摘要:
A method of manufacturing a thin film transistor capable of simplifying a substrate structure and a manufacturing process is disclosed. The method of manufacturing a thin film transistor array substrate comprising a three mask process. The 3 mask process comprising, forming a gate pattern on a substrate, forming a gate insulating film on the substrate, forming a source/drain pattern and a semiconductor pattern on the substrate, forming a first, second, and third passivation film successively on the substrate. Over the above multi-layers of the passivation film forming a first photoresist pattern comprising a first portion formed on part of the drain electrode and on the pixel region, and a second portion wherein, the second portion thicker than the first portion, and then patterning the third passivation film using the first photoresist pattern, forming a second photoresist pattern by removing the first portion of the first photoresist pattern, forming a transparent electrode film on the substrate, removing the second photoresist pattern and the transparent electrode film disposed on the second photoresist pattern; and forming a transparent electrode pattern on the second passivation layer.
摘要:
A data output circuit for an integrated circuit memory device includes a control circuit that is configured to generate a plurality of clock signals responsive to at least a portion of a memory column address, and a multiplexer circuit that is configured to output memory data received on input terminals thereof onto an output terminal responsive to selective invocation of the plurality of clock signals. The clock signals are invoked in an order based on the at least a portion of the memory column address.
摘要:
Disclosed is a novel concept of infrared blocking powder, that is to say, indium antimony tin oxide (IATO), which is produced by mixing indium (In), antimony (Sb), and tin (Sn) in a predetermined mixing ratio, and co-precipitating a mixture in solvent. Additionally, the present invention provides infrared blocking solution and infrared blocking material using the infrared blocking powder, which allow visible rays to transmit therethrough but effectively block near-infrared rays acting as thermic rays.
摘要:
A plasma processing apparatus includes: a chamber; an insulating member disposed in an upper portion of the chamber; a ground electrode formed at a side wall of the chamber, a ground potential being applied to the ground electrode; and a lower electrode disposed in a lower portion of the chamber, a substrate being placed on the lower electrode, wherein the lower electrode is divided into a plurality of electrodes.According to an aspect of the present invention, particles accumulated in the central portion on a lower surface, an edge area of an upper surface, a side, and an edge area of the lower surface of the substrate can be effectively removed.
摘要:
A data output circuit for an integrated circuit memory device includes a control circuit that is configured to generate a plurality of clock signals responsive to at least a portion of a memory column address, and a multiplexer circuit that is configured to output memory data received on input terminals thereof onto an output terminal responsive to selective invocation of the plurality of clock signals. The clock signals are invoked in an order based on the at least a portion of the memory column address.
摘要:
A memory device, such as a DDR SDRAM, may be provided in which subsets of data output circuits of the device can be selectively enabled to allow sets of data output pins to be connected in common in a testing configuration. In some embodiments, a memory device includes a plurality of data output circuits, respective ones of which are configured to receive data from respective internal data lines and respective ones of which are coupled to respective data input/output pins. The device further includes a data output control circuit operative to selectively enable subsets of the plurality of data output circuits to drive their respective corresponding data input/output pins responsive to an externally-applied control signal. The data output control circuit may be operative to selectively cause subsets of the plurality of data output circuits to present a high impedance at their respective corresponding data input/output pins. The invention may be embodied as devices and methods.
摘要:
A full-stress testable memory device having an open bit line architecture and a method of testing the memory device. The memory device of the invention includes dummy bit lines, and a voltage controller connected to the dummy bit lines. The voltage controller alternately provides a first variable control voltage and a second variable control voltage to the dummy bit lines during a test mode. In accordance with a method of testing the memory device, a fixed voltage is provided to the dummy bit lines of the edge sub-arrays during a normal operation mode. However, during a test mode, the fixed voltage being applied to the dummy bit line is replaced with a supply voltage and/or a ground voltage, so that all of the sub-arrays can be equally tested.
摘要:
An integrated circuit memory device includes a memory cell array, a plurality of data input lines configured to convey data to the memory cell array and a plurality of data output lines configured to convey data from the memory cell array. The device also includes a memory write buffer that receives write data for the memory cell array and responsively drives the data input lines, a sense amplifier and a plurality of sense amplifier input lines configured to convey data to the sense amplifier. The device further includes a selecting circuit coupled to the data input lines, to the data output lines and to the sense amplifier input lines and configured to selectively couple the data input lines to the sense amplifier input lines responsive to a control signal.
摘要:
A flash memory device has improved erasable characteristics and device reliability. The flash memory device includes a semiconductor substrate and heavily doped impurity regions formed spaced apart from one another by a predetermined distance in the semiconductor substrate in a first direction. First and second isolation regions are formed spaced apart from each other by a second predetermined distance on the semiconductor substrate, in a second direction which is preferably at a right angle to the first direction. Each of the floating gates are formed between the first and second isolation regons and between the heavily doped impurity regions. The control gate lines are formed between the first and second isolation regions, and over the floating gates in the same direction as the first and second isolation regions. An erase gate line is formed to have a narrower width than the floating gate, and is formed over the floating gate, preferably at a right angle to the control gate line.