Abstract:
A NAND type flash memory includes first to third memory cell transistors having current paths connected in series between one end of a current path of each of first and second selection transistors, and each having a control gate and a charge storage layer, the first and second memory cell transistors being adjacent to the first and second selection transistors, the third memory cell transistor being positioned between the first and second memory cell transistors, the third memory cell transistor holding data having not less than three bits, the first memory cell transistor holding 2-bit data in which middle and upper pages is written by skipping a lower page, and a lower page verify voltage being set when writing the middle page, and a middle page verify voltage is set when writing the upper page, changing a position of a threshold distribution of the first memory cell transistor.
Abstract:
A memory system with a semiconductor memory device, in which a physical block of n-bits serves as an erase unit, wherein the address management of the memory device is performed by a logical block with m-bits, “m” being larger than “n” and expressed by a power of two, and wherein a n-bit portion continued from the head address in the logical block is defined as a first management unit corresponding to one physical block of the memory device, and a number of the remaining fraction portions each defined as a second management unit are gathered so as to correspond to one physical block of the memory device.
Abstract:
A NAND type flash memory includes first to third memory cell transistors having current paths connected in series between one end of a current path of each of first and second selection transistors, and each having a control gate and a charge storage layer, the first and second memory cell transistors being adjacent to the first and second selection transistors, the third memory cell transistor being positioned between the first and second memory cell transistors, the third memory cell transistor holding data having not less than three bits, the first memory cell transistor holding 2-bit data in which middle and upper pages is written by skipping a lower page, and a lower page verify voltage being set when writing the middle page, and a middle page verify voltage is set when writing the upper page, changing a position of a threshold distribution of the first memory cell transistor.
Abstract:
A NAND type flash memory includes first to third memory cell transistors having current paths connected in series between one end of a current path of each of first and second selection transistors, and each having a control gate and a charge storage layer, the first and second memory cell transistors being adjacent to the first and second selection transistors, the third memory cell transistor being positioned between the first and second memory cell transistors, the third memory cell transistor holding data having not less than three bits, the first memory cell transistor holding 2-bit data in which middle and upper pages is written by skipping a lower page, and a lower page verify voltage being set when writing the middle page, and a middle page verify voltage is set when writing the upper page, changing a position of a threshold distribution of the first memory cell transistor.
Abstract:
A nonvolatile semiconductor memory according to the present invention includes a memory cell array including a plurality of electrically writable memory cells; a plurality of word lines and a plurality of bit lines connected to the plurality of memory cells; and a data reading and programming control section for, when performing 4-value data programming, read or erasure with respect to at least one of the plurality of memory cells, selecting and applying a voltage to a corresponding word line and a corresponding bit line among the plurality of word lines and the plurality of bit lines; wherein the data reading and programming control section includes an adjacent memory cell data reading section for reading, at a reading voltage of a predetermined reading voltage level, whether or not data is programmed in a lower page of a second memory cell adjacent to a first memory cell in the memory cell array, and generating adjacent memory cell state data which represents a data state of the second memory cell; an adjacent memory cell data memory section for storing the adjacent memory cell state data generated by the adjacent memory cell data reading section; a reading voltage level control section for defining a plurality of predetermined reading voltage verify levels for reading data from the first memory cell based on the adjacent memory cell state data; a data reading section for reading the data from the first memory cell at a plurality of reading voltages corresponding to the plurality of predetermined reading voltage verify levels; and a data determining section for determining which data of 4-value data is programmed in the first memory cell based on the data which is read by the data reading section.
Abstract:
A semiconductor memory device includes a memory cell array, data buffer, and column switch. The data buffer senses the potential of a bit line to determine data in a selected memory cell and hold readout data in a read. The data buffer detects both whether the whole data buffer holds “0” data and whether the whole data buffer holds “1” data. The column switch selects part of the data buffer and connects the part to a bus.
Abstract:
The non-volatile semiconductor memory device has a circuit which maintains and holds the potentials of bit lines, and either ones of even-bit lines or odd-bit lines are connected to the circuit. When the bit line potential holding circuit is connected to even-bit lines and a block copy is performed, data is first outputted to the even-bit lines, and after the potential of the even-bit line is determined, the bit line potential holding circuit operates. Then, biasing of the potential of the even-bit lines is carried out by the bit line potential holding circuit, the potentials of the bit lines are maintained and held. At the same time, data is outputted to the odd-bit lines and the potentials of the odd-bit lines are determined. Then, a program voltage is supplied to a selected word line, and data is simultaneously written (programmed) in the memory cells connected to the even-bit lines, and the memory cells connected to the odd-bit lines.
Abstract:
A non-volatile semiconductor memory device includes: a cell array having electrically rewritable and non-volatile memory cells arranged therein; and a sense amplifier circuit configured to detect voltage change of a bit line in the cell array, thereby reading data of a selected memory cell coupled to the bit line, wherein the sense amplifier circuit is controlled to read data at plural timings within a period in which the bit line voltage is changing in correspondence with the selected memory cell, and compare data read out by successive two data read operations with each other so as to judge a threshold margin of the selected memory cell.
Abstract:
A semiconductor device has an address counter to output, in a first mode, a first block address whereas, in a second mode, a second block address selected from a block-address space two times larger than a block-address space corresponding to memory blocks, the memory blocks and at least one redundant block being included in a memory section, and a block-selection controller, in the second mode, one of the memory blocks, which corresponds to the output of the address counter, when the most significant value of the second block address as the output of the address counter is at a first level whereas select the redundant block while the memory blocks are inhibited from selection, when the most significant value is at a second level.
Abstract:
A non-volatile semiconductor memory device comprises a plurality of blocks each having a plurality of memory cells to be erased at a time and a decoder for selecting the memory cells, each of the blocks having a block decoder for latching a selection signal thereof in pre-programming and for selecting all of the latched blocks by the selection signal at the same time, a sense amplifier, and an address control circuit for controlling a sequence, the sequence including counting addresses of the memory cells in erasing and erasing all of the selected memory cells after pre-programming, all of the blocks having the latched selection signal being controlled to be collectively erased by the address control circuit.