Abstract:
There are provided a probe card for test of semiconductor chips and a method for testing semiconductor chips using the probe card. In implementing the probe card for electrically testing semiconductor chips, the probe blocks corresponding to multiple selected ones of the semiconductor chips on the wafer can be selected so that the selected semiconductor chips are EDS tested in a one-step process. As the selected semiconductor chips are EDS tested in a one-step process, equipment efficiency is improved, and statistical objectivity of data indicating characteristics of the wafer can be achieved.
Abstract:
A vacuum type pickup apparatus may include an absorption pad having an absorption inlet for contacting and/or picking up an object. A pad holder may be connected to the absorption pad. The pad holder may also have a vacuum line. A separator may be provided in the pad holder for forcibly releasing the object from the absorption inlet of the absorption pad. During the forcible release of the object, the air around the absorption pad may be drawn into the pad holder, thus reducing or preventing the potential contamination by impurities of the object as well as the equipment around the object. Also, an additional vacuum extinguisher may not be required, thus simplifying the structure of the vacuum type pickup apparatus and reducing installation costs. Furthermore, the object may be picked up and released in a relatively expedient, safe, and accurate manner, despite the suction force of the vacuum that may be maintained in the pad holder.
Abstract:
In a capacitor structure and a method of manufacturing the capacitor structure, first and second conductive patterns are formed on a substrate. The first and second conductive patterns extend in a first direction. The first and second conductive patterns are alternately arranged to be spaced apart from one another in a second direction substantially perpendicular to the first direction. An insulating interlayer is formed on the substrate to cover the first and second conductive patterns. Third and fourth conductive patterns extending in a third direction lying at an angle of between about 0° and about 90° relative to the first direction are formed on the insulating interlayer. The third and fourth conductive patterns are alternately arranged to be spaced apart from one another in a fourth direction substantially perpendicular to the third direction.
Abstract:
A semiconductor device includes a semiconductor package, a circuit board and an interval maintaining member. The semiconductor package has a body and a lead protruded from the body. The circuit board has a first land electrically connected to the lead. The interval maintaining member is interposed between the circuit board and the body. The interval maintaining member maintains an interval between the lead and the first land. Thus, an interval between the lead and the land is uniformly maintained, so that a thermal and/or mechanical reliability of the semiconductor device is improved.
Abstract:
A semiconductor package may include a substrate. A conductive bump may be provided on a bottom surface of the substrate. A semiconductor chip may be provided on a top surface of the substrate. A sealing material may seal the semiconductor chip on the top of the substrate. A first conductive adhesive may be provided on a top surface of the sealing material. A second conductive adhesive may be provided on a side surface of the substrate and a side surface of the sealing material.
Abstract:
The present invention relates to a method and system for the management of the mobility, the management of an idle mode, the registration management (management of attachment and detachment), and the location management (management of tracking area) of a terminal by using a non-access stratum (i.e., network stratum, hereinafter referred to as “NAS”) in a mobile telecommunication network. To this end, the method for the management of mobility, the management of an idle mode, the registration management, and the location management of a terminal by using a NAS protocol, i.e., messages, according to an embodiment of the present invention, includes a terminal (hereinafter, referred to as “UE”) and a mobility management entity (hereinafter, referred to as “MME”), and addresses to a method for efficiently processing security protected NAS messages if received messages are security protected NAS messages, in a case of sending or receiving messages serving as EMM (EPS Mobility Management) messages, i.e., mobility management messages, in a network such as an EPS (Evolved Packet System) of 3GPP, when the terminal performs handover in an active mode, performs location management in an idle mode, and registers to a network, thereby achieving improved efficiency in the mobility management, the position management, and the registration management of a terminal.
Abstract:
A method to compress exposure data may include converting image data into a plurality of exposure data, generating new exposure data by combining part of the plurality of exposure data or by excluding part of the plurality of exposure data, and compressing the new exposure data. An exposure apparatus may include a conversion unit that converts image data into a plurality of exposure data, a control unit that generates new exposure data by combining part of the plurality of exposure data or by excluding part of the plurality of exposure data, and a compression unit that compresses the new exposure data.
Abstract:
A damper including a cylinder, a piston inserted in the cylinder, a movable member disposed in the piston to be movable in the cylinder in a length direction of the cylinder, and a weight sensor mounted on an inner surface of the cylinder, facing an end of the piston, to perceive weight loaded on the piston through contact with the movable member. When applied to a washing machine, the damper is capable of perceiving accurate weight of the laundry supplied in the washing machine.
Abstract:
A semiconductor manufacturing apparatus and a wafer loading/unloading method thereof increase productivity. The semiconductor manufacturing apparatus includes a first boat and a second boat having a plurality of first slots and a plurality of second slots, respectively, and disposed such that the first slots and the second slots alternate each other, the first boat mounting a plurality of first wafers in the first slots to direct front faces of the first wafers in a predetermined direction, the second boat mounting a plurality of second wafers in the second slots to direct back faces of the second wafers in the predetermined direction; a reaction tube having an opening and containing the first and second boats mounting the first and second wafers; a plate sealing up the opening of the reaction tube containing the first boat and the second boat; a reaction gas supplier supplying reaction gas into the sealed reaction tube for a predetermined process; and a reaction gas exhauster exhausting the reaction gas from the reaction tube to the external of the reaction tube after the predetermined process.
Abstract:
A projection type image display apparatus includes: a cabinet; a screen which is provided in the cabinet; a display device which is placed inside the cabinet and forms an image; and an optical system which projects an image formed by the display device to the screen and comprises at least one mirror, a supporter for supporting the mirror, and a frame through which the supporter is fastened to the cabinet, all of the mirror, the supporter and the frame being disposed within a single interior space formed by the cabinet and the screen.