Coalescing packets based on hints generated by network adapter

    公开(公告)号:US12218860B2

    公开(公告)日:2025-02-04

    申请号:US16932765

    申请日:2020-07-19

    Abstract: A network node includes a network adapter and a host. The network adapter is coupled to a communication network. The host includes a processor running a client process and a communication stack, and is configured to receive packets from the communication network, and classify the received packets into respective flows that are associated with respective chunks in a receive buffer, to distribute payloads of the received packets among the chunks so that payloads of packets classified to a given flow are stored in a given chunk assigned to the given flow, and to notify the communication stack of the payloads in the given chunk, for transferring the payloads in the given chunk to the client process.

    Virtual wire protocol for transmitting side band channels

    公开(公告)号:US12216604B2

    公开(公告)日:2025-02-04

    申请号:US17958111

    申请日:2022-09-30

    Abstract: A virtual wire system includes a source device, a target device, and a mesh interface connecting the source device and the target device. One or more mesh messages are transmitted over the mesh interface from the source device to the target device, and the one or more mesh messages indicate a change in a value of a signal level at the source device. The source device may include a plurality of virtual wire sources, a virtual wire encoder, and a virtual wire arbiter operatively coupled to the plurality of virtual wire sources and the virtual wire encoder. The virtual wire arbiter is configured to determine whether information from a virtual wire source should be transmitted to the virtual wire encoder. The virtual wire encoder is configured to receive information from the virtual wire arbiter, combine the information into a single virtual wire message, and transmit the single virtual wire message to a first mesh interface component in the source device.

    DYNAMIC PACKET ROUTING USING PRIORITIZED GROUPS

    公开(公告)号:US20250039078A1

    公开(公告)日:2025-01-30

    申请号:US18917976

    申请日:2024-10-16

    Abstract: An example method for dynamic packet routing using prioritized groups includes: receiving, by a node, a network packet to be forwarded to a network destination, identifying, based on data stored in a forwarding information data structure of the node, a first path satisfying a first cost criterion to the network destination, determining that a path latency of the first path exceeds a threshold latency, selecting, based on the data stored in the forwarding information data structure of the node, a second path to the network destination, wherein the second path satisfies a second cost criterion and does not satisfy the first cost criterion, and forwarding, by the node, the network packet to the network destination via a local interface associated with the second path.

    Fast In-Service Software Updating using Multi-Layer Memory

    公开(公告)号:US20250036391A1

    公开(公告)日:2025-01-30

    申请号:US18911312

    申请日:2024-10-10

    Inventor: Yair Chasdai

    Abstract: A peripheral device includes a bus interface, a first processor and a second processor. The bus interface is to communicate over a peripheral bus. The first processor is to manage communication over the peripheral bus by executing bus-maintenance software code, the bus-maintenance software code being executed from one or more first layers of a multi-layer memory. The second processor is to update the bus-maintenance software code from an existing version to an updated version, by (i) loading the updated version to one or more second layers of the multi-layer memory, higher in hierarchy than the or one more first layers, and (ii) invalidating the existing version in the one or more first layers, thereby forcing fetching of the updated version from the one or more second layers to the one or more first layers and to start executing the updated version.

    CONTINUOUS COMPOSITIONAL GRADING FOR REALIZATION OF LOW CHARGE CARRIER BARRIERS IN ELECTRO-OPTICAL HETEROSTRUCTURE SEMICONDUCTOR DEVICES

    公开(公告)号:US20250035965A1

    公开(公告)日:2025-01-30

    申请号:US18911975

    申请日:2024-10-10

    Abstract: Processes and devices for continuous compositional grading in photodetectors and electro-absorption modulators (EAM) are provided. An example photodetector includes a multi-layered structure comprising a collector region, an absorber region, a grading layer, and a peripheral layer, all aligned along a detection axis. The grading layer, positioned adjacent to the absorber region, includes multiple sub-layers that define a continuous compositional grading to facilitate smooth carrier transport and reduce recombination. Similarly, an example electro-absorption modulator (EAM) device includes a waveguide mesa formed on a semiconductor substrate, comprising a multi-quantum well (MQW) core layer, upper and lower near-core cladding layers, and upper and lower central cladding layers. The EAM device features both upper and lower grading layers, each positioned between the near-core cladding layers and the adjacent central cladding layers. These grading layers include multiple sub-layers that define a continuous compositional grading, facilitating smooth transitions between the MQW core and surrounding cladding layers.

    METHOD AND CONFIGURATION FOR STACKING MULTIPLE PRINTED CIRCUIT BOARDS

    公开(公告)号:US20250024606A1

    公开(公告)日:2025-01-16

    申请号:US18904428

    申请日:2024-10-02

    Abstract: Electronic devices, electronic modules, and methods for manufacturing electronic devices and/or electronic modules are described herein. In some embodiments, the present invention may be directed to an electronic module that includes a pair of printed circuit boards (PCBs) and a capacitor positioned between the PCBs. Each of the PCBs may include a pair of vias configured to provide electrical connections through the PCB, and the capacitor may include a pair of pins. Each pin of the capacitor may be aligned with a via of one of the PCBs and a corresponding via of the other PCB such that each pin is configured to provide electrical connection between the two PCBs. Additionally, the pair of pins may be configured to support the PCBs with respect to each other.

    Clock synchronization monitoring system

    公开(公告)号:US20250021130A1

    公开(公告)日:2025-01-16

    申请号:US18349976

    申请日:2023-07-11

    Abstract: In one embodiment, a system including a reference processing device includes a reference hardware clock to maintain a reference clock value, and reference clock synchronization circuitry to discipline the reference hardware clock responsively to a remote clock, which is remote to the system, and a follower processing device including a follower hardware clock to maintain a follower clock value, and follower clock synchronization circuitry to synchronize the follower hardware clock to the reference hardware clock, and provide an indication about the follower clock value to the reference processing device, wherein the reference clock synchronization circuitry is configured to monitor a quality of the synchronization of the follower hardware clock to the reference hardware clock.

    OPTICAL COUPLER
    630.
    发明申请

    公开(公告)号:US20250012971A1

    公开(公告)日:2025-01-09

    申请号:US18887611

    申请日:2024-09-17

    Abstract: An optical interconnect device and the method of fabricating it are described. The device includes an in-plane laser cavity transmitting a light beam along a first direction, a Franz Keldysh (FK) optical modulator transmitting the light beam along the first direction, a mode-transfer module including a tapered structure disposed after the FK optical modulator along the first direction to enlarge the spot size of the light beam to match an external optical fiber and a universal coupler controlling the light direction. The tapered structure can be made linear or non-linear along the first direction. The universal coupler passes the laser light to an in-plane external optical fiber if the fiber is placed along the first direction, or it is a vertical coupler in the case that the external optical fiber is placed perpendicularly to the substrate surface. The coupler is coated with highly reflective material.

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