Abstract:
An operation method of programming, erasing, and reading a silicon-oxide-nitride-oxide-silicon (SONOS) non-volatile memory device having a tunnel oxide layer thicker than 20 Å is provided. A program operation of the method is accomplished by applying a program voltage higher than 0 volts and a ground voltage to a gate electrode and a channel region of a selected SONOS cell transistor, respectively. Also, an erasing operation is accomplished by applying a ground voltage and a first erase voltage lower than 0 volts to a bulk region and a gate electrode of a selected SONOS cell transistor, respectively, and by applying a second erasure voltage to either a drain region or a source region of the selected SONOS cell transistor. The second erase voltage is a ground voltage or a positive voltage. In addition, a read operation is accomplished using either a backward read mode or a forward read mode. Thus, it is possible to remarkably improve a bake retention characteristic, which is sensitive to a thickness of the tunnel oxide layer.
Abstract:
A brake pedal supporting structure designed for a brake pedal of a car having a pedal arm coupled with a mounting bracket attached to a dash panel and a cowl panel to rotate via an actuating rod and a hinge point of a brake booster, wherein pedal arm pushing preventing means is fixed at the rear portion of the pedal arm to face a predetermined interval of the total length of the pedal arm including the hinge point to prevent the pedal arm from being pushed to the rear by the brake booster which will be pushed toward the inside of the car room at the time of a head-on colliding car crash, thereby keeping the pedal arm from being pushed toward the rear of the chassis or enabling the lower portion of the pedal arm to rotate to the front of the chassis to rule out an impact given by the pedal arm onto the driver's lower body and reduce the possibility of the injury at the time of the head-on colliding car crash.
Abstract:
According to example embodiments, a vertical memory device includes a low resistance layer on a lower insulation layer, a channel layer on the low resistance layer, a plurality of vertical channels on the channel layer, and a plurality of gate lines. The vertical channels extend in a first direction that is perpendicular with respect to a top surface of the channel layer. The gate lines surround outer sidewalls of the vertical channels, and are stacked in the first direction and are spaced apart from each other.
Abstract:
A vertical memory device includes a substrate, a channel, gate lines and a connecting portion. A plurality of the channels extend in a first direction which is vertical to a top surface of a substrate. A plurality of the gate lines are stacked in the first direction to be spaced apart from each other and extend in a second, lengthwise direction, each gate line intersecting a set of channels and surrounding outer sidewalls of each channel of the set of channels. The gate lines forms a stepped structure which includes a plurality of vertical levels. A connecting portion connects a group of gate lines of the plurality of gate lines located at the same vertical level, the connecting portion diverging from the second direction in which the gate lines of the group of gate lines extend.
Abstract:
A non-volatile memory device includes a memory cell array and a voltage generator. The memory cell array has a plurality of cell strings in which a plurality of memory cells are connected with each other in series between a string select transistor and a ground select transistor. The voltage generator generates a program voltage, a first pass voltage, and a second pass voltage. A first boost channel voltage applied when programming an outermost memory cell from among the memory cells of each of non-selected cell strings of the cell strings is lower than a second boost channel voltage applied when programming one of remaining memory cells except for the outermost memory cell. The non-volatile memory device prevents programming disturb caused by hot carrier injection.
Abstract:
A vertical memory device includes a substrate, a column of vertical channels on the substrate and spaced apart along a direction parallel to the substrate, respective charge storage structures on sidewalls of respective ones of the vertical channels and gate electrodes vertically spaced along the charge storage structures. The vertical memory device further includes an isolation pattern disposed adjacent the column of vertical channels and including vertical extension portions extending parallel to the vertical channels and connection portions extending between adjacent ones of the vertical extension portions.
Abstract:
A memory device may include a plurality of semiconductor patterns on a substrate including a plurality of first impurity regions doped at a first impurity concentration, a plurality of second impurity regions at portions of the substrate contacting the plurality of semiconductor patterns and doped at a second impurity concentration, a plurality of channel patterns on the plurality of semiconductor patterns, a plurality of gate structures, a plurality of third impurity regions at portions of the substrate adjacent to end portions of the plurality of gate structures, and a plurality of fourth impurity regions at portions of the substrate between the second and third impurity regions and between adjacent second impurity regions. The plurality of fourth impurity regions may be doped at a third impurity concentration which may be lower than the first and second impurity concentrations.
Abstract:
A setting circuit includes a selection unit configured to select one of a predefined code and an external code in response to a test signal, and a setting information generation unit configured to generate setting information in response to the code selected by the selection unit.
Abstract:
A non-volatile memory device includes an array of flash memory cells therein and a voltage generator. The voltage generator is configured to generate a program voltage (Vpgm), a pass voltage (Vpass), a blocking voltage (Vblock) and a decoupling voltage (Vdcp) during a flash memory programming operation. The blocking voltage is generated at a level that inhibits inadvertent programming of an unselected memory cell(s). This voltage level of the blocking voltage is set so that Vdcp
Abstract:
A semiconductor device has an isolation layer pattern, a plurality of gate structures, and a first insulation layer pattern. The isolation layer pattern is formed on a substrate and has a recess thereon. The gate structures are spaced apart from each other on the substrate and the isolation layer pattern. The first insulation layer pattern is formed on the substrate and covers the gate structures and an inner wall of the recess. The first insulation layer pattern has a first air gap therein.