Abstract:
An imaging array device and staring array imaging system are described for generating signals in response to an image from a distant scene. The device comprises a plurality of discrete arrays (11) of photo-sensing elements (10), for example cadmium mercury telluride infrared detector elements. The discrete arrays (11) are arranged side-by-side to provide a large composite array. A corresponding plurality of lenses (110), preferably formed in a common body, is arranged side-by-side to provide a substantially continuous optical transmission plane which is located in front of the arrangement of discrete arrays (11) and through which the image from the scene is transmitted to the composite array of the elements (10). In the composite virtual image (FIG. 3) of the composite array as seen from in front of the arrangement of lenses (110), the center-to-center spacing D' of the elements (10a') facing each other from neighboring discrete arrays (11) appears to be approximately equal to the magnified center-to-center spacing d' of the elements (10') in these discrete arrays (11). By making various adjustments in the fabrication and arrangement of the lenses (110), the discrete arrays (11) and their elements (10), it is possible to compensate for various image distortions and other problems which can arise in such imaging systems. Other image transfer means may be used instead of lenses (110), for example wedge-shaped plates (FIG. 8) and arrays of optical fibres (FIG. 9).
Abstract:
In a method of driving an image sensor comprised of a plurality of image sensor chips to sequentially deliver image outputs from the image sensor chips, start signals are initially applied to all of the image sensor chips at the beginning of the drive timing, a shift clock is applied to only each one of the plurality of image sensor chips which is so selected as to deliver an image output, and image outputs are picked up from the individual image sensor chips by sequentially applying shift clocks to selected image sensor chips so as to provide a continuous sensor output signal, whereby no noise is superimposed on the sensor output signal and the quality of images in the image reader, facsimile equipment, OCR equipment and the like can be improved.
Abstract:
A stitched image sensor array on a semiconductor substrate with identical blocks that have wherein said first configuration includes enable inputs, which vary a function of the block depending on the connection to the enable inputs. The enable inputs can set an SRAM to receive different numbers of inputs.
Abstract:
Systems and methods for controlling the parameters of groups of focal planes as focal plane groups in an array camera are described. One embodiment includes a plurality of focal planes, and control circuitry configured to control the capture of image data by the pixels within the focal planes. In addition, the control circuitry includes: a plurality of parameter registers, where a given parameter register is associated with one of the focal planes and contains configuration data for the associated focal plane; and a focal plane group register that contains data identifying focal planes that belong to a focal plane group. Furthermore, the control circuitry is configured to control the imaging parameters of the focal planes in the focal plane groups by mapping instructions that address virtual register addresses to the addresses of the parameter registers associated with focal planes within specific focal plane groups.
Abstract:
A camera array, an imaging device and/or a method for capturing image that employ a plurality of imagers fabricated on a substrate is provided. Each imager includes a plurality of pixels. The plurality of imagers include a first imager having a first imaging characteristics and a second imager having a second imaging characteristics. The images generated by the plurality of imagers are processed to obtain an enhanced image compared to images captured by the imagers. Each imager may be associated with an optical element fabricated using a wafer level optics (WLO) technology.
Abstract:
An image fusing method, apparatus and system for fusing images from an array of cameras, method includes selecting a camera from the array of cameras as a reference camera, estimating misalignment between the retrieved input images from the reference camera and the retrieved input images from the other cameras, estimating misalignment parameters between the reference camera and the other cameras, estimating local disparity between the reference camera image data and the other cameras based on the estimated misalignment parameters, using the estimated misalignment parameters and the estimated disparity values, mapping the image data into a reference camera grid, the retrieved input image data from the other cameras in the array of cameras is fused in the reference camera grid utilizing fractional offsets from integer coordinates, and producing an output image grid on the reference camera grid and interpolate output pixels using processed data for producing a high resolution image.
Abstract:
A camera array, an imaging device and/or a method for capturing image that employ a plurality of imagers fabricated on a substrate is provided. Each imager includes a plurality of pixels. The plurality of imagers include a first imager having a first imaging characteristics and a second imager having a second imaging characteristics. The images generated by the plurality of imagers are processed to obtain an enhanced image compared to images captured by the imagers. Each imager may be associated with an optical element fabricated using a wafer level optics (WLO) technology.
Abstract:
A camera array, an imaging device and/or a method for capturing image that employ a plurality of imagers fabricated on a substrate is provided. Each imager includes a plurality of pixels. The plurality of imagers include a first imager having a first imaging characteristics and a second imager having a second imaging characteristics. The images generated by the plurality of imagers are processed to obtain an enhanced image compared to images captured by the imagers. Each imager may be associated with an optical element fabricated using a wafer level optics (WLO) technology.
Abstract:
A camera array, an imaging device and/or a method for capturing image that employ a plurality of imagers fabricated on a substrate is provided. Each imager includes a plurality of pixels. The plurality of imagers include a first imager having a first imaging characteristics and a second imager having a second imaging characteristics. The images generated by the plurality of imagers are processed to obtain an enhanced image compared to images captured by the imagers. Each imager may be associated with an optical element fabricated using a wafer level optics (WLO) technology.
Abstract:
A camera array, an imaging device and/or a method for capturing image that employ a plurality of imagers fabricated on a substrate is provided. Each imager includes a plurality of pixels. The plurality of imagers include a first imager having a first imaging characteristics and a second imager having a second imaging characteristics. The images generated by the plurality of imagers are processed to obtain an enhanced image compared to images captured by the imagers. Each imager may be associated with an optical element fabricated using a wafer level optics (WLO) technology.