Abstract:
The present invention involves a method and apparatus for canceling the effects of magnetic field noise in a torque sensor by placing three sets of magnetic field sensors around a shaft, the first set of field sensors being placed in the central region of the shaft and the second and third sets of field sensors being placed on the right side and left side of the field sensors placed at the central region, respectively. A torque-induced magnetic field is not cancelled with this arrangement of field sensors but a magnetic near field from a near field source is cancelled.
Abstract:
An n-type SBTT and a manufacturing method thereof are provided. The SBTT includes a silicon layer, a gate, a double layer that has a rare-earth metal silicide layer and a transition metal silicide layer. The silicon layer has a channel region. The gate is formed in an overlapping manner on the channel region and has a gate dielectric layer on its interface with respect to the silicon layer. The double layer is formed as a source/drain that has the channel region interposed on the silicon layer.
Abstract:
Provided is a data storage apparatus using current switching in a metal oxide layer. The data storage apparatus includes a substrate; a lower electrode layer disposed on the substrate; a metal oxide layer disposed on the lower electrode layer; a probe tip disposed on the metal oxide layer opposite the lower electrode layer and for scanning a local region of the metal oxide layer in units of nanometer, wherein the probe tip applies a write voltage to the local region of the metal oxide layer so that the resistance of the local region is sharply changed until a resistive state of the local region is switched from a first state to a second state or measures current flowing through the local region according to the resistive state and reads data stored in the local region; a driver for transferring the position of the probe tip to the local region of the metal oxide layer; and a controller for controlling the probe tip and the driver.
Abstract:
Provided is a method of manufacturing a nano size-gap electrode device. The method includes the steps of: disposing a floated nano structure on a semiconductor layer; forming a mask layer having at least one opening pattern to intersect the nano structure; and depositing a metal on the semiconductor layer exposed through the opening pattern to form an electrode, such that a nano size-gap is provided under the nano structure by the nano structure.
Abstract:
A magnetic array having a collar with a plurality of magnets mounted to the inner surface of the collar. The magnets are positioned in a spaced alignment around the collar with all having the same polarity facing toward the center of the collar. Shielding is used to control and/or contain the direction of the magnetic force and the array is covered with a plastic coating.
Abstract:
Disclosed is to a single electron device, a method of manufacturing the same, and a method of simultaneously manufacturing a single electron device and an MOS transistor. Accordingly, the single electron device of the present invention comprises, on a substrate, semiconductor layers in which a source region and a drain region spaced a predetermined distance apart are formed, hemisphere-type silicon layer formed between the semiconductor layers as an active layer, the hemisphere-type silicon layer having a plurality of electron islands, a gate insulating layer formed on a top surface of the entire structure, and a gate electrode formed on the gate insulating layer in order to apply voltage to the active layer.
Abstract:
The present invention relates to an ultra small size vertical MOSFET device having a vertical channel and a source/drain structure and a method for the manufacture thereof by using a silicon on insulator (SOI) substrate. To begin with, a first silicon conductive layer is formed by doping an impurity of a high concentration into a first single crystal silicon layer. Thereafter, a second single crystal silicon layer with the impurity of a low concentration and a second silicon conductive layer with the impurity of the high concentration are formed on the first silicon conductive layer. The second single crystal silicon layer and the second silicon conductive layer are vertically patterned into a predetermined configuration. Subsequently, a gate insulating layer is formed on entire surface. Then, an annealing process is carried out to diffuse the impurities in the first silicon conductive layer and the second silicon conductive layer into the second single crystal layer, thereby forming a source contact, a drain contact and a vertical channel. Finally, a gate electrode is formed on side walls of the vertical channel.
Abstract:
A permanent magnet structure for maximizing the flux density per weight of magnetic material comprising a hollow body flux source for generating a magnetic field in the central gap of the hollow body, the magnetic field having a flux density greater than the residual flux density of the hollow body flux source. The hollow body flux source has a generally elliptic-shape, defined by unequal major and minor axis. These elliptic-shaped permanent magnet structures exhibit a higher flux density at the center gap while minimizing the amount of magnetic material used. Inserts of soft magnetic material proximate the central gap, and a shell of soft magnetic material surrounding the hollow body can further increase the strength of the magnetic field in the central gap by reducing the magnetic flux leakage and focusing the flux density lines in the central gap.
Abstract:
A thin film transistor is disclosed comprising a piezoelectric film formed on a piezoresistive body of an ultra thin film and a gate electrode formed on the piezoelectric film. Due to the force generated from the piezoelectric film by an electric field generated according to the strength of a voltage applied to the gate electrode, a pressure is applied on the piezoresistive body to vary the resistance of the piezoresistive body. Thus, the quantity of current that flows from a source terminal through the piezoresistive channel to a drain terminal can be controlled. Since the piezoresistive body can be formed on a plane, a thin film transistor with a three-dimensional structure can be manufactured.
Abstract:
A bottle cap that is an apparatus for containing heterogeneous materials, applied in the discharge direction of materials in a container, comprises: a main body coupled to a bottle neck; and a containing unit assembled inside the main body with a storage space. An activated unit is assembled in the center of the upper support unit of the main body. An activation unit for downward movement is coupled to the activated unit so that the activated unit may move downward by a separate activation unit. An opening/closing unit is coupled with the lower part of the activated unit with the above structure in order to seal an opening/closing hole of the storage space.