators and also a single-ended output. In addition, the duplexer comprises, in the reception path (RX), a balun (BL) which is connected downstream of the reception filter (RXF) and the output of which delivers a balanced signal and which is in the form of an LC circuit, wherein at least one inductance and/or at least one capacitance of the balun (BL) are implemented in the patterned metallization plane of the substrate.
Abstract:
A common mode filter and a method of manufacturing the same are disclosed. The common mode filter in accordance with an aspect of the present invention includes: a substrate; a filter layer comprising a coil and an insulation layer and formed on the substrate to remove a signal noise; a magnetic compound layer laminated on the filter layer; an electrostatic electrode pattern formed on the magnetic compound layer to remove static electricity and having one portion thereof exposed to a lateral surface of the magnetic compound layer; a sealing layer laminated on the electrostatic electrode pattern so as to seal the electrostatic electrode pattern; and a lateral surface electrode connected with the exposed portion of the electrostatic electrode pattern and formed in a longitudinal direction between the sealing layer and the substrate.
Abstract:
An electronic device comprising a laminate constituted by pluralities of insulation layers on which conductor patterns are formed; ground electrodes being formed on an upper-surface-side insulation layer and a bottom-surface-side insulation layer in the laminate; the laminate being partitioned to first and second regions by a first shield constituted by a line of via-holes electrically connecting the upper-surface-side ground electrode to the bottom-surface-side ground electrode; conductor patterns constituting a first filter for a first frequency band and conductor patterns constituting a first balun for the first frequency band being arranged in the first and second regions, respectively; pluralities of terminal electrodes being formed on bottom or side surfaces of the laminate; one of terminal electrodes of the first filter, which acts as an unbalanced port, being adjacent to a terminal electrode of the first balun, which acts as an unbalanced port, with no other terminal electrode than a ground electrode existing therebetween; and the first filter and the first balun being not electrically connected.
Abstract:
A ceramic multilayer component includes a ceramic body including a plurality of ceramic layers stacked on top of one another, internal electrodes located inside the ceramic multilayer body, terminal electrodes located on a mounting surface of the ceramic multilayer body, and via hole conductors that are arranged inside the ceramic multilayer body so as to connect the internal electrodes and the terminal electrodes to each other. An insulating portion is arranged to extend as a single body across a surface of the ceramic multilayer body and across the terminal electrodes. The insulating portion covers at least a portion of each of the via conductors and covers a portion of each of the terminal electrodes when viewed from the mounting surface side.
Abstract:
A ceramic multilayer component has a base body with connecting contacts, fitted to it, with a ferrite ceramic, which is provided for an inductive area and in which an inductance is arranged which is formed by electrical conductors, and with a varistor ceramic, wherein the varistor ceramic comprises at most 40% of the volume of the base body.
Abstract:
A composite electronic component includes a composite body containing a capacitor and an inductor coupled to each other, the capacitor including a ceramic body having a plurality of dielectric layers and first and second internal electrodes, and the inductor including a magnetic body including a coil part, an input terminal disposed on a first end surface of the composite body and connected to the coil part, an output terminal including first output terminals disposed on a second end surface of the composite body and connected to the coil part and a second output terminal disposed on a second side surface of the composite body and connected to the first internal electrodes, and a ground terminal disposed on a first side surface of the composite body. The capacitor and the inductor are coupled in a vertical direction, and a magnetic metal layer is provided between the inductor and the capacitor.