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182 条记录 (耗时 0.036 秒)

    Methods for exposure for the purpose of thermal management for imprint lithography processes
    63.
    发明授权
    Methods for exposure for the purpose of thermal management for imprint lithography processes 有权
    用于印刷光刻工艺的热处理目的的曝光方法

    公开(公告)号：US08609326B2

    公开(公告)日：2013-12-17

    申请号：US12047572

    申请日：2008-03-13

    申请人： Sidlgata V. Sreenivasan ,  Byung-Jin Choi

    发明人： Sidlgata V. Sreenivasan ,  Byung-Jin Choi

    IPC分类号： B29C35/08

    CPC分类号： B82Y10/00 ,  B82Y40/00 ,  G03F7/0002

    摘要： The present invention is directed to a method that attenuates, if not avoids, heating of a substrate undergoing imprint lithography process and the deleterious effects associated therewith. To that end, the present invention includes a method of patterning a field of a substrate with a polymeric material that solidifies in response to actinic energy in which a sub-portion of the field is exposed sufficient to cure the polymeric material is said sub-portion followed by a blanket exposure of all of the polymeric material associated with the entire field to cure/solidify the same.

    摘要翻译： 本发明涉及一种衰减（如果不是避免）加热经历压印光刻工艺的衬底和与之有关的有害影响的方法。 为此，本发明包括使用聚合物材料对基材的场图案化的方法，该聚合物材料响应于其中暴露足够固化聚合物材料的场的部分暴露的光化能而固化，所述子部分 随后与整个场相关联的所有聚合物材料的全面曝光以固化/固化。

    LARGE AREA IMPRINT LITHOGRAPHY
    64.
    发明申请
    LARGE AREA IMPRINT LITHOGRAPHY 有权
    大面积印刷图

    公开(公告)号：US20130214452A1

    公开(公告)日：2013-08-22

    申请号：US13773217

    申请日：2013-02-21

    申请人： Byung-Jin Choi ,  Se Hyun Ahn ,  Mahadevan GanapathiSubramanian ,  Michael N. Miller ,  Sidlgata V. Sreenivasan

    发明人： Byung-Jin Choi ,  Se Hyun Ahn ,  Mahadevan GanapathiSubramanian ,  Michael N. Miller ,  Sidlgata V. Sreenivasan

    IPC分类号： B29C59/02

    CPC分类号： B29C59/026 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002

    摘要： Methods and systems are provided for patterning polymerizable material dispensed on flexible substrates or flat substrates using imprint lithography techniques. Template replication methods and systems are also presented where patterns from a master are transferred to flexible substrates to form flexible film templates. Such flexible film templates are then used to pattern large area flat substrates. Contact between the imprint template and substrate can be initiated and propagated by relative translation between the template and the substrate.

    摘要翻译： 提供了使用压印光刻技术对分配在柔性基板或平坦基板上的可聚合材料进行图案化的方法和系统。 还提供了模板复制方法和系统，其中来自主机的模式被转移到柔性基板以形成柔性膜模板。 然后使用这种柔性膜模板来对大面积的平坦基板进行图案化。 可以通过模板和衬底之间的相对平移来启动和传播压印模板和衬底之间的接触。

    Method and system for double-sided patterning of substrates
    67.
    发明授权
    Method and system for double-sided patterning of substrates 有权
    用于基板双面图案化的方法和系统

    公开(公告)号：US08109754B2

    公开(公告)日：2012-02-07

    申请号：US12686732

    申请日：2010-01-13

    申请人： Byung-Jin Choi ,  Sidlgata V. Sreenivasan

    发明人： Byung-Jin Choi ,  Sidlgata V. Sreenivasan

    IPC分类号： B29C59/00

    CPC分类号： G03F7/70425 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  G03F9/00 ,  Y10S977/887

    摘要： A system of patterning first and second opposed sides of a substrate is described. The system may employ a mold assembly and obtaining a desired spatial relationship between the first and second opposed sides of the substrate and the mold assembly. In a further embodiment, the method and system may employ a first and a second mold assembly.

    摘要翻译： 描述了基板的第一和第二相对侧的构图的系统。 该系统可以采用模具组件并且获得基板和模具组件的第一和第二相对侧之间的期望的空间关系。 在另一个实施例中，该方法和系统可以采用第一和第二模具组件。

    Capillary Imprinting Technique
    68.
    发明申请
    Capillary Imprinting Technique 有权
    毛细管压印技术

    公开(公告)号：US20110140302A1

    公开(公告)日：2011-06-16

    申请号：US13028336

    申请日：2011-02-16

    申请人： Byung-Jin Choi ,  Sidlgata V. Sreenivasan

    发明人： Byung-Jin Choi ,  Sidlgata V. Sreenivasan

    IPC分类号： B28B11/08

    CPC分类号： G03F7/0002 ,  B82Y10/00 ,  B82Y40/00 ,  C23F1/08

    摘要： The present invention provides a method for patterning a substrate with a template having a mold that features positioning conformable material between the substrate and the mold and filling a volume defined between the mold and the substrate with the conformable material through capillary action between the conformable material and one of the mold and the substrate. Thereafter, the conformable material is solidified. Specifically, the distance between the mold and the substrate is controlled to a sufficient degree to attenuate, if not avoid, compressive forces between the mold and the substrate. As a result, upon initial contact of the mold with the conformable material, capillary filling of the volume between the mold and the substrate occurs.

    摘要翻译： 本发明提供了一种用模板图案化模板的方法，该模板具有在基板和模具之间具有定位适形材料的模具，并且通过适形材料之间的毛细管作用在适形材料之间填充限定在模具和基板之间的体积， 模具和基材之一。 此后，使适形材料固化。 具体地说，模具和基板之间的距离被控制到足够的程度以减小模具和基板之间的压缩力（如果不是避免的话）。 结果，当模具与适形材料初次接触时，发生模具和基板之间的体积的毛细管填充。