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公开(公告)号：US20180371180A1
公开(公告)日：2018-12-27
申请号：US15802445
申请日：2017-11-02
申请人： NATIONAL TSING HUA UNIVERSITY , Chang Chun Plastics Co., Ltd. , Chang Chun Petrochemical Co., LTD.
发明人： Chung-Sung TAN
摘要： A method for purifying polybutylene terephthalate (PBT) includes: providing or receiving initial PBT, in which oligomers and tetrahydrofuran are present; dissolving the initial PBT in hexafluoroisopropanol (HFIP) to form a solution, in which the oligomers are also dissolved in the HFIP; and contacting the solution with compressed CO2 at a temperature and a pressure, thereby precipitating the purified PBT, resulting from a large portion of the oligomers are still dissolved in the HFIP, in the operation the temperature is in a range of 20° C. to 35° C., and the pressure is in a range of 900 psi to 1400 psi. A device for purifying PBT is also provided.
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公开(公告)号：US20180298508A1
公开(公告)日：2018-10-18
申请号：US15490608
申请日：2017-04-18
发明人： Yao-Sheng LAI , Kuei-Seng Cheng , Jian-Ming Huang
CPC分类号： C25D1/04 , C25D1/20 , C25D3/38 , C25D5/38 , C25D5/48 , H01M4/0438 , H01M4/045 , H01M4/0469
摘要： The present disclosure relates to a copper foil that exhibits surprising low repulsive force characteristics; and to methods for manufacturing such copper foils. Typically, the copper foil has (a) a lightness L* value of the nodule untreated side, based on the L*a*b color system, in the range of 75 to 90 and (b) a normal tensile strength in the range of 40 kgf/mm2 to 55 kgf/mm2. The disclosure further relates to flexible printed circuit boards and electronic devices using the above-mentioned copper foils for forming conductive lines therein.
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公开(公告)号：US10081875B1
公开(公告)日：2018-09-25
申请号：US15626877
申请日：2017-06-19
发明人： Yao-Sheng Lai , Kuei-Seng Cheng , Jian-Ming Huang
摘要： The present disclosure relates to a copper foil that exhibits surprising low repulsive force characteristics; and to methods for manufacturing such copper foils. Typically, the copper foil has (a) a lightness L* value of the nodule untreated side, based on the L*a*b color system, in the range of 75 to 90 and (b) a normal tensile strength in the range of 40 kgf/mm2 to 55 kgf/mm2. The disclosure further relates to flexible printed circuit boards and electronic devices using the above-mentioned copper foils for forming conductive lines therein.
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公开(公告)号：US20180265878A1
公开(公告)日：2018-09-20
申请号：US15710849
申请日：2017-09-21
申请人： NATIONAL TSING HUA UNIVERSITY , Chang Chun Plastics Co., Ltd. , Chang Chun Petrochemical Co., LTD.
发明人： Yuan YAO , Bo-Fan HSEUH
CPC分类号： C12N15/70 , B01D3/4211 , C07H17/08 , C12N15/09 , C12Q1/18 , C12R1/465 , G01N30/52 , G01N30/8658 , G01N2030/889
摘要： A method of real-time prognosis of a flooding phenomenon in a packed column includes steps as follows. An online data collection step is conducted, wherein a plurality of values of the pressure drop are collected from the packed column under operation. A calculation step is conducted, wherein the values of the pressure drop are used to calculate a plurality of values of a steadiness index. A statistical step is conducted, wherein a value of a monitoring statistic is calculated based on the values of the steadiness index. A control step is conducted, wherein the value of the monitoring statistic is compared to a control limit, and an alarm is triggered when the value of the monitoring statistic is greater than the control limit.
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公开(公告)号：US20180236437A1
公开(公告)日：2018-08-23
申请号：US15679173
申请日：2017-08-17
申请人： NATIONAL TSING HUA UNIVERSITY , Chang Chun Plastics Co., Ltd. , Chang Chun Petrochemical Co., LTD.
发明人： Chung-Sung TAN , Hao CHEN , Wei-Han HSIAO
CPC分类号： B01J20/223 , B01D53/06 , B01D53/1475 , B01D53/1493 , B01D53/18 , B01D2252/2041 , B01D2252/20415 , B01D2252/20421 , B01D2252/20426 , B01D2252/20447 , B01D2252/2056 , B01D2252/504 , B01D2253/20 , B01D2257/504 , B01D2258/0283 , B01J20/22 , Y02C10/04 , Y02C10/08
摘要： A carbon dioxide absorbent composition is disclosed. Based on 100 parts by weight of the carbon dioxide absorbent composition, the carbon dioxide absorbent composition includes 5 to 45 parts by weight of sodium 2-[(2-aminoethyl)amino]ethanesulfonate. Moreover, a method for capturing carbon dioxide using the carbon dioxide absorbent composition is disclosed.
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公开(公告)号：US20180220531A1
公开(公告)日：2018-08-02
申请号：US15422960
申请日：2017-02-02
发明人： Tsang-Jin Juo , Kuei-Sen Cheng , Yao-Sheng Lai , Jui-Chang Chou
CPC分类号： H05K1/09 , C25D3/38 , C25D5/48 , C25D7/00 , H05K3/007 , H05K3/188 , H05K3/28 , H05K2201/05 , H05K2203/0143 , H05K2203/1545
摘要： A method and production of composite foils and thin copper foils peeled from said composite copper foils is disclosed for use in forming printed circuit boards (PCB). Either the composite foil or only the thin copper foil can be laminated to a polymer layer to form the printed circuit board, with the step of separating the thin copper foil from the composite copper foil is performed subsequent to said laminating step.
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公开(公告)号：US09988637B2
公开(公告)日：2018-06-05
申请号：US15495580
申请日：2017-04-24
申请人： NATIONAL TSING HUA UNIVERSITY , CHANG CHUN PLASTICS CO., LTD , CHANG CHUN PETROCHEMICAL CO., LTD
发明人： Yu Chen Hu , Mu-En Chung , I-Hsin Yeh , Hung Li , Li-Yu Sung
CPC分类号： C12N15/73 , C07K14/245 , C12N9/22 , C12N15/102 , C12N15/11 , C12N15/70 , C12N15/72 , C12N15/902 , C12N2310/20 , C12N2800/101 , C12N2830/006 , C12Y301/11003
摘要： A Cas9 expression plasmid, a genome editing system and a genome editing method for Escherichia coli are provided. The Cas9 expression plasmid includes a tracrRNA sequence, a Cas9 gene and a chloramphenicol resistance gene (CmR). The Cas9 expression plasmid is applied to CRISPR/Cas-coupled λ-red recombineering system for editing genomes of E. coli with high efficiency.
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68.发明申请公开(公告)号：US20180037887A1
公开(公告)日：2018-02-08
申请号：US15475139
申请日：2017-03-31
申请人： NATIONAL TSING HUA UNIVERSITY , Chang Chun Plastics Co., Ltd. , Chang Chun Petrochemical Co., LTD.
发明人： Yu-Chen HU , Hung LI , Chun-Hung HUANG , Li-Yu SUNG , Chih-Che SHEN
IPC分类号： C12N15/113 , C12N15/87 , C12N1/38 , C12N1/20
CPC分类号： C12N15/113 , C12N9/22 , C12N15/102 , C12N15/74 , C12N2310/20
摘要： The present disclosure relates to a gene expression regulation system of a Synechococcus elongatus PCC 7942. The gene expression regulation system of the S. elongatus PCC 7942 includes a S. elongatus PCC 7942 cell, a gene expression interference unit and a gene editing unit. The present disclosure also relates to a method for regulating a gene expression of the S. elongatus PCC 7942. The method includes providing the S. elongatus PCC 7942 cell, using the gene editing unit to insert an exogenous gene into the S. elongates PCC 7942 cell, and using the gene expression interference unit to inhibit an expression of a target gene.
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公开(公告)号：US09711799B1
公开(公告)日：2017-07-18
申请号：US15284011
申请日：2016-10-03
发明人： Yao-Sheng Lai , Kuei-Sen Cheng , Jui-Chang Chou
CPC分类号： H01M4/661 , C25D1/04 , C25D3/38 , C25D5/022 , H01M4/366 , H01M4/386 , H01M4/587 , H01M4/625 , H01M10/0525 , H01M2004/021 , H01M2004/027 , H05K3/025 , H05K2201/0355
摘要： The present disclosure relates to an improved electrodeposited copper foil having uniform thickness and methods for manufacturing the electrodeposited copper foil. The electrodeposited copper foil typically has one to four interfacial lines through the cross-sectional area of the foil and a weight deviation less than 2.0%. The disclosure also relates to a process for making the electrodeposited copper foil that includes the addition of one or more insulative masks to the surface of a dimensionally stable anode. The insulative mask is cut to correspond to areas of variation in electrodeposited copper foil, such that the mask causes interferences with the electrodeposition process to even out the variation.
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公开(公告)号：US09707738B1
公开(公告)日：2017-07-18
申请号：US14995911
申请日：2016-01-14
发明人： Kuei-Sen Cheng , Shih-Cheng Tseng , Tsang-Jin Juo
CPC分类号： B32B15/01 , B32B37/10 , B32B37/1284 , B32B37/16 , B32B2311/12 , B32B2311/22 , B32B2457/00 , C25D1/04 , C25D3/12 , C25D3/38 , C25D5/14 , C25D7/0614 , C25D7/0621 , H01C1/1406 , H01C7/008 , H01C7/027 , H01C17/28 , H05K1/09 , H05K2201/0355 , H05K2203/0307
摘要： A copper foil having a matte side with nickel plated thereon in an amount of nickel in the range of 100,000-300,000 μs/dm2. The plated copper foils have particular utility in Positive Temperature Coefficient (PTC) devices. The plated copper foils have a surface hardness of from 50 to 200, a tensile strength greater than 45 kg/mm2 and a shiny side surface roughness (Rz) not exceeding 2.0 μm. The surface roughness of the matte side of the copper foil is in the range of 6 to 10 μm. Copper nodules are present on the matte side of the copper foil between the copper foil and the nickel plating. Methods of producing the copper foil and PTC devices incorporating the copper foil are described.
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