中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

84 records (took 0.036 seconds)

    Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements
    62.
    发明授权
    Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements 有权
    用于使用关键尺寸测量来控制半导体晶圆工艺的方法，系统和介质

    公开(公告)号：US07225047B2

    公开(公告)日：2007-05-29

    申请号：US10100184

    申请日：2002-03-19

    Applicant: Amir Al-Bayati ,  Babak Adibi ,  Majeed Foad ,  Sasson Somekh

    Inventor： Amir Al-Bayati ,  Babak Adibi ,  Majeed Foad ,  Sasson Somekh

    IPC: G06F19/00 ,  G01N37/00

    CPC classification number: H01L21/67253 ,  H01L22/20 ,  Y10T29/41

    Abstract: Methods, systems, and mediums of controlling a semiconductor manufacturing process are described. The method comprises the steps of measuring at least one critical dimension of at least one device being fabricated on at least one of the plurality of wafers, determining at least one process parameter value on the at least one measured dimension, and controlling at least one semiconductor manufacturing tool to process the at least one of the plurality of wafers based on the at least one parameter value. A variation in the at least one critical dimension causes undesirable variations in performance of the at least one device, and at least one process condition is directed to controlling the processing performed on the plurality of wafers. The at least one manufacturing tool includes at least one of an implanter tool and an annealing tool.

    Abstract translation: 描述了控制半导体制造工艺的方法，系统和介质。 该方法包括以下步骤：测量在至少一个晶片上制造的至少一个器件的至少一个临界尺寸，确定至少一个测量尺寸上的至少一个工艺参数值，以及控制至少一个半导体 基于所述至少一个参数值来处理所述多个晶片中的所述至少一个的制造工具。 所述至少一个关键尺寸的变化导致所述至少一个装置的性能的不期望的变化，并且至少一个处理条件涉及控制在所述多个晶片上执行的处理。 所述至少一个制造工具包括注入机工具和退火工具中的至少一个。

    Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
    65.
    发明授权
    Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion 有权
    化学机械抛光系统具有多个抛光台并提供相对的线性抛光运动

    公开(公告)号：US07097544B1

    公开(公告)日：2006-08-29

    申请号：US09507172

    申请日：2000-02-18

    Applicant: Robert D. Tolles ,  Norm Shendon ,  Sasson Somekh ,  Ilya Perlov ,  Eugene Gantvarg ,  Harry Q. Lee

    Inventor： Robert D. Tolles ,  Norm Shendon ,  Sasson Somekh ,  Ilya Perlov ,  Eugene Gantvarg ,  Harry Q. Lee

    IPC: B24B7/22

    CPC classification number: H01L21/67057 ,  B08B1/007 ,  B24B27/0023 ,  B24B37/30 ,  B24B37/345 ,  B24B41/005 ,  B24B53/017 ,  B24B57/02 ,  H01L21/30625 ,  H01L21/67051

    Abstract: An apparatus and associated methods for polishing semiconductor wafers and other workpieces that includes polishing surfaces located at multiple polishing stations. Multiple wafer heads, preferably at least one greater in number than the number of polishing stations, can be loaded with individual wafers. The wafer heads are suspended from a rotatable support, which provides circumferential positioning of the heads relative to the polishing surfaces, and the wafer heads move linearly with respect to the polishing surface, thus providing relative linear motion between the wafer and the polishing station. A load/unload station may be located at a position symmetric with the polishing surfaces. The rotatable support can simultaneously position one of the heads over the load/unload station while the remaining heads are located over polishing stations for wafer polishing so that loading and unloading of wafers can be performed concurrently with wafer polishing. The multiple polishing stations can be used to sequentially polish a wafer held in a wafer head in a step of multiple steps. The steps may be equivalent, may provide polishes of different finish, or may be directed to polishing different levels. Alternately, more than one wafer may equivalently be polished at multiple polishing stations.

    Abstract translation: 一种用于抛光半导体晶片和其它工件的装置和相关方法，其包括位于多个抛光站处的抛光表面。 多个晶片头，优选地至少比抛光站的数量多一个，可以加载单独的晶片。 晶片头从可旋转的支撑件悬挂，其提供头部相对于抛光表面的周向定位，并且晶片头相对于抛光表面线性移动，从而在晶片和抛光台之间提供相对的线性运动。 装载/卸载站可以位于与抛光表面对称的位置。 可旋转支撑件可以将其中一个头部同时放置在装载/卸载台上，而其余的头部位于用于晶片抛光的抛光站之上，从而可以与晶片抛光同时进行晶片的加载和卸载。 多个抛光站可以用于在多个步骤的步骤中顺序抛光保持在晶片头中的晶片。 这些步骤可以是等效的，可以提供不同涂饰的抛光剂，或者可以指向抛光不同的水平。 或者，可以在多个抛光站等效地抛光多于一个晶片。

    Conductive polishing article for electrochemical mechanical polishing
    66.
    发明授权
    Conductive polishing article for electrochemical mechanical polishing 失效
    电化学机械抛光用导电抛光制品

    公开(公告)号：US06979248B2

    公开(公告)日：2005-12-27

    申请号：US10140010

    申请日：2002-05-07

    Applicant: Yongqi Hu ,  Yan Wang ,  Alain Duboust ,  Feng Q. Liu ,  Rashid Mavliev ,  Liang-Yuh Chen ,  Ratson Morad ,  Sasson Somekh

    Inventor： Yongqi Hu ,  Yan Wang ,  Alain Duboust ,  Feng Q. Liu ,  Rashid Mavliev ,  Liang-Yuh Chen ,  Ratson Morad ,  Sasson Somekh

    IPC: C25D7/12 ,  B23H5/08 ,  B24B37/04 ,  B24D13/14 ,  C25F3/00 ,  C25F3/30 ,  C25F7/00 ,  H01L21/304 ,  B24B1/00 ,  C25C7/04 ,  C25D17/00

    CPC classification number: B24B37/16 ,  B23H5/08 ,  B24B37/046 ,  B24B37/14 ,  Y10S977/902

    Abstract: An article of manufacture, method, and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including a polishing article having a body comprising at least a portion of fibers coated with a conductive material, conductive fillers, or combinations thereof, and adapted to polish the substrate. In another aspect, a polishing article includes a body having a surface adapted to polish the substrate and at least one conductive element embedded in the polishing surface, the conductive element comprising dielectric or conductive fibers coated with a conductive material, conductive fillers, or combinations thereof. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. A plurality of perforations and a plurality of grooves may be formed in the articles to facilitate flow of material through and around the polishing article.

    Abstract translation: 提供了一种用于平坦化基板表面的制造方法和装置。 在一个方面，提供了一种制造用品，用于抛光包括抛光制品的基材，所述抛光制品具有主体，该主体包括涂覆有导电材料的纤维的至少一部分，导电填料或其组合，并适于抛光该基材。 在另一方面，抛光制品包括具有适于抛光基底的表面和嵌入在抛光表面中的至少一个导电元件的主体，该导电元件包括​​涂覆有导电材料的电介质或导电纤维，导电填料或其组合 。 导电元件可以具有延伸超过由抛光表面限定的平面的接触表面。 可以在制品中形成多个穿孔和多个凹槽以促进材料通过和抛光制品周围的流动。

    Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
    67.
    发明申请
    Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion 失效
    化学机械抛光系统具有多个抛光台并提供相对的线性抛光运动

    公开(公告)号：US20050048880A1

    公开(公告)日：2005-03-03

    申请号：US10965202

    申请日：2004-10-13

    Applicant: Robert Tolles ,  Norm Shendon ,  Sasson Somekh ,  Ilya Perlov ,  Eugene Gantvarg ,  Harry Lee

    Inventor： Robert Tolles ,  Norm Shendon ,  Sasson Somekh ,  Ilya Perlov ,  Eugene Gantvarg ,  Harry Lee

    IPC: B24B27/00 ,  B24B37/04 ,  B24B41/00 ,  B24B41/06 ,  B24B53/007 ,  B24B53/12 ,  B24B57/02 ,  H01L21/00 ,  H01L21/306 ,  B24B49/00 ,  B24B7/00

    CPC classification number: H01L21/67057 ,  B08B1/007 ,  B24B27/0023 ,  B24B37/30 ,  B24B37/345 ,  B24B41/005 ,  B24B53/017 ,  B24B57/02 ,  H01L21/30625 ,  H01L21/67051

    Abstract: An apparatus and associated methods for polishing semiconductor wafers and other workpieces that includes polishing surfaces located at multiple polishing stations. Multiple wafer heads, preferably at least one greater in number than the number of polishing stations, can be loaded with individual wafers. The wafer heads are suspended from a rotatable support, which provides circumferential positioning of the heads relative to the polishing surfaces, and the wafer heads move linearly with respect to the polishing surface, thus providing relative linear motion between the wafer and the polishing station. A load/unload station may be located at a position symmetric with the polishing surfaces. The rotatable support can simultaneously position one of the heads over the load/unload station while the remaining heads are located over polishing stations for wafer polishing so that loading and unloading of wafers can be performed concurrently with wafer polishing. The multiple polishing stations can be used to sequentially polish a wafer held in a wafer head in a step of multiple steps. The steps may be equivalent, may provide polishes of different finish, or may be directed to polishing different levels. Alternately, more than one wafer may equivalently be polished at multiple polishing stations.

    Abstract translation: 一种用于抛光半导体晶片和其它工件的装置和相关方法，其包括位于多个抛光站处的抛光表面。 多个晶片头，优选地至少比抛光站的数量多一个，可以加载单独的晶片。 晶片头从可旋转的支撑件悬挂，其提供头部相对于抛光表面的周向定位，并且晶片头相对于抛光表面线性移动，从而在晶片和抛光台之间提供相对的线性运动。 装载/卸载站可以位于与抛光表面对称的位置。 可旋转支撑件可以将其中一个头部同时放置在装载/卸载台上，而其余的头部位于用于晶片抛光的抛光站之上，从而可以与晶片抛光同时进行晶片的加载和卸载。 多个抛光站可以用于在多个步骤的步骤中顺序抛光保持在晶片头中的晶片。 这些步骤可以是等效的，可以提供不同涂饰的抛光剂，或者可以指向抛光不同的水平。 或者，可以在多个抛光站等效地抛光多于一个晶片。

    Carrier head with a substrate detection mechanism for a chemical mechanical polishing system
    68.
    发明授权
    Carrier head with a substrate detection mechanism for a chemical mechanical polishing system 有权
    载体头，具有用于化学机械抛光系统的基底检测机构

    公开(公告)号：US06705924B2

    公开(公告)日：2004-03-16

    申请号：US10364081

    申请日：2003-02-10

    Applicant: Sasson Somekh

    Inventor： Sasson Somekh

    IPC: B24B4900

    CPC classification number: B24B37/30 ,  B24B37/0053

    Abstract: A carrier head for a chemical mechanical polishing system includes a substrate sensing mechanism. The carrier head includes a base and a flexible member connected to the base to define a chamber. A lower surface of the flexible member provides a substrate receiving surface. The substrate sensing mechanism includes a sensor to measure a pressure in the chamber and generate an output signal representative thereof, and a processor configured to indicate whether the substrate is attached to the substrate receiving surface in response to the output signal.

    Abstract translation: 用于化学机械抛光系统的载体头包括基底感测机构。 承载头包括基部和连接到基部以限定室的柔性构件。 柔性构件的下表面提供衬底接收表面。 衬底检测机构包括用于测量腔室中的压力并产生代表其的输出信号的传感器，以及被配置为响应于输出信号指示衬底是否附着到衬底接收表面的处理器。

    Multi-tool control system, method and medium
    69.
    发明授权
    Multi-tool control system, method and medium 失效
    多工具控制系统，方法和介质

    公开(公告)号：US06640151B1

    公开(公告)日：2003-10-28

    申请号：US09469227

    申请日：1999-12-22

    Applicant: Sasson Somekh ,  Howard E. Grunes

    Inventor： Sasson Somekh ,  Howard E. Grunes

    IPC: G06F1900

    CPC classification number: H01L21/67253

    Abstract: A system/method for interactively monitoring and adjusting product output from a module that includes two or more preparation tools. The output is a result of the coordinated effort of the two or more semiconductor preparation tools making up the module. The first of the tools is capable of implementing a first process on a semiconductor product and producing a first output. The second of the tools is configured to receive as input the first output from the first tool. The second tool is also capable of implementing a second process on the semiconductor product and producing a second output. A module control mechanism is capable of facilitating the exchange of information between the first tool and the second tool so that the module yields a desired semiconductor product output. Certain information can also be exchanged between the first and second tools. Other system/method embodiments for output/production control are also envisioned.

    Abstract translation: 用于交互式监视和调整包含两个或更多准备工具的模块的产品输出的系统/方法。 输出是构成模块的两个或更多个半导体制备工具的协调努力的结果。 第一个工具能够实现半导体产品上的第一个工艺并产生第一个输出。 第二个工具被配置为从第一个工具接收第一个输出作为输入。 第二工具还能够实现半导体产品上的第二工艺并产生第二输出。 模块控制机构能够促进第一工具和第二工具之间的信息交换，使得模块产生期望的半导体产品输出。 某些信息也可以在第一和第二工具之间交换。 也可以设想用于输出/生产控制的其它系统/方法实施例。

Patent Agency Ranking